FR2856195B1 - Dissipateur de chaleur pour la dissipation thermique sur des composantes electroniques - Google Patents

Dissipateur de chaleur pour la dissipation thermique sur des composantes electroniques

Info

Publication number
FR2856195B1
FR2856195B1 FR0406407A FR0406407A FR2856195B1 FR 2856195 B1 FR2856195 B1 FR 2856195B1 FR 0406407 A FR0406407 A FR 0406407A FR 0406407 A FR0406407 A FR 0406407A FR 2856195 B1 FR2856195 B1 FR 2856195B1
Authority
FR
France
Prior art keywords
electronic components
thermal dissipation
heat dissipator
dissipator
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0406407A
Other languages
English (en)
Other versions
FR2856195A1 (fr
Inventor
Elmar Schaper
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Phoenix Contact GmbH and Co KG
Original Assignee
Phoenix Contact GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoenix Contact GmbH and Co KG filed Critical Phoenix Contact GmbH and Co KG
Publication of FR2856195A1 publication Critical patent/FR2856195A1/fr
Application granted granted Critical
Publication of FR2856195B1 publication Critical patent/FR2856195B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR0406407A 2003-06-12 2004-06-14 Dissipateur de chaleur pour la dissipation thermique sur des composantes electroniques Expired - Fee Related FR2856195B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10326458A DE10326458B4 (de) 2003-06-12 2003-06-12 Kühlanordnung für elektronische Bauelemente

Publications (2)

Publication Number Publication Date
FR2856195A1 FR2856195A1 (fr) 2004-12-17
FR2856195B1 true FR2856195B1 (fr) 2010-02-19

Family

ID=33482824

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0406407A Expired - Fee Related FR2856195B1 (fr) 2003-06-12 2004-06-14 Dissipateur de chaleur pour la dissipation thermique sur des composantes electroniques

Country Status (5)

Country Link
US (2) US7185696B2 (fr)
JP (1) JP4587279B2 (fr)
DE (1) DE10326458B4 (fr)
FR (1) FR2856195B1 (fr)
IT (1) ITRE20040068A1 (fr)

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US7177156B2 (en) * 2004-07-08 2007-02-13 Cray Inc. Assemblies for holding heat sinks and other structures in contact with electronic devices and other apparatuses
US7193851B2 (en) * 2004-12-09 2007-03-20 Cray Inc. Assemblies for holding heat sinks and other structures in contact with electronic devices and other apparatuses
DE102005022226B4 (de) * 2005-05-10 2008-05-15 RUNGE, André Kühlanordnung für in einem Gehäuse angeordnete elektronische Bauelemente
US7336491B2 (en) 2005-09-06 2008-02-26 Lear Corporation Heat sink
US7411785B2 (en) * 2006-06-05 2008-08-12 Cray Inc. Heat-spreading devices for cooling computer systems and associated methods of use
TWI303973B (en) * 2006-09-06 2008-12-01 Delta Electronics Inc Heat sink fastening device and manufacturing method thereof
US20090154091A1 (en) 2007-12-17 2009-06-18 Yatskov Alexander I Cooling systems and heat exchangers for cooling computer components
US8170724B2 (en) 2008-02-11 2012-05-01 Cray Inc. Systems and associated methods for controllably cooling computer components
US7898799B2 (en) 2008-04-01 2011-03-01 Cray Inc. Airflow management apparatus for computer cabinets and associated methods
US8081459B2 (en) 2008-10-17 2011-12-20 Cray Inc. Air conditioning systems for computer systems and associated methods
US7903403B2 (en) 2008-10-17 2011-03-08 Cray Inc. Airflow intake systems and associated methods for use with computer cabinets
DE102009044368B4 (de) * 2009-10-30 2014-07-03 Lear Corporation Gmbh Kühlanordnung
US8472181B2 (en) 2010-04-20 2013-06-25 Cray Inc. Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use
WO2011131686A1 (fr) * 2010-04-23 2011-10-27 Napatech A/S Ensemble commandé de manière thermique
US9591788B2 (en) * 2011-04-13 2017-03-07 Siemens Aktiengesellschaft Coupling system between a waste-heat generator and a waste-heat receiver
DE202012101076U1 (de) * 2011-04-14 2012-04-19 Visteon Global Technologies, Inc. Vorrichtung zum Kühlen von Batterien, insbesondere für Kraftfahrzeuge
CN102299127B (zh) * 2011-07-13 2013-12-11 台达电子企业管理（上海）有限公司 用于封装元件的双向散热器及其组装方法
EP2648495B1 (fr) * 2012-04-04 2015-02-25 Inmotion Technologies AB Convertisseur de puissance à commutation
DE102012222959B4 (de) 2012-12-12 2015-04-02 Semikron Elektronik Gmbh & Co. Kg Leistungsbauelementeinrichtung
CN108630636B (zh) * 2017-03-24 2022-01-14 德昌电机(深圳)有限公司 Mos器件安装结构、控制器及电动助力转向系统
JP7155571B2 (ja) * 2018-03-27 2022-10-19 ブラザー工業株式会社 電子部品実装装置
CN113161306B (zh) * 2021-04-15 2024-02-13 浙江集迈科微电子有限公司 芯片的高效散热结构及其制备工艺

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US3803469A (en) * 1972-05-18 1974-04-09 Bosch Fernsehanlagen System for controlling speed of the tape drive in a tape recording and replaying apparatus
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US4288839A (en) * 1979-10-18 1981-09-08 Gould Inc. Solid state device mounting and heat dissipating assembly
US4563725A (en) * 1983-01-06 1986-01-07 Welwyn Electronics Limited Electrical assembly
US4509839A (en) * 1983-06-16 1985-04-09 Imc Magnetics Corp. Heat dissipator for semiconductor devices
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SE451106B (sv) * 1985-09-13 1987-08-31 Ellemtel Utvecklings Ab Anordning for att astadkomma tetning mellan tva metallplatar som anvends som skerm mot elektromagnetiska felt
US4703181A (en) * 1986-04-07 1987-10-27 Gatan Inc. Anti-drift device for side entry electron microscope specimen holders
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US5241453A (en) * 1991-11-18 1993-08-31 The Whitaker Corporation EMI shielding device
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US5402313A (en) * 1993-05-21 1995-03-28 Cummins Engine Company, Inc. Electronic component heat sink attachment using a canted coil spring
US5411348A (en) * 1993-10-26 1995-05-02 Bal Seal Engineering Company, Inc. Spring mechanism to connect, lock and unlock, members
US5640304A (en) * 1995-07-07 1997-06-17 Agile Systems Inc. Power electronic device mounting apparatus
DE19538642A1 (de) * 1995-10-17 1997-04-24 Kd Ingenieurtechnik Gmbh Kühl- und Montageanordnung für eine Reihe von Halbleiter-Bauelementen
JP3518131B2 (ja) * 1996-02-21 2004-04-12 株式会社明電舎 回路素子の固定構造
DE29612437U1 (de) * 1996-07-17 1996-09-12 Hella Kg Hueck & Co Wärmeableiteinrichtung für ein elektronisches Bauteil
JPH10107467A (ja) * 1996-10-01 1998-04-24 Ritoo Denshi:Kk 半導体と放熱部材の組付構造およびこの組付構造体の基板への取付構造
IT1292590B1 (it) * 1997-05-30 1999-02-08 El Bo Mec S R L Dissipatore di calore, in particolare per componenti elettronici.
DE19722602C2 (de) * 1997-05-30 2001-03-29 Lenze Gmbh & Co Kg Aerzen Wärmeableitendes Gehäuse zur Aufnahme von elektrischen oder elektronischen Bauteilen
DE19729851C2 (de) * 1997-07-11 2003-03-06 Heinz Ernst Befestigung eines elektronischen Bauteils mittels Druckfeder auf einem Aluminium-Strangpressprofil durch eine lösbare Schnappverbindung
US5926369A (en) * 1998-01-22 1999-07-20 International Business Machines Corporation Vertically integrated multi-chip circuit package with heat-sink support
EP1128432B1 (fr) * 2000-02-24 2016-04-06 Infineon Technologies AG Fixation de modules à semi-conducteurs sur un dissipateur de chaleur
JP4218184B2 (ja) * 2000-05-19 2009-02-04 株式会社デンソー 半導体装置の実装構造
DE10064194B4 (de) * 2000-12-22 2006-12-07 Infineon Technologies Ag Leistungshalbleiter-Modul und Kühlkörper zur Aufnahme des Leistungshalbleiter-Moduls
US6771504B2 (en) * 2002-12-23 2004-08-03 Eastman Kodak Company Thermal transport element for use with a heat dissipating electrical assemblage

Also Published As

Publication number Publication date
JP2005005712A (ja) 2005-01-06
JP4587279B2 (ja) 2010-11-24
US20040250990A1 (en) 2004-12-16
ITRE20040068A1 (it) 2004-09-04
US7984754B2 (en) 2011-07-26
US7185696B2 (en) 2007-03-06
US20070125517A1 (en) 2007-06-07
DE10326458A1 (de) 2005-01-20
FR2856195A1 (fr) 2004-12-17
DE10326458B4 (de) 2006-05-04

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Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 13

ST Notification of lapse

Effective date: 20180228