TW537438U - CPU heat dissipating device - Google Patents

CPU heat dissipating device

Info

Publication number
TW537438U
TW537438U TW91209840U TW91209840U TW537438U TW 537438 U TW537438 U TW 537438U TW 91209840 U TW91209840 U TW 91209840U TW 91209840 U TW91209840 U TW 91209840U TW 537438 U TW537438 U TW 537438U
Authority
TW
Taiwan
Prior art keywords
heat dissipating
dissipating device
cpu heat
cpu
heat
Prior art date
Application number
TW91209840U
Other languages
Chinese (zh)
Inventor
Shr-Chung Chen
Original Assignee
Shuttle Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shuttle Inc filed Critical Shuttle Inc
Priority to TW91209840U priority Critical patent/TW537438U/en
Priority to DE20304779U priority patent/DE20304779U1/en
Priority to GB0307359A priority patent/GB2390227B/en
Priority to JP2003001827U priority patent/JP3096939U/en
Priority to FR0304856A priority patent/FR2841664B3/en
Publication of TW537438U publication Critical patent/TW537438U/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW91209840U 2002-06-28 2002-06-28 CPU heat dissipating device TW537438U (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
TW91209840U TW537438U (en) 2002-06-28 2002-06-28 CPU heat dissipating device
DE20304779U DE20304779U1 (en) 2002-06-28 2003-03-25 CPU radiator
GB0307359A GB2390227B (en) 2002-06-28 2003-03-28 CPU radiator
JP2003001827U JP3096939U (en) 2002-06-28 2003-04-04 CPU radiator
FR0304856A FR2841664B3 (en) 2002-06-28 2003-04-18 CENTRAL TREATMENT UNIT RADIATOR

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW91209840U TW537438U (en) 2002-06-28 2002-06-28 CPU heat dissipating device

Publications (1)

Publication Number Publication Date
TW537438U true TW537438U (en) 2003-06-11

Family

ID=21688573

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91209840U TW537438U (en) 2002-06-28 2002-06-28 CPU heat dissipating device

Country Status (5)

Country Link
JP (1) JP3096939U (en)
DE (1) DE20304779U1 (en)
FR (1) FR2841664B3 (en)
GB (1) GB2390227B (en)
TW (1) TW537438U (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2601565Y2 (en) * 1993-02-26 1999-11-22 株式会社村上開明堂 Electric retractable door mirror
TWI282725B (en) * 2005-10-21 2007-06-11 Foxconn Tech Co Ltd Heat sink clip and assembly
CN115394732B (en) * 2022-05-30 2023-09-05 安世半导体科技(上海)有限公司 Power semiconductor module and method for assembling the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5208731A (en) * 1992-01-17 1993-05-04 International Electronic Research Corporation Heat dissipating assembly
US5371652A (en) * 1993-11-15 1994-12-06 Thermalloy, Inc. Spring clamp assembly with electrically insulating shoe
US5594624A (en) * 1994-04-05 1997-01-14 Thermalloy, Inc. Strap spring for heat sink clip assembly
TW534367U (en) * 2000-04-05 2003-05-21 Foxconn Prec Components Co Ltd Heat dissipation device assembly
TW477515U (en) * 2000-05-19 2002-02-21 Yau-Huei Lai Improved heat sink holding device
TW560832U (en) * 2001-04-27 2003-11-01 Foxconn Prec Components Co Ltd Heat sink fastener

Also Published As

Publication number Publication date
JP3096939U (en) 2004-01-08
GB2390227A (en) 2003-12-31
GB2390227B (en) 2005-12-07
DE20304779U1 (en) 2003-08-07
GB0307359D0 (en) 2003-05-07
FR2841664B3 (en) 2004-05-14
FR2841664A3 (en) 2004-01-02

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees