GB0322365D0 - Heatsink - Google Patents

Heatsink

Info

Publication number
GB0322365D0
GB0322365D0 GBGB0322365.8A GB0322365A GB0322365D0 GB 0322365 D0 GB0322365 D0 GB 0322365D0 GB 0322365 A GB0322365 A GB 0322365A GB 0322365 D0 GB0322365 D0 GB 0322365D0
Authority
GB
United Kingdom
Prior art keywords
heatsink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB0322365.8A
Other versions
GB2406442A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giga Byte Technology Co Ltd
Original Assignee
Giga Byte Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giga Byte Technology Co Ltd filed Critical Giga Byte Technology Co Ltd
Priority to GB0322365A priority Critical patent/GB2406442A/en
Priority to DE20315169U priority patent/DE20315169U1/en
Publication of GB0322365D0 publication Critical patent/GB0322365D0/en
Publication of GB2406442A publication Critical patent/GB2406442A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
GB0322365A 2003-09-24 2003-09-24 Heat sink Withdrawn GB2406442A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB0322365A GB2406442A (en) 2003-09-24 2003-09-24 Heat sink
DE20315169U DE20315169U1 (en) 2003-09-24 2003-10-01 Heat dissipating plates Module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0322365A GB2406442A (en) 2003-09-24 2003-09-24 Heat sink
DE20315169U DE20315169U1 (en) 2003-09-24 2003-10-01 Heat dissipating plates Module

Publications (2)

Publication Number Publication Date
GB0322365D0 true GB0322365D0 (en) 2003-10-22
GB2406442A GB2406442A (en) 2005-03-30

Family

ID=34575541

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0322365A Withdrawn GB2406442A (en) 2003-09-24 2003-09-24 Heat sink

Country Status (2)

Country Link
DE (1) DE20315169U1 (en)
GB (1) GB2406442A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7079396B2 (en) 2004-06-14 2006-07-18 Sun Microsystems, Inc. Memory module cooling
JP4861840B2 (en) * 2007-01-26 2012-01-25 アイシン・エィ・ダブリュ株式会社 Heating element cooling structure and driving device
JP2009147107A (en) * 2007-12-14 2009-07-02 Toyota Motor Corp Cooling fin and manufacturing method of the cooling fin

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08222665A (en) * 1995-02-16 1996-08-30 Fujitsu Ltd Heat sink
JPH10200278A (en) * 1997-01-13 1998-07-31 Yaskawa Electric Corp Cooler
JPH10263779A (en) * 1997-03-24 1998-10-06 Fujikura Ltd Manufacture of heat sink
JP3352362B2 (en) * 1997-07-14 2002-12-03 三菱電機株式会社 Heat sink
JP2001345585A (en) * 2000-06-01 2001-12-14 Hitachi Kokusai Electric Inc Heat-radiating fin

Also Published As

Publication number Publication date
GB2406442A (en) 2005-03-30
DE20315169U1 (en) 2003-11-27

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)