GB0307359D0 - CPU radiator - Google Patents

CPU radiator

Info

Publication number
GB0307359D0
GB0307359D0 GB0307359A GB0307359A GB0307359D0 GB 0307359 D0 GB0307359 D0 GB 0307359D0 GB 0307359 A GB0307359 A GB 0307359A GB 0307359 A GB0307359 A GB 0307359A GB 0307359 D0 GB0307359 D0 GB 0307359D0
Authority
GB
United Kingdom
Prior art keywords
cpu radiator
radiator
cpu
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB0307359A
Other versions
GB2390227A (en
GB2390227B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shuttle Inc
Original Assignee
Shuttle Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shuttle Inc filed Critical Shuttle Inc
Publication of GB0307359D0 publication Critical patent/GB0307359D0/en
Publication of GB2390227A publication Critical patent/GB2390227A/en
Application granted granted Critical
Publication of GB2390227B publication Critical patent/GB2390227B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB0307359A 2002-06-28 2003-03-28 CPU radiator Expired - Fee Related GB2390227B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW91209840U TW537438U (en) 2002-06-28 2002-06-28 CPU heat dissipating device

Publications (3)

Publication Number Publication Date
GB0307359D0 true GB0307359D0 (en) 2003-05-07
GB2390227A GB2390227A (en) 2003-12-31
GB2390227B GB2390227B (en) 2005-12-07

Family

ID=21688573

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0307359A Expired - Fee Related GB2390227B (en) 2002-06-28 2003-03-28 CPU radiator

Country Status (5)

Country Link
JP (1) JP3096939U (en)
DE (1) DE20304779U1 (en)
FR (1) FR2841664B3 (en)
GB (1) GB2390227B (en)
TW (1) TW537438U (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2601565Y2 (en) * 1993-02-26 1999-11-22 株式会社村上開明堂 Electric retractable door mirror
TWI282725B (en) * 2005-10-21 2007-06-11 Foxconn Tech Co Ltd Heat sink clip and assembly
CN115394732B (en) * 2022-05-30 2023-09-05 安世半导体科技(上海)有限公司 Power semiconductor module and method for assembling the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5208731A (en) * 1992-01-17 1993-05-04 International Electronic Research Corporation Heat dissipating assembly
US5371652A (en) * 1993-11-15 1994-12-06 Thermalloy, Inc. Spring clamp assembly with electrically insulating shoe
US5594624A (en) * 1994-04-05 1997-01-14 Thermalloy, Inc. Strap spring for heat sink clip assembly
TW534367U (en) * 2000-04-05 2003-05-21 Foxconn Prec Components Co Ltd Heat dissipation device assembly
TW477515U (en) * 2000-05-19 2002-02-21 Yau-Huei Lai Improved heat sink holding device
TW560832U (en) * 2001-04-27 2003-11-01 Foxconn Prec Components Co Ltd Heat sink fastener

Also Published As

Publication number Publication date
DE20304779U1 (en) 2003-08-07
FR2841664B3 (en) 2004-05-14
GB2390227A (en) 2003-12-31
TW537438U (en) 2003-06-11
FR2841664A3 (en) 2004-01-02
JP3096939U (en) 2004-01-08
GB2390227B (en) 2005-12-07

Similar Documents

Publication Publication Date Title
TW547362U (en) Radiator fastener device
TW540985U (en) Improved heat sink
GB2407375B (en) Heat sinks
AU2003203295A1 (en) Cpu heat sink
TW587902U (en) Heat sink
GB0121460D0 (en) CPU radiator assembly
GB0307358D0 (en) CPU cooling base
TW537517U (en) CPU socket
AU2002359055A1 (en) Cpu cooler
GB2390227B (en) CPU radiator
GB0216464D0 (en) Radiator covers
GB0208701D0 (en) Heat radiator
GB0322365D0 (en) Heatsink
TW555073U (en) CPU water cooling-apparatus
GB2406441B (en) Heatsink
TW540986U (en) Heat sink
GB0228916D0 (en) Radiator
TW532741U (en) Heat sink
TW576527U (en) CPU radiating structure
TW587779U (en) Improved CPU heat-dissipation structure
HU0300524D0 (en) Flat radiator
TW581295U (en) Heat sink for CPU
GB0311196D0 (en) Radiator
TW560713U (en) CPU socket
TW555204U (en) CPU socket

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20100328