WO2012151762A1 - Led光源组件、背光模组及液晶显示装置 - Google Patents

Led光源组件、背光模组及液晶显示装置 Download PDF

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Publication number
WO2012151762A1
WO2012151762A1 PCT/CN2011/074354 CN2011074354W WO2012151762A1 WO 2012151762 A1 WO2012151762 A1 WO 2012151762A1 CN 2011074354 W CN2011074354 W CN 2011074354W WO 2012151762 A1 WO2012151762 A1 WO 2012151762A1
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WO
WIPO (PCT)
Prior art keywords
hole
led chip
printed circuit
circuit board
heat
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Application number
PCT/CN2011/074354
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English (en)
French (fr)
Inventor
肖勇刚
林博瑛
Original Assignee
深圳市华星光电技术有限公司
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Application filed by 深圳市华星光电技术有限公司 filed Critical 深圳市华星光电技术有限公司
Priority to US13/376,841 priority Critical patent/US20120287606A1/en
Publication of WO2012151762A1 publication Critical patent/WO2012151762A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133628—Illuminating devices with cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Definitions

  • the present invention relates to an LED light source assembly, and more particularly to an LED light source assembly for use in a backlight module of a liquid crystal display device.
  • LED Light Emitting Due to its low power consumption and long service life, Diode (LED) is widely used in various technical fields, such as lighting and liquid crystal display technology.
  • LED chips and PCBs are usually included (Printed Circuit) Board, printed circuit board), LED chip is set on the surface of the PCB, and LED is provided thereon to provide a light source.
  • LED When the LED is working, it will generate a lot of heat. If there is no structural design with good heat dissipation effect, it will seriously affect the service life of the LED and the reliability of the whole product. Based on this, it is generally necessary to provide a heat conducting structure on the PCB for heat dissipation.
  • the heat conduction structure in the prior art is mostly one-dimensional heat dissipation, and the heat dissipation path is single, especially the high-power LED, which generates more heat. If the heat is not timely, a large amount of heat is collected, which affects the service life of the LED. And the reliability of the entire product.
  • the main object of the present invention is to provide an LED light source assembly, a backlight module based on the LED light source assembly, and a liquid crystal display device, which are intended to improve heat dissipation efficiency.
  • the present invention provides an LED light source assembly including an LED chip and a printed circuit board, the LED chip being disposed on the printed circuit board, the printed circuit board being located at a position where the LED chip is disposed Providing at least one hole penetrating through the printed circuit board, an aperture of the hole near one end of the LED chip is smaller than an aperture of the hole away from the end of the LED chip, and the inner wall of the hole is coated with heat conduction Floor.
  • an auxiliary heat dissipation layer is disposed on a surface of the printed circuit board opposite to a surface on which the LED chip is disposed, and the auxiliary heat dissipation layer is in contact with the heat conduction layer.
  • an insulating solder resist layer is disposed between the LED chip and the printed circuit board, the hole of the printed circuit board runs through the solder resist layer, the solder resist layer and the LED chip A heat-dissipating coating with a high thermal conductivity is placed between them.
  • the heat dissipation coating is in contact with the thermally conductive layer.
  • the angle between the heat conducting layer and the axis of the hole is set within a range of 20 degrees to 30 degrees.
  • the angle between the heat conducting layer and the axis of the hole is 25 degrees.
  • the hole is filled with a heat conductor, and the heat conductor is in contact with the heat conductive layer and the LED chip.
  • the cross-sectional shape of the hole is an isosceles trapezoid
  • the end of the hole adjacent to the LED chip is a trapezoidal upper bottom
  • the side opposite to the trapezoidal upper bottom is a trapezoidal lower bottom
  • the opposite side of the hole The two side walls are trapezoidal two waists
  • the length of the trapezoidal lower bottom is greater than the length of the trapezoidal upper base.
  • the invention also provides a backlight module comprising an LED light source assembly.
  • the LED light source assembly includes an LED chip and a printed circuit board, the LED chip is disposed on the printed circuit board, and the printed circuit board is provided with at least one through the printed circuit at a position where the LED chip is disposed a hole of the plate having an aperture smaller than an end of the hole near the LED chip, the inner wall of the hole being coated with a heat conducting layer.
  • the invention also provides a liquid crystal display device comprising a liquid crystal display panel and a backlight module.
  • the backlight module includes an LED light source assembly.
  • the LED light source assembly includes an LED chip and a printed circuit board, the LED chip is disposed on the printed circuit board, and the printed circuit board is provided with at least one through the printed circuit at a position where the LED chip is disposed a hole of the plate having an aperture smaller than an end of the hole near the LED chip, the inner wall of the hole being coated with a heat conducting layer.
  • FIG. 1 is a schematic structural view of a first embodiment of an LED light source assembly of the present invention.
  • FIG. 2 is a schematic structural view of a second embodiment of an LED light source assembly of the present invention.
  • the LED light source assembly 1 is a schematic structural view of a first embodiment of an LED light source assembly of the present invention.
  • the LED light source assembly 1 includes an LED chip 10 and a printed circuit board 20.
  • the LED chip 10 is disposed on the printed circuit board 20.
  • the printed circuit board 20 is provided with at least one hole 21 extending through the printed circuit board 20 at a position where the LED chip 10 is disposed.
  • the aperture of the hole 21 near the LED chip 10 is smaller than the hole.
  • the aperture of 21 is away from the aperture at one end of the LED, and the inner wall of the aperture 21 is coated with a thermally conductive layer 22.
  • the heat conducting layer 22 may be disposed on the inner wall of the hole 21 by a method of plated through holes, and the material may be made of copper, silver or thermal grease. In the field of printed circuit board manufacturing technology, the method of plating through holes is well known to those skilled in the art and thus will not be described.
  • the printed circuit board 20 is provided with at least one hole 21 penetrating the printed circuit board 20 at the position where the LED chip 10 is provided, the aperture of the hole 21 near the end of the LED chip 10 is smaller than the distance of the hole 21.
  • the inner diameter of the hole 21 is coated with the heat conductive layer 22, so that the heat dissipation path is dissipated along the cross section of the hole and the longitudinal section of the hole.
  • the cross section and the longitudinal section referred to in the present invention are relative, wherein the cross section is a section perpendicular to the axis of the hole, and the longitudinal section means a section parallel to the axis of the hole.
  • the above-mentioned heat dissipation method along the cross section of the hole and the longitudinal section of the hole is two-dimensional heat dissipation. This way of dissipating heat is different from the traditional one-dimensional way of dissipating heat.
  • the traditional one-dimensional heat dissipation method means that heat is mainly radiated in one direction of the cross section or the longitudinal section, and the heat dissipation effect is poor.
  • an auxiliary heat dissipation layer 23 is disposed on a surface of the printed circuit board 20 opposite to the surface on which the LED chip 10 is disposed.
  • the auxiliary heat dissipation layer 23 is in contact with the heat conduction layer 22, and the material thereof may be gold, silver or copper or Other materials with high thermal conductivity diffuse heat transferred through the heat conducting layer 22, reducing heat accumulation around the LED chip 10, further improving heat dissipation efficiency.
  • the auxiliary heat dissipation layer 23 may be a plastic coating having a high thermal conductivity provided on the printed circuit board 20, or may be a metal block having a high thermal conductivity attached to the printed circuit board 20.
  • an insulating solder resist 24 is disposed between the LED chip 10 and the printed circuit board 20, and the hole 21 penetrates the solder resist layer 24, and a heat transfer coating with high thermal conductivity is disposed between the solder resist layer 24 and the LED chip 10.
  • the material used for the heat dissipation coating may be a metal material such as silver or copper.
  • the heat-dissipating coating is in contact with the heat-conducting layer 22, and the heat generated by the LED chip is transferred to the heat-conducting layer 22.
  • the heat dissipation region of the LED chip can form a horn shape. Therefore, the shape of the heat conducting layer 22 disposed on the wall surface of the hole 21 can be set according to the shape of the horn, that is, the angle between the heat conducting layer 22 and the axis of the hole 21 is corresponding to the size of the horn shape formed by the heat dissipating region, so that the setting can be Improve the heat dissipation effect of the LED chip. As shown in FIG.
  • the angle between the heat conducting layer 22 and the axis of the hole 21 is set to ⁇ , and the size of the flared opening angle formed by the heat radiating region is twice the angle ⁇ .
  • the size of the flared opening angle formed by the heat dissipation area is 40° ⁇ Between 60°, so the angle ⁇ is 20° ⁇ Between 30°.
  • the angle ⁇ is 20° ⁇ Between 30°.
  • the angle ⁇ has a variety of options, the angle ⁇ can be taken 20° or 30°.
  • the cross-sectional shape of the hole 21 of the LED light source assembly 1 of the present invention may be an isosceles trapezoid, the side near the LED chip 10 is a trapezoidal upper bottom, and the side opposite to the trapezoidal upper bottom is a trapezoidal lower bottom, and the opposite side of the hole 21
  • the two side walls are trapezoidal two waists, and the length of the trapezoidal lower bottom is greater than the length of the trapezoidal upper base.
  • the LED chip 10 described above may be provided in plurality on the same printed circuit board as needed.
  • the holes 21 may be disposed in one-to-one correspondence with the LED chips 10, which may be formed by numerically controlled drilling, punching or laser drilling.
  • the aperture of the holes 21 may be gradually enlarged, and the cross-section of the holes 21 may be circular or A polygon, for example it may be a cone hole or a prismatic hole.
  • the LED light source unit 2 of the present embodiment is different from the light source unit 1 of the first embodiment in that the hole 21 of the first embodiment is entirely filled with the heat conductor 25, and the material of the heat conductor 25 may be a metal material such as aluminum, copper or iron. .
  • the heat conductor 25 is in contact with the heat conductive layer, and one side of the heat conductor 25 is in contact with the LED chip.
  • the heat conductor 25 can be constructed of the same material as the heat conductive layer. Further, the heat conductor and the heat conductive layer may also be integrated.
  • the heat transfer body 25 Since the LED light source unit 2 is provided with the heat conductor 25, the heat transfer body 25 has a higher heat transfer efficiency than air. Therefore, the heat generated by the LED chip is transmitted through the heat conductor 25 and rapidly diffused, thereby improving the heat dissipation efficiency of the LED chip.
  • the heat conductor 25 substantially conforming to the shape of the hole can be filled into the hole 21 by filling or the like, so that the heat conductor 25 can directly contact the LED chip 10, thereby effectively increasing the contact area with the LED chip. Allows heat to pass out quickly.
  • the heat conductor 25 and the heat conductive layer may be made of different materials.
  • a heat conductor 25 substantially conforming to the shape and size of the hole may be provided and connected to the hole by crimping or the like.
  • the method in the embodiment may be selected, that is, the heat conductor 25 substantially conforming to the shape and size of the hole is first formed, and then mechanically connected by crimping or the like. The holes 21 are fixedly connected.
  • the LED light source assembly 1 or the LED light source assembly 2 of the present invention can be applied to various occasions, such as a backlight module of a liquid crystal display device, a lighting of a lamp, and the like, which are combined by a printed circuit board and an LED and require heat dissipation.
  • a backlight module of a liquid crystal display device such as a liquid crystal display device, a lighting of a lamp, and the like, which are combined by a printed circuit board and an LED and require heat dissipation.
  • the liquid crystal display device includes a liquid crystal display panel and a backlight module
  • the backlight module includes the LED light source assembly 1 or the LED light source assembly of the present invention. 2.
  • an LED light source component is a key light-emitting component, and its service life directly affects the life of the liquid crystal display device.
  • the liquid crystal display device of the present invention since the LED light source assembly 1 or the LED light source assembly 2 is disposed in the backlight module, the liquid crystal display device of the present invention has better heat dissipation performance and longer service life than the existing liquid crystal display device. .
  • the heat conductor 25 can be designed in various shapes according to the flared opening angle of the heat dissipation path of the LED light source assembly. Such as a truncated cone or a prismatic shape.
  • the heat conductor 25 may be a plastic having a high thermal conductivity or the like.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Planar Illumination Modules (AREA)
  • Liquid Crystal (AREA)
  • Led Device Packages (AREA)

Description

LED光源组件、背光模组及液晶显示装置
技术领域
本发明涉及一种LED光源组件，尤其涉及用于液晶显示装置的背光模组中的LED光源组件。
背景技术
LED（Light Emitting Diode，发光二极管）因其具有低功耗、使用寿命长等优点，广泛应用于各个技术领域，如在照明和液晶显示技术领域均有使用。
在现有的LED光源组件中，通常包括LED芯片和PCB（Printed Circuit Board，印刷电路板），LED芯片设于PCB表面，其上设有LED以提供光源。LED在工作时，将产生大量热量，如果没有一个散热效果良好的结构设计，将严重影响LED的使用寿命和整个产品的信赖度。基于此，一般都要在PCB上设置导热结构，以便散热。但是现有技术中的导热结构，大多是一维散热，其散热途径单一，尤其是大功率的LED，其产生热量更多，若散热不及时，则会聚集大量的热，影响LED的使用寿命和整个产品的可靠度。
发明内容
本发明的主要目的在于提供一种LED光源组件、基于该LED光源组件的背光模组及液晶显示装置，旨在提高散热效率。
为了实现上述目的，本发明提供一种LED光源组件，包括LED芯片及印刷电路板，所述LED芯片设于所述印刷电路板上，所述印刷电路板在设有所述LED芯片的位置处设有至少一贯穿所述印刷电路板的孔，所述孔的靠近所述LED芯片处一端的孔径小于所述孔的远离所述LED芯片处一端的孔径，所述孔的内壁涂布有导热层。
优选地，在所述印刷电路板的与设置所述LED芯片的表面相对的表面设置有辅助散热层，所述辅助散热层与所述导热层接触。
优选地，所述LED芯片与所述印刷电路板之间设有一层绝缘的防焊层，所述印刷电路板的所述孔贯穿所述防焊层，所述防焊层与所述LED芯片之间设置导热率高的散热涂层。
优选地，所述散热涂层与所述导热层接触。
优选地，所述导热层与所述孔的轴心的夹角设定在20度~ 30度范围内。
优选地，所述导热层与所述孔的轴心的夹角为25度。
优选地，所述孔内充填有导热体，所述导热体与所述导热层和所述LED芯片接触。
优选地，所述孔的截面形状为等腰梯形，所述孔的靠近所述LED芯片的一端为梯形上底，与所述梯形上底相对的一边为梯形下底，所述孔的相对的两侧壁为梯形两腰，所述梯形下底的长度大于所述梯形上底的长度。
本发明还提供一种背光模组，包括LED光源组件。所述LED光源组件包括LED芯片及印刷电路板，所述LED芯片设于所述印刷电路板上，所述印刷电路板在设有所述LED芯片的位置处设有至少一贯穿所述印刷电路板的孔，所述孔的靠近所述LED芯片处一端的孔径小于所述孔的远离所述LED芯片处一端的孔径，所述孔的内壁涂布有导热层。
本发明还提供一种液晶显示装置，包括液晶显示面板和背光模组。所述背光模组包括LED光源组件。所述LED光源组件包括LED芯片及印刷电路板，所述LED芯片设于所述印刷电路板上，所述印刷电路板在设有所述LED芯片的位置处设有至少一贯穿所述印刷电路板的孔，所述孔的靠近所述LED芯片处一端的孔径小于所述孔的远离所述LED芯片处一端的孔径，所述孔的内壁涂布有导热层。
附图说明
图1为本发明LED光源组件第一实施方式的结构示意图。
图2为本发明LED光源组件第二实施方式的结构示意图。
具体实施方式
以下将结合附图及实施方式，对实现发明目的的技术方案作详细说明。应当理解，此处所描述的具体实施方式仅仅用以解释本发明，并不用于限定本发明。
参照图1，其为本发明LED光源组件第一实施方式的结构示意图。该LED光源组件1包括LED芯片10及印刷电路板20。LED芯片10设于印刷电路板20上，印刷电路板20在设有LED芯片10的位置处设有至少一个贯穿印刷电路板20的孔21，孔21的靠近LED芯片10处一端的孔径小于孔21的远离LED处一端的孔径，孔21的内壁涂布有导热层22。导热层22可采用镀通孔的工艺设置在孔21的内壁上，材质可以为铜、银或散热膏等材质。在印刷电路板制造技术领域中，镀通孔的工艺方法为本领域技术人员所周知，因而不作赘述。
相较于现有技术，由于印刷电路板20在设有LED芯片10的位置处设有至少一个贯穿印刷电路板20的孔21，孔21的靠近LED芯片10处一端的孔径小于孔21的远离LED处一端的孔径，孔21的内壁涂布有导热层22，因而其散热途径沿孔的横截面与孔的纵截面两个方向散热。应当说明的是，本发明所指的横截面和纵截面均是相对而言，其中横截面是垂直于孔的轴心的截面，而纵截面是指与孔的轴心平行的截面。上述沿孔的横截面与孔的纵截面两个方向的散热方式就是二维散热。这种散热方式有别于传统的一维方式的散热途径。传统的一维散热方式是指热量主要沿横截面或纵截面中一个方向散热，其散热效果较差。
在一个实施例中，在印刷电路板20的与设置LED芯片10的表面相对的表面设置有辅助散热层23，辅助散热层23与导热层22相接触，其材质可以是金、银或铜或其他高导热率的材质，将经导热层22传来的热量扩散，减少热量在LED芯片10周围聚集，进一步提高散热效率。辅助散热层23可以是设置在印刷电路板20的导热率高的塑料涂层，也可是贴附于印刷电路板20上的导热率高的金属块。
此外，在LED芯片10与印刷电路板20之间还设有一层绝缘的防焊层24，孔21贯穿防焊层24，在防焊层24与LED芯片10之间设置导热率高的散热涂层，散热涂层采用的材料可以是银、铜等金属材料。该散热涂层与导热层22接触，将LED芯片产生的热量传递至导热层22，通过上述设置，避免了LED芯片10产生的热量在防焊层24与LED芯片10之间聚集，不能及时散热，对LED芯片10产生损害。
另外，本发明LED光源组件的二维传热路径中，由于LED芯片产生的热量沿孔的横截面与孔的纵截面两个方向散热，因而LED芯片的散热区域可形成喇叭形状。因此孔21的壁面设置的导热层22形状可依据该喇叭形状进行设置，即导热层22与孔21的轴心的夹角与散热区域形成的喇叭形状的张角大小存在对应关系，这样设置可提高LED芯片的散热效果。如图1所示，设定导热层22与孔21的轴心的夹角为θ，散热区域形成的喇叭形状的张角的大小是夹角θ的2倍。通常散热区域形成的喇叭形状的张角的大小在40°~ 60°之间，因而夹角θ的大小在20°~ 30°之间。其中，喇叭状的张角在50°时，散热效果较佳，因此由2θ=50°可知，θ取25°。具体应用时，夹角θ有多种选择方案，夹角θ可取 20°或30°。
进一步地，本发明的LED光源组件1的孔21的截面形状可为等腰梯形，靠近LED芯片10的边为梯形上底，与梯形上底相对的一边为梯形下底，孔21的相对的两侧壁为梯形的两腰，梯形下底的长度大于梯形上底的长度。
上述LED芯片10可根据需要，在同一印刷电路板上设置多个。孔21可以与LED芯片10一一对应设置，其可通过数控钻孔、冲孔或激光钻孔的方式加工成型，孔21的孔径可以是逐渐变大，孔21的横截面可以为圆形或多边形，例如其可以是圆锥体孔或棱台形孔。
参照图2，其为本发明LED光源组件第二实施方式的结构示意图。本实施方式的LED光源组件2与第一实施方式的光源组件1的区别在于：将第一实施方式的孔21整个填充导热体25，导热体25的材质可以是铝、铜或铁等金属材料。导热体25与导热层接触，导热体25的一侧面与LED芯片接触。导热体25可采用与导热层相同的材料构成。进一步地，导热体与导热层还可形成一体。
由于LED光源组件2设置有导热体25，导热体25的传热效率比空气高。因此，LED芯片产生的热量经导热体25传递并迅速扩散，提高了LED芯片的散热效率。
在一实施例中，可通过灌注等方式将与孔形状基本一致的导热体25充填到孔21内部，可使得导热体25与LED芯片10直接接触，有效的增大与LED芯片的接触面积，使得热量迅速传导出去。
上述实施例中，导热体25与导热层也可以分别为不同的材质。例如，也可设置与孔形状和大小基本一致的导热体25，通过压接等方式与孔连接。此外，若印刷电路板的厚度较厚，此时，可选择本实施例中的方式，即先制成与孔形状和大小基本一致的导热体25，然后通过压接等机械连接方式将其与孔21固定连接。
本发明LED光源组件1或LED光源组件2可应用于多种场合，例如液晶显示装置的背光模组中、灯具照明等各类通过印刷电路板和LED组合发光且需要散热的场合。例如，在上述LED光源组件1或LED光源组件2应用于液晶显示装置中时，该液晶显示装置包括液晶显示面板和背光模组，该背光模组包括本发明的LED光源组件1或LED光源组件2。
众所周知，液晶显示装置中，LED光源组件是关键的发光组件，其使用寿命直接影响液晶显示装置的寿命。本发明实施方式中，由于在背光模组中设置上述LED光源组件1或LED光源组件2，相对于现有的液晶显示装置而言，本发明的液晶显示装置散热性能更好，使用寿命更长。
本发明并不局限于以上实施方式，在上述实施方式公开的技术内容下，还可以进行各种变化，例如，导热体25可根据LED光源组件的散热路径的喇叭状张角设计各种形状，如为圆台形或棱台形。又如，导热体25可为导热率高的塑料等。凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (20)

  1. 一种LED光源组件，包括LED芯片及印刷电路板，所述LED芯片设于所述印刷电路板上，其特征在于，所述印刷电路板在设有所述LED芯片的位置处设有至少一贯穿所述印刷电路板的孔，所述孔的靠近所述LED芯片处一端的孔径小于所述孔的远离所述LED芯片处一端的孔径，所述孔的内壁涂布有导热层。
  2. 如权利要求1所述的LED光源组件，其特征在于，在所述印刷电路板的与设置所述LED芯片的表面相对的表面设置有辅助散热层，所述辅助散热层与所述导热层接触。
  3. 如权利要求1所述的LED光源组件，其特征在于，所述LED芯片与所述印刷电路板之间设有一层绝缘的防焊层，所述印刷电路板的所述孔贯穿所述防焊层，所述防焊层与所述LED芯片之间设置导热率高的散热涂层。
  4. 如权利要求3所述的LED光源组件，其特征在于，所述散热涂层与所述导热层接触。
  5. 如权利要求1所述的LED光源组件，其特征在于，所述导热层与所述孔的轴心的夹角设定在20度~ 30度范围内。
  6. 如权利要求5所述的LED光源组件，其特征在于，所述导热层与所述孔的轴心的夹角为25度。
  7. 如权利要求1所述的LED光源组件，其特征在于，所述孔内充填有导热体，所述导热体与所述导热层和所述LED芯片接触。
  8. 如权利要求1所述的LED光源组件，其特征在于，所述孔的截面形状为等腰梯形，所述孔的靠近所述LED芯片的一端为梯形上底，与所述梯形上底相对的一边为梯形下底，所述孔的相对的两侧壁为梯形两腰，所述梯形下底的长度大于所述梯形上底的长度。
  9. 一种背光模组，包括LED光源组件，所述LED光源组件包括LED芯片及印刷电路板，所述LED芯片设于所述印刷电路板上，其特征在于，所述印刷电路板在设有所述LED芯片的位置处设有至少一贯穿所述印刷电路板的孔，所述孔的靠近所述LED芯片处一端的孔径小于所述孔的远离所述LED芯片处一端的孔径，所述孔的内壁涂布有导热层。
  10. 如权利要求9所述的背光模组，其特征在于，在所述印刷电路板的与设置所述LED芯片的表面相对的表面设置有辅助散热层，所述辅助散热层与所述导热层接触。
  11. 如权利要求9所述的背光模组，其特征在于，所述LED芯片与所述印刷电路板之间设有一层绝缘的防焊层，所述印刷电路板的所述孔贯穿所述防焊层，所述防焊层与所述LED芯片之间设置导热率高的散热涂层。
  12. 如权利要求11所述的背光模组，其特征在于，所述散热涂层与所述导热层接触。
  13. 如权利要求9所述的背光模组，其特征在于，所述导热层与所述孔的轴心的夹角设定在20度~ 30度范围内。
  14. 如权利要求13所述的背光模组，其特征在于，所述导热层与所述孔的轴心的夹角为25度。
  15. 如权利要求9所述的背光模组，其特征在于，所述孔内充填有导热体，所述导热体与所述导热层和所述LED芯片接触。
  16. 如权利要求9所述的背光模组，其特征在于，所述孔的截面形状为等腰梯形，所述孔的靠近所述LED芯片的一端为梯形上底，与所述梯形上底相对的一边为梯形下底，所述孔的相对的两侧壁为梯形两腰，所述梯形下底的长度大于所述梯形上底的长度。
  17. 一种液晶显示装置，包括液晶显示面板和背光模组，所述背光模组包括LED光源组件，所述LED光源组件包括LED芯片及印刷电路板，所述LED芯片设于所述印刷电路板上，其特征在于，所述印刷电路板在设有所述LED芯片的位置处设有至少一贯穿所述印刷电路板的孔，所述孔的靠近所述LED芯片处一端的孔径小于所述孔的远离所述LED芯片处一端的孔径，所述孔的内壁涂布有导热层。
  18. 如权利要求17所述的液晶显示装置，其特征在于，所述孔内充填有导热体，所述导热体与所述导热层和所述LED芯片接触。
  19. 如权利要求17所述的液晶显示装置，其特征在于，所述导热层与所述孔的轴心的夹角设定在20度~ 30度范围内。
  20. 如权利要求17所述的液晶显示装置，其特征在于，所述LED芯片与所述印刷电路板之间设有一层绝缘的防焊层，所述印刷电路板的所述孔贯穿所述防焊层，所述防焊层与所述LED芯片之间设置导热率高的散热涂层；所述散热涂层与所述导热层接触。
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