JPH08125369A - Heat radiation structure - Google Patents

Abstract

PURPOSE: To improve the cooing efficiency of a high heat generating part of a device by providing a heat radiating fin having a curved shape is arranged in a heat radiating part. CONSTITUTION: The title heat radiation structure is provided with a heat radiating part 2 which radiates heat and is in close contact with the heat generating parts 5 of a device 1, a cooling fan 3 blowing air to this heat radiating part 2, this heat radiating part 2 has a plural number of curved fins 21 arranged so that the blowing air from the fan 3 may run along the curved trenches formed between the adjacent heat radiating fins while the blowing air area from the fan 3 is set up almost the same as that of the air suction port of the heat radiation part 2 formed by the curved fins 21 as well as the curved fins 21 are curved in the shape so that the trenches formed between adjacent fins may pass above the heat generating parts 5.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipation structure, and more particularly to a heat dissipation structure for efficiently air-cooling a heating element of an electronic device.

[0002]

2. Description of the Related Art FIG. 3A is a perspective view of an electronic device showing an example of a conventional heat dissipation structure, FIG. 3B is a view taken in the direction of arrow B in FIG. 3A, and FIG. It is a top view.

Referring to FIG. 3, in this conventional example, a heat radiating portion 4 is attached to a device 1 having a heat generating portion 5, and the heat radiating portion 4 has a plurality of linear fins 41 arranged in parallel. . Then, the cooling air sent from the fan 3 provided outside the air suction part of the heat dissipation part 4 flows along the linear grooves formed between the adjacent linear fins 41 to cool the device 1 by air. It has a structure.

An example of the heat dissipation structure having the linear fins is the "air cooling structure" disclosed in Japanese Patent Laid-Open No. 61-75598.

[0005]

However, in this conventional heat radiation structure, the air blowing area from the fan may be insufficient as compared with the area of the air suction portion to the heat radiation portion of the device to be cooled. However, there is a problem that a sufficient cooling effect may not be obtained in the high heat generation part.

That is, as shown by the arrow in FIG. 3 (b), a sufficient cooling effect can be obtained in the portion where the air blown from the fan 3 hits, but the air is not hit in the heat-generating portion 5 and the cooling effect is natural. It is about the same as air cooling. As described above, unless the air is blown to the high heat generation portion, sufficient cooling cannot be performed, so that the temperature continues to rise, and when the temperature exceeds the allowable temperature range of the component, the component is damaged.

To avoid this, for example, Japanese Unexamined Patent Publication No.
As described in "Cooling Structure of Electronic Device" in Japanese Patent No. 145261, it is considered that the position of the fan is movably attached to the air suction part of the heat dissipation part of the device to be cooled or the fan is added. However, when the fan position cannot be moved or fans cannot be added due to structural design restrictions, the above problems still remain.

It is an object of the present invention to provide a heat dissipation structure which improves the cooling efficiency of a high heat generating part by making the shape of the heat dissipation fins arranged in the heat dissipation part curved.

[0009]

According to the present invention, there is provided a heat radiating portion which is in close contact with a heat generating portion of the device and radiates heat, and a cooling fan which blows air to the heat radiating portion, and the heat radiating portions are adjacent to each other. A heat dissipation structure having a plurality of curved fins arranged so that air from the fan flows along a groove formed between the heat dissipation fins can be obtained.

Further, in the curved fin, the grooves formed between the adjacent heat radiation fins are curved so as to pass over the respective heat generating portions dispersedly arranged in the heat radiation portion. A heat dissipation structure is obtained.

Further, there is obtained a heat dissipation structure characterized in that the width of the groove is variably set according to the size of the heat generating portion and the air blowing ability of the fan.

[0012]

Next, the present invention will be described with reference to the drawings.

FIG. 1A is a perspective view of an electronic device showing an embodiment of a heat dissipation structure of the present invention, FIG. 1B is a view taken along arrow A in FIG. 1A, and FIG. FIG.

Referring to FIG. 1, in this embodiment, the device 1
The heat radiating portion 2 is provided with a heat radiating portion 2 that closely adheres to the heat generating portion 5 and radiates heat, and a cooling fan 3 that blows air to the heat radiating portion 2.
Has a plurality of curved fins 21 arranged so that the air blown from the fan 3 flows along the groove formed between the adjacent heat radiation fins.

It should be noted that the area of air blown from the fan 3 is set to be substantially equal to the area of the air suction portion to the heat radiating portion 2 formed by the plurality of curved fins 21, and the curved fin 21 is placed between the adjacent fins. The formed groove is curved so as to pass over the heat generating portion 5.

With such a structure, the cooling air blown from the fan 3 smoothly flows along the curved grooves formed between the adjacent curved fins 21 to cool the apparatus 1 by air, and particularly the heat generating portion 5 The cooling efficiency of is not lower than that of other parts of the heat dissipation part 2.

Next, FIG. 2 is a side view showing the shape of another example of the curved fin in one embodiment of the present invention.

Although FIGS. 1 (a) and 1 (b) show an example in which there is only one heat generating portion 5, in FIG. 2 the apparatus has a plurality of heat generating portions and is formed between adjacent curved fins 22. The formed groove passes over the three heat generating portions 51, 52 and 53.

The curvature and shape of the heat radiation fin are not limited to those shown in FIGS. 1 and 2. Heat dissipation part,
Needless to say, it is possible to set an arbitrary degree of curvature, shape, and groove width, in particular, depending on the position and size of the high heat generation portion and the blowing ability of the cooling fan.

[0020]

As described above, the present invention is provided with a heat radiating portion which is in close contact with the heat generating portion of the device and radiates heat, and a cooling fan which blows air to the heat radiating portion. When the fan cannot be placed directly under the high heat generation part due to structural design restrictions by having multiple curved fins that are arranged so that the wind from the fan can flow along the grooves formed between the fins. Alternatively, even if the number of fans cannot be increased due to design or cost constraints, it is possible to guide the air blown from the cooling fan to the high heat generation portion. Further, since the fins have a curved shape, stagnation points are not generated in the cooling flow passage, and the cooling air from the cooling fan smoothly flows along the curved grooves formed between the adjacent heat radiation fins. The inflow resistance is extremely low.

Therefore, according to the present invention, the effect of increasing the cooling efficiency of the device and not particularly lowering the cooling effect of the high heat generating portion compared to other portions can be obtained.

[Brief description of drawings]

1A is a perspective view of an electronic device showing an embodiment of a heat dissipation structure of the present invention, FIG. 1B is a view taken along arrow A in FIG. 1A, and FIG. 1C is a view of FIG. It is a top view.

FIG. 2 is a side view showing the shape of another example of the curved fin according to the embodiment of the present invention.

3A is a perspective view of an electronic device showing an example of a conventional heat dissipation structure, FIG. 3B is a view taken in the direction of arrow B in FIG. 3A,
(C) is a top view of the same figure (a).

[Explanation of symbols]

 1 Device 2,4 Heat Dissipation Part 3 Fan 5,51,52,53 Heat Generation Part 21,22 Curved Fin 41 Linear Fin

Claims (3)

[Claims] 1. A heat dissipating portion that closely adheres to a heat generating portion of the device to dissipate heat, and a cooling fan that blows air to the heat dissipating portion, the heat dissipating portion being formed between adjacent heat dissipating fins. A heat dissipating structure having a plurality of curved fins arranged so that air from the fan flows along the fins. 2. The curved fin is curved so that the grooves formed between the adjacent fins for heat radiation pass above the respective heat-generating portions dispersedly arranged in the heat-radiating portion. The heat dissipation structure according to claim 1. 3. The heat dissipation structure according to claim 1, wherein the width of the groove is variably set according to the size of the heat generating portion and the blowing ability of the fan.