GB2406441B - Heatsink - Google Patents

Heatsink

Info

Publication number
GB2406441B
GB2406441B GB0322364A GB0322364A GB2406441B GB 2406441 B GB2406441 B GB 2406441B GB 0322364 A GB0322364 A GB 0322364A GB 0322364 A GB0322364 A GB 0322364A GB 2406441 B GB2406441 B GB 2406441B
Authority
GB
United Kingdom
Prior art keywords
heatsink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0322364A
Other versions
GB2406441A (en
GB0322364D0 (en
Inventor
Richard Ma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giga Byte Technology Co Ltd
Original Assignee
Giga Byte Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giga Byte Technology Co Ltd filed Critical Giga Byte Technology Co Ltd
Priority to GB0322364A priority Critical patent/GB2406441B/en
Priority to DE20315170U priority patent/DE20315170U1/en
Publication of GB0322364D0 publication Critical patent/GB0322364D0/en
Publication of GB2406441A publication Critical patent/GB2406441A/en
Application granted granted Critical
Publication of GB2406441B publication Critical patent/GB2406441B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
GB0322364A 2003-09-24 2003-09-24 Heatsink Expired - Fee Related GB2406441B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB0322364A GB2406441B (en) 2003-09-24 2003-09-24 Heatsink
DE20315170U DE20315170U1 (en) 2003-09-24 2003-10-01 Heat dissipating fins module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0322364A GB2406441B (en) 2003-09-24 2003-09-24 Heatsink
DE20315170U DE20315170U1 (en) 2003-09-24 2003-10-01 Heat dissipating fins module

Publications (3)

Publication Number Publication Date
GB0322364D0 GB0322364D0 (en) 2003-10-22
GB2406441A GB2406441A (en) 2005-03-30
GB2406441B true GB2406441B (en) 2006-04-26

Family

ID=34575542

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0322364A Expired - Fee Related GB2406441B (en) 2003-09-24 2003-09-24 Heatsink

Country Status (2)

Country Link
DE (1) DE20315170U1 (en)
GB (1) GB2406441B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012060002A (en) * 2010-09-10 2012-03-22 Mitsubishi Electric Corp Structure for cooling semiconductor element
CN103413792A (en) * 2013-07-19 2013-11-27 昆山维金五金制品有限公司 Cooling fin convenient to install

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08125369A (en) * 1994-10-27 1996-05-17 Nec Eng Ltd Heat radiation structure
US20020174980A1 (en) * 2001-05-18 2002-11-28 Incep Technologies, Inc. Vortex heatsink for high performance thermal applications

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08125369A (en) * 1994-10-27 1996-05-17 Nec Eng Ltd Heat radiation structure
US20020174980A1 (en) * 2001-05-18 2002-11-28 Incep Technologies, Inc. Vortex heatsink for high performance thermal applications

Also Published As

Publication number Publication date
GB2406441A (en) 2005-03-30
DE20315170U1 (en) 2004-02-12
GB0322364D0 (en) 2003-10-22

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20130924