FR3036917B1 - Dispositif electronique comprenant une carte de circuit imprime avec un refroidissement ameliore. - Google Patents

Dispositif electronique comprenant une carte de circuit imprime avec un refroidissement ameliore. Download PDF

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Publication number
FR3036917B1
FR3036917B1 FR1554836A FR1554836A FR3036917B1 FR 3036917 B1 FR3036917 B1 FR 3036917B1 FR 1554836 A FR1554836 A FR 1554836A FR 1554836 A FR1554836 A FR 1554836A FR 3036917 B1 FR3036917 B1 FR 3036917B1
Authority
FR
France
Prior art keywords
circuit board
printed circuit
electronic device
improved cooling
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1554836A
Other languages
English (en)
Other versions
FR3036917A1 (fr
Inventor
Wissam DIB
Abdenour ABDELLI
Fabien VIDAL-NAQUET
Marco FRANCESSETTI
Denny CHIONO
Davide BETTONI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IFP Energies Nouvelles IFPEN
Mavel SRL
Original Assignee
IFP Energies Nouvelles IFPEN
Mavel SRL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IFP Energies Nouvelles IFPEN, Mavel SRL filed Critical IFP Energies Nouvelles IFPEN
Priority to FR1554836A priority Critical patent/FR3036917B1/fr
Priority to EP16725060.4A priority patent/EP3305039A1/fr
Priority to CN201690000081.8U priority patent/CN206506764U/zh
Priority to PCT/EP2016/060693 priority patent/WO2016188762A1/fr
Priority to JP2017561883A priority patent/JP2018516462A/ja
Priority to US15/577,694 priority patent/US20180168025A1/en
Publication of FR3036917A1 publication Critical patent/FR3036917A1/fr
Application granted granted Critical
Publication of FR3036917B1 publication Critical patent/FR3036917B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09572—Solder filled plated through-hole in the final product
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

La présente invention concerne un dispositif électronique (10) comprenant une carte de circuit imprimé (12) portant au moins un composant comprenant au moins un composant de puissance (14) et/ou au moins un conducteur de puissance (18), ladite carte de circuit imprimé comportant une succession en alternance de couches isolantes (22) et conductrices (24), des puits (30, 30') portant un revêtement intérieur conducteur électriquement et thermiquement (32) et traversant l'épaisseur de la carte, et un dispositif de refroidissement (34) de la carte. Selon l'invention, l'intérieur du puits est rempli en outre d'une matière thermiquement conductrice (44) pour réaliser un pont thermique entre le composant et le dispositif de refroidissement (34).
FR1554836A 2015-05-28 2015-05-28 Dispositif electronique comprenant une carte de circuit imprime avec un refroidissement ameliore. Active FR3036917B1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
FR1554836A FR3036917B1 (fr) 2015-05-28 2015-05-28 Dispositif electronique comprenant une carte de circuit imprime avec un refroidissement ameliore.
EP16725060.4A EP3305039A1 (fr) 2015-05-28 2016-05-12 Dispositif électronique comprenant une carte de circuit imprimé avec un refroidissement amélioré
CN201690000081.8U CN206506764U (zh) 2015-05-28 2016-05-12 包括具有增强冷却的印刷电路板的电子装置
PCT/EP2016/060693 WO2016188762A1 (fr) 2015-05-28 2016-05-12 Dispositif électronique comprenant une carte de circuit imprimé avec un refroidissement amélioré
JP2017561883A JP2018516462A (ja) 2015-05-28 2016-05-12 冷却が改善されたプリント回路基板を含む電子デバイス
US15/577,694 US20180168025A1 (en) 2015-05-28 2016-05-30 Electronic device comprising a printed circuit board with improved cooling

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1554836A FR3036917B1 (fr) 2015-05-28 2015-05-28 Dispositif electronique comprenant une carte de circuit imprime avec un refroidissement ameliore.
FR1554836 2015-05-28

Publications (2)

Publication Number Publication Date
FR3036917A1 FR3036917A1 (fr) 2016-12-02
FR3036917B1 true FR3036917B1 (fr) 2018-11-02

Family

ID=54066019

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1554836A Active FR3036917B1 (fr) 2015-05-28 2015-05-28 Dispositif electronique comprenant une carte de circuit imprime avec un refroidissement ameliore.

Country Status (6)

Country Link
US (1) US20180168025A1 (fr)
EP (1) EP3305039A1 (fr)
JP (1) JP2018516462A (fr)
CN (1) CN206506764U (fr)
FR (1) FR3036917B1 (fr)
WO (1) WO2016188762A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3065112A1 (fr) * 2017-04-11 2018-10-12 Valeo Systemes De Controle Moteur Unite electronique et dispositif electrique comprenant ladite unite electronique

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* Cited by examiner, † Cited by third party
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US5285352A (en) * 1992-07-15 1994-02-08 Motorola, Inc. Pad array semiconductor device with thermal conductor and process for making the same
DE4326506A1 (de) * 1993-08-06 1995-02-09 Bosch Gmbh Robert Elektrisches Gerät, insbesondere Schalt- oder Steuergerät für Kraftfahrzeuge
KR0163871B1 (ko) * 1995-11-25 1998-12-01 김광호 하부에 히트 싱크가 부착된 솔더 볼 어레이 패키지
US5887435A (en) * 1995-12-08 1999-03-30 Litton Systems, Inc. Environmentally protected module
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KR100244965B1 (ko) * 1997-08-12 2000-02-15 윤종용 인쇄회로기판과 볼 그리드 어레이 패키지의 제조 방법
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WO2001065344A2 (fr) * 2000-02-18 2001-09-07 Incep Technologies, Inc. Procede et appareil d'alimentation en courant d'un microprocesseur a gestion de chaleur integree et d'interference electromagnetique
US6477052B1 (en) * 2000-08-01 2002-11-05 Daimlerchrysler Corporation Multiple layer thin flexible circuit board
US6611055B1 (en) * 2000-11-15 2003-08-26 Skyworks Solutions, Inc. Leadless flip chip carrier design and structure
US7161239B2 (en) * 2000-12-22 2007-01-09 Broadcom Corporation Ball grid array package enhanced with a thermal and electrical connector
DE10101359A1 (de) * 2001-01-13 2002-07-25 Conti Temic Microelectronic Verfahren zur Herstellung einer elektronischen Baugruppe
US20030029637A1 (en) * 2001-08-13 2003-02-13 Tina Barcley Circuit board assembly with ceramic capped components and heat transfer vias
US20030161603A1 (en) * 2002-02-27 2003-08-28 Nadeau Mary J. Receiver optical bench formed using passive alignment
US6653557B2 (en) * 2002-02-27 2003-11-25 Jds Uniphase Corporation Faraday cage and ceramic walls for shielding EMI
US20050284607A1 (en) * 2002-06-27 2005-12-29 Eastman Kodak Company Cooling-assisted, heat-generating electrical component and method of manufacturing same
US7161240B2 (en) * 2002-06-27 2007-01-09 Eastman Kodak Company Insitu-cooled electrical assemblage
US6671176B1 (en) * 2002-06-27 2003-12-30 Eastman Kodak Company Method of cooling heat-generating electrical components
JP2005210044A (ja) * 2003-12-26 2005-08-04 Tdk Corp インダクタ素子内蔵基板およびパワーアンプモジュール
US7321098B2 (en) * 2004-04-21 2008-01-22 Delphi Technologies, Inc. Laminate ceramic circuit board and process therefor
US8415788B2 (en) * 2004-07-08 2013-04-09 Rambus Inc. System and method for dissipating heat from semiconductor devices
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Also Published As

Publication number Publication date
EP3305039A1 (fr) 2018-04-11
CN206506764U (zh) 2017-09-19
JP2018516462A (ja) 2018-06-21
FR3036917A1 (fr) 2016-12-02
US20180168025A1 (en) 2018-06-14
WO2016188762A1 (fr) 2016-12-01

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