FR2925255B1 - Procede de fabrication d'un drain thermique pour des composants de puissance a montage en surface - Google Patents

Procede de fabrication d'un drain thermique pour des composants de puissance a montage en surface

Info

Publication number
FR2925255B1
FR2925255B1 FR0708838A FR0708838A FR2925255B1 FR 2925255 B1 FR2925255 B1 FR 2925255B1 FR 0708838 A FR0708838 A FR 0708838A FR 0708838 A FR0708838 A FR 0708838A FR 2925255 B1 FR2925255 B1 FR 2925255B1
Authority
FR
France
Prior art keywords
power components
surface mounting
mounting power
manufacturing thermal
thermal drain
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR0708838A
Other languages
English (en)
Other versions
FR2925255A1 (fr
Inventor
Pierre Bertram
Dominique Portier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thales SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thales SA filed Critical Thales SA
Priority to FR0708838A priority Critical patent/FR2925255B1/fr
Publication of FR2925255A1 publication Critical patent/FR2925255A1/fr
Application granted granted Critical
Publication of FR2925255B1 publication Critical patent/FR2925255B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09572—Solder filled plated through-hole in the final product
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0455—PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

Procédé pour fabriquer un drain thermique permettant la dissipation de chaleur pour des composants de puissance à montage en surface sur une carte électronique (20) caractérisé en ce qu'il comporte au moins les étapes suivantes :. la carte (20) présente des trous métallisés (20i) ayant un diamètre Di calibré en fonction de la pâte à braser utilisée et de l'épaisseur ep du substrat afin d'optimiser leur remplissage,. l'ensemble constitué de la carte (20) et des trous métallisés (20i) remplis par la pâte à braser est ensuite soumis à une température suffisante pour braser ledit ensemble,. la fabrication du drain thermique correspondant aux composants de puissance est effectuée lors des étapes d'étalement de la pâte puis de brasage.
FR0708838A 2007-12-18 2007-12-18 Procede de fabrication d'un drain thermique pour des composants de puissance a montage en surface Active FR2925255B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0708838A FR2925255B1 (fr) 2007-12-18 2007-12-18 Procede de fabrication d'un drain thermique pour des composants de puissance a montage en surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0708838A FR2925255B1 (fr) 2007-12-18 2007-12-18 Procede de fabrication d'un drain thermique pour des composants de puissance a montage en surface

Publications (2)

Publication Number Publication Date
FR2925255A1 FR2925255A1 (fr) 2009-06-19
FR2925255B1 true FR2925255B1 (fr) 2010-01-08

Family

ID=39642871

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0708838A Active FR2925255B1 (fr) 2007-12-18 2007-12-18 Procede de fabrication d'un drain thermique pour des composants de puissance a montage en surface

Country Status (1)

Country Link
FR (1) FR2925255B1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3036917B1 (fr) * 2015-05-28 2018-11-02 IFP Energies Nouvelles Dispositif electronique comprenant une carte de circuit imprime avec un refroidissement ameliore.
CN114390803A (zh) * 2022-01-20 2022-04-22 苏州光余年生物科技有限公司 通过过孔塞金属膏法提高电路板热电分离效率的生产工艺

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55138294A (en) * 1979-04-11 1980-10-28 Matsushita Electric Ind Co Ltd Method of forming through hole connector
DE19909505C2 (de) * 1999-03-04 2001-11-15 Daimler Chrysler Ag Verfahren zur Herstellung von Schaltungsanordnungen
DE102005047026A1 (de) * 2005-09-30 2007-04-05 Siemens Ag Leiterplatte und Verfahren zu deren Herstellung

Also Published As

Publication number Publication date
FR2925255A1 (fr) 2009-06-19

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