JP2002280779A - Cooler for electronic apparatus - Google Patents
Cooler for electronic apparatusInfo
- Publication number
- JP2002280779A JP2002280779A JP2001075520A JP2001075520A JP2002280779A JP 2002280779 A JP2002280779 A JP 2002280779A JP 2001075520 A JP2001075520 A JP 2001075520A JP 2001075520 A JP2001075520 A JP 2001075520A JP 2002280779 A JP2002280779 A JP 2002280779A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- cooling
- wind tunnel
- tunnel cover
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、各種発熱体の冷却
に用いられる強制空冷用ヒートシンク冷却装置に係り、
特に電子機器に用いられる発熱を伴う電子部品を取り付
けたシートシンクの冷却に好適な強制空冷用ヒートシン
ク冷却装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink cooling device for forced air cooling used for cooling various heating elements.
More particularly, the present invention relates to a heat sink cooling device for forced air cooling suitable for cooling a sheet sink to which a heat-generating electronic component used in electronic equipment is attached.
【０００２】[0002]
【従来の技術】複数の発熱電子部品を空気冷却する場
合、図６に示す如く、例えばアルミニュウム合金製のヒ
ートシンク基板１０１に多数の冷却用のフィン１０２を
形成してヒートシンク１００を構成し、この基板１０１
に、パワートランジスタやパワーダイオードの如き発熱
を伴う電子部品１０３を取り付けた放熱装置が用いられ
ていた。2. Description of the Related Art When a plurality of heat-generating electronic components are air-cooled, as shown in FIG. 6, a heat sink 100 is formed by forming a large number of cooling fins 102 on a heat sink substrate 101 made of, for example, an aluminum alloy. 101
In addition, a heat radiator to which an electronic component 103 that generates heat, such as a power transistor or a power diode, is used.
【０００３】また、発熱を伴う電子部品を取り付けたヒ
ートシンクに対し、冷却風を効果的にあてる技術とし
て、ヒートシンクの一部を削除し冷たい空気を電子部品
の真下の冷却用ピンにあてる手法が特開平１１−３０７
７０５号公報に記載され、またヒートシンクの外側をカ
バーで覆う手法が特開平９−１５３５７３号公報、特開
２０００−２９４６９５号公報に記載されている。Further, as a technique for effectively applying cooling air to a heat sink having an electronic component that generates heat, a technique of removing a part of the heat sink and directing cool air to a cooling pin directly below the electronic component is known. Kaihei 11-307
No. 705, and a method of covering the outside of the heat sink with a cover is described in JP-A-9-153573 and JP-A-2000-294695.
【０００４】[0004]
【発明が解決しようとする課題】ところで、図６に示す
従来のヒートシンク１００においては、電子部品１０２
の発熱を放熱するために大きな放熱面積が必要となり、
ヒートシンク１００が大型化、重量化し、近年の小型・
軽量化の要求に沿うことができなかった。By the way, in the conventional heat sink 100 shown in FIG.
Large heat dissipation area is needed to dissipate the heat of
The heat sink 100 has become larger and heavier, and has recently become smaller and smaller.
The demand for weight reduction could not be met.
【０００５】また特開平９−１５３５７３号公報に記載
されたものでは冷却風を送るファンの位置や、電子部品
の位置が限定され、また冷却風もフィンの横からもれる
ので冷却効果が低い。また特開２０００−２９４６９５
号公報に記載のものはカバーの外に冷却ファンが配置さ
れ、カバーと冷却ファンの間に存在する空隙部分から冷
却風が漏れて冷却効果が低い。Further, in the device described in Japanese Patent Application Laid-Open No. 9-153573, the position of a fan for sending cooling air and the position of electronic components are limited, and the cooling air leaks from the side of the fins, so that the cooling effect is low. Also, JP-A-2000-294695
The cooling fan is disposed outside the cover, and the cooling air leaks from a gap existing between the cover and the cooling fan, so that the cooling effect is low.
【０００６】特開平１１−３０７７０５号公報に記載の
ものは、冷却ピンに一部切り欠き部や短長部を形成して
あるが、これはヒートシンクに１個の電子部品しか配置
しないものであって、その電子部品の下部の冷却ピンに
冷たい空気があたるようにして中央部の熱伝達率を周辺
より大きくして放熱効率の向上を狙ったものであり、ヒ
ートシンクには１個のＬＳＩやパワートランジスタ等の
発熱素子が装着されるものにすぎず、複数の電子部品を
効率良く冷却することを目的とするものではない。Japanese Patent Application Laid-Open No. H11-307705 discloses a cooling pin in which a cutout portion and a short-length portion are partially formed, but this is one in which only one electronic component is arranged on a heat sink. The purpose is to increase the heat transfer coefficient in the center by increasing the heat transfer coefficient in the center by making cold air hit the cooling pins at the lower part of the electronic component to improve the heat radiation efficiency. It is merely a device to which a heating element such as a transistor is mounted, and is not intended to efficiently cool a plurality of electronic components.
【０００７】したがって本発明の目的は、このような問
題点を改善した電子機器の冷却装置を提供するものであ
る。SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a cooling device for electronic equipment in which such a problem is solved.
【０００８】[0008]
【課題を解決するための手段】本発明の概略を図３によ
り説明する。図３において、１はヒートシンク、２はヒ
ートシンク基板、３はフィン、４は切り欠き部、５−１
は電子部品、５−２は発熱量の大きい電子部品、６は風
洞カバー、７はファンである。本発明の前記目的は、下
記（１）、（２）の構成により達成することができる。The outline of the present invention will be described with reference to FIG. In FIG. 3, 1 is a heat sink, 2 is a heat sink substrate, 3 is a fin, 4 is a cutout portion, and 5-1.
Denotes an electronic component, 5-2 denotes an electronic component having a large heat value, 6 denotes a wind tunnel cover, and 7 denotes a fan. The above object of the present invention can be achieved by the following configurations (1) and (2).
【０００９】（１）ヒートシンク１に複数の電子部品５
−１、５−２を配置し、ヒートシンク１を強制冷却する
電子機器の冷却装置において、ヒートシンクの外側に風
洞カバー６を設け、冷却風が風洞カバー６の外側に漏れ
ないようにこの風洞カバー６の内側に冷却風を発生する
ファン７を設け、前記ヒートシンク１には複数の冷却フ
ィン３を形成するとともに、その風上側のフィンに部分
的に切り欠き部４を設け、前記ヒートシンク１には前記
切り欠き部４を設けた側に、前記複数の電子部品５−
１、５−２のうちの発熱量の大きい電子部品５−２を配
置したことを特徴とする電子機器の冷却装置。(1) The heat sink 1 has a plurality of electronic components 5
In a cooling device for an electronic device in which the heat sink 1 is forcibly cooled and the heat sink 1 is forcibly cooled, the wind tunnel cover 6 is provided outside the heat sink so that the cooling wind does not leak outside the wind tunnel cover 6. A fan 7 for generating cooling air is provided inside the heat sink 1, a plurality of cooling fins 3 are formed in the heat sink 1, and a notch 4 is partially provided in a fin on the windward side thereof. The plurality of electronic components 5-
A cooling device for an electronic device, wherein an electronic component 5-2 having a large calorific value among the components 1 and 5-2 is arranged.
【００１０】（２）ヒートシンクに複数の電子部品を配
置し、ヒートシンクを強制冷却する電子機器の冷却装置
において、ヒートシンクの外側に風洞カバーを設け、冷
却風が風洞カバーの外側に漏れないように、この風洞カ
バーの内側に冷却風を発生するファンを設け、前記ヒー
トシンクには複数の冷却ピンを形成するとともに、その
風上側の冷却ピンが部分的に存在しない切り欠き部を設
け、前記ヒートシンクには前記切り欠き部を設けた側
に、前記複数の電子部品のうちの発熱量の大きいものを
配置したことを特徴とする電子機器の冷却装置。(2) In a cooling device for an electronic device in which a plurality of electronic components are arranged on a heat sink and the heat sink is forcibly cooled, a wind tunnel cover is provided outside the heat sink so that cooling air does not leak outside the wind tunnel cover. A fan that generates cooling air is provided inside the wind tunnel cover, a plurality of cooling pins are formed in the heat sink, and a cutout portion in which the cooling pin on the windward side is partially absent is provided. A cooling device for an electronic device, wherein a component having a large calorific value among the plurality of electronic components is arranged on a side where the cutout portion is provided.
【００１１】これにより下記の作用効果を奏することが
できる。As a result, the following functions and effects can be obtained.
【００１２】（１）ヒートシンクの外側に風洞カバーを
設け、冷却風が風洞カバーの外側に漏れないように風洞
カバーの内側に冷却風発生用のファンを設け、またヒー
トシンクに形成した風上側のフィンに部分的に切り欠き
部を設けたので、切り欠き部の存在する側の風速を大き
くすることができ、この部分に配置した発熱量の大きい
電子部品を効果的に冷却することができる。(1) A wind tunnel cover is provided outside the heat sink, a cooling air generating fan is provided inside the wind tunnel cover so that cooling air does not leak outside the wind tunnel cover, and a windward fin formed on the heat sink is provided. Since the notch is partially provided in the portion, the wind speed on the side where the notch is present can be increased, and the electronic component having a large amount of heat disposed in this portion can be effectively cooled.
【００１３】（２）ヒートシンクの外側に風洞カバーを
設け、冷却風が風洞カバーの外側に漏れないように風洞
カバーの内側に冷却風発生用のファンを設け、またヒー
トシンクに形成した風上側の冷却ピンが部分的に存在し
ない切り欠き部を設けたので、切り欠き部の存在する側
の風速を大きくすることができ、この部分に配置した発
熱量の大きい電子部品を効果的に冷却することができ
る。(2) A wind tunnel cover is provided outside the heat sink, a cooling air generating fan is provided inside the wind tunnel cover so that cooling air does not leak outside the wind tunnel cover, and a windward cooling formed on the heat sink is provided. Since the cutout portion in which the pin does not partially exist is provided, the wind speed on the side where the cutout portion exists can be increased, and the electronic component having a large calorific value arranged in this portion can be effectively cooled. it can.
【００１４】[0014]
【発明の実施の形態】本発明の一実施の形態を図１〜図
４に説明する。図１は本発明に係るヒートシンクの一
例、図２は本発明の一実施の形態の電子機器の冷却装置
の外観図、図３は本発明の一実施の形態の電子機器の冷
却装置の分解説明図、図４は本発明の一実施の形態の電
子機器の冷却装置の側面図である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described with reference to FIGS. 1 is an example of a heat sink according to the present invention, FIG. 2 is an external view of a cooling device for an electronic device according to an embodiment of the present invention, and FIG. 3 is an exploded view of the cooling device for an electronic device according to the embodiment of the present invention. FIG. 4 is a side view of a cooling device for an electronic device according to an embodiment of the present invention.
【００１５】図中１はヒートシンク、２はヒートシンク
基板、３はフィン、４は切り欠き部、５−１は電子部
品、５−２は発熱量の大きい電子部品、６は風洞カバ
ー、７はファンである。In the figure, 1 is a heat sink, 2 is a heat sink substrate, 3 is a fin, 4 is a cutout portion, 5-1 is an electronic component, 5-2 is an electronic component having a large calorific value, 6 is a wind tunnel cover, 7 is a fan. It is.
【００１６】ヒートシンク１は、ヒートシンク基板２
と、このヒートシンク基板２の片面に形成された、放熱
用のフィン３により構成されている。この放熱用のフィ
ン３の一部には、図１に示す如く、ヒートシンク基板２
より削除又は欠除された切り欠き部４が存在している。The heat sink 1 comprises a heat sink substrate 2
And fins 3 for heat radiation formed on one surface of the heat sink substrate 2. As shown in FIG. 1, a part of the heat dissipating fins 3
There is a notched portion 4 that has been further deleted or deleted.
【００１７】このヒートシンク１は、銅やアルミニウム
合金等で構成され、軽量が要求される場合はＭｇ合金を
使用されるが、これらに限定されるものではない。The heat sink 1 is made of a copper or aluminum alloy or the like. When a light weight is required, an Mg alloy is used, but the heat sink 1 is not limited to these.
【００１８】ヒートシンク１の基板２上には、複数の電
子部品５−１、５−１、５−２が取り付けられるが、そ
の数はこれに限定されるものではない。A plurality of electronic components 5-1, 5-1 and 5-2 are mounted on the substrate 2 of the heat sink 1, but the number is not limited to this.
【００１９】このヒートシンク１には風洞カバー６を装
着する。風洞カバー６の一端には冷却風を発生するファ
ン７、７が取り付けられる。ファン７、７の発生する冷
却風の風向きが、図３に示す矢印方向の場合、ファン
７、７の位置は切り欠き部４の側に位置するように、す
なわち冷却風の風上側に切り欠き部４が位置するように
配置されている。図２に示す如く、風洞カバー６がヒー
トシンク基板２に電子部品５−１、５−２が実装されて
いるヒートシンク１に装置されたとき、ファン７、７の
冷却風は、フィン３を通過するまで風洞カバー６によ
り、外に漏れないように構成されている。A wind tunnel cover 6 is mounted on the heat sink 1. Fans 7, 7 for generating cooling air are attached to one end of the wind tunnel cover 6. When the wind direction of the cooling air generated by the fans 7 is in the direction of the arrow shown in FIG. It is arranged so that the part 4 is located. As shown in FIG. 2, when the wind tunnel cover 6 is mounted on the heat sink 1 in which the electronic components 5-1 and 5-2 are mounted on the heat sink substrate 2, the cooling air from the fans 7 passes through the fins 3. The wind tunnel cover 6 is configured so as not to leak outside.
【００２０】このように風洞カバー６がヒートシンク１
に装置されたとき、図４に示す如く、風洞カバー６は、
フィン３と風洞カバー６の側面との空隙ｇ2 と、フィン
３と風洞カバーの底面との空隙ｇ3 とが、ヒートシンク
のフィン３、３間の空隙ｇ1よりいずれも小さい、つま
りｇ1 ＞ｇ2 、ｇ1 ＞ｇ3 となるように構成されてい
る。As described above, the wind tunnel cover 6 is connected to the heat sink 1.
When installed in the wind tunnel cover 6 as shown in FIG.
The void g 2 of the side surface of the fin 3 and the air channel cover 6, and the gap g 3 between the bottom surface of the fin 3 and the air channel cover, both small than the gap g 1 between the fins 3, 3 of the heat sink, i.e. g 1> g 2 , g 1 > g 3 .
【００２１】これによりファン７、７より発生する冷却
風はフィン３の外側からも電子部品５−１、５−２の実
装されているヒートシンクのフィン３に吹き込むことが
可能となる。Thus, the cooling air generated by the fans 7 can be blown into the fins 3 of the heat sink on which the electronic components 5-1 and 5-2 are mounted from outside the fins 3.
【００２２】本発明では、ヒートシンク１のフィン３の
一部には切り欠き部４が形成されている。しかもこの切
り欠き部４は風上側に形成されているため、ファン７、
７により発生された冷却風は切り欠き部４の存在する部
分と存在しない部分とで圧力損失の差が生じ、圧力損失
の少ない切り欠き部４側により多くの冷却風が流れ込
み、風速が大きくなる。In the present invention, the notch 4 is formed in a part of the fin 3 of the heat sink 1. Moreover, since the notch 4 is formed on the windward side, the fan 7,
In the cooling air generated by 7, a difference in pressure loss occurs between the portion where the cutout portion 4 exists and the portion where it does not exist, more cooling air flows into the cutout portion 4 where the pressure loss is small, and the wind speed increases. .
【００２３】したがって切り欠き部４側に、電子部品５
−１よりも大きい発熱量を持つ電子部品５−２を配置す
れば、これを効果的に冷却することができる。つまりフ
ィン３の切り欠き部４を設けた側に発熱電子部品を多く
実装しておけば、切り欠き部のない側よりも切り欠き部
の存在する側の風速が大きいため効果的に冷却すること
ができる。このようにして装置全体の小型・軽量化が可
能となる。Therefore, the electronic component 5
If the electronic component 5-2 having a heat value larger than −1 is arranged, it can be cooled effectively. In other words, if a large number of heat-generating electronic components are mounted on the side of the fin 3 where the notch 4 is provided, effective cooling can be achieved because the wind speed on the side where the notch is present is higher than on the side without the notch. Can be. Thus, the size and weight of the entire apparatus can be reduced.
【００２４】なお前記説明では、切り欠き部としてフィ
ンの一部をヒートシンク基板部分より削除または初めか
ら存在しない欠除した例について説明したが、切り欠き
部は、このようにフィンの一部をヒートシンク基板部分
より削除または欠除したものに限定されるものではな
く、ヒートシンク基板部分にフィンの一部を短長部とし
て残した形状のものを使用することもできる。In the above description, an example was described in which a part of the fin was removed from the heat sink substrate portion as a cutout portion or was not originally present, but the cutout portion was formed by removing a part of the fin from the heat sink substrate. The shape of the heat sink is not limited to the one removed or omitted from the substrate portion, and a shape in which a part of the fin is left as a short and long portion in the heat sink substrate portion may be used.
【００２５】本発明の第２の実施の形態を図５にもとづ
き説明する。図５は、冷却用のフィンを使用する代わり
に、ピンを使用したものである。すなわち、ヒートシン
ク基板１１に多数の冷却用のピン１２を設ける。そして
このヒートシンク基板の一部に冷却風の風上側に切り欠
き部１３を設けたものである。電子部品は、図５で示し
たヒートシンク基板１１の反対側に配置され、前記と同
様に風洞カバーによりカバーされ、ファンにより強制冷
却される。A second embodiment of the present invention will be described with reference to FIG. FIG. 5 uses pins instead of using cooling fins. That is, a large number of cooling pins 12 are provided on the heat sink substrate 11. A cutout 13 is provided in a part of the heat sink substrate on the windward side of the cooling air. The electronic component is arranged on the opposite side of the heat sink substrate 11 shown in FIG. 5, is covered by the wind tunnel cover as described above, and is forcibly cooled by the fan.
【００２６】切り欠き部１３として、図５に示す如く、
冷却用のピンをヒートシンク基板１１部分より削除また
は欠除したものに限定されるものではなく、冷却用のピ
ンの一部をヒートシンク基板部分に短長部として残した
ものを使用してもよい。As shown in FIG.
The cooling pins are not limited to the ones in which the cooling pins are deleted or omitted from the heat sink substrate 11, and a cooling pin in which a part of the cooling pins is left as a short part in the heat sink substrate may be used.
【００２７】[0027]
【発明の効果】本発明により下記の効果を奏することが
できる。According to the present invention, the following effects can be obtained.
【００２８】（１）ヒートシンクの外側に風洞カバーを
設け、冷却風が風洞カバーの外側に漏れないように風洞
カバーの内側に冷却風発生用のファンを設け、またヒー
トシンクに形成した風上側のフィンに部分的に切り欠き
部を設けたので、切り欠き部の存在する側の風速を大き
くすることができ、この部分に配置した発熱量の大きい
電子部品を効果的に冷却することができる。(1) A wind tunnel cover is provided outside the heat sink, a cooling air generating fan is provided inside the wind tunnel cover so that cooling air does not leak outside the wind tunnel cover, and a windward fin formed on the heat sink is provided. Since the notch is partially provided in the portion, the wind speed on the side where the notch is present can be increased, and the electronic component having a large amount of heat disposed in this portion can be effectively cooled.
【００２９】（２）ヒートシンクの外側に風洞カバーを
設け、冷却風が風洞カバーの外側に漏れないように風洞
カバーの内側に冷却風発生用のファンを設け、またヒー
トシンクに形成した風上側の冷却ピンを部分的に切り欠
いた切り欠き部を設けたので、切り欠き部の存在する側
の風速を大きくすることができ、この部分に配置した発
熱量の大きい電子部品を効果的に冷却することができ
る。(2) A wind tunnel cover is provided outside the heat sink, a cooling air generation fan is provided inside the wind tunnel cover so that cooling air does not leak outside the wind tunnel cover, and a windward cooling formed on the heat sink is provided. Since the cut-out part where the pin is partially cut out is provided, the wind speed on the side where the cut-out part exists can be increased, and the electronic components having a large amount of heat disposed in this part can be effectively cooled. Can be.
【図１】本発明に係るヒートシンクの一例を示す。FIG. 1 shows an example of a heat sink according to the present invention.
【図２】本発明の一実施の形態の電子機器の冷却装置の
外観図を示す。FIG. 2 is an external view of a cooling device for an electronic device according to an embodiment of the present invention.
【図３】本発明の一実施の形態の電子機器の冷却装置の
分解説明図を示す。FIG. 3 is an exploded explanatory view of a cooling device for an electronic device according to an embodiment of the present invention.
【図４】本発明の一実施の形態の電子機器の冷却装置の
側面図を示す。FIG. 4 is a side view of a cooling device for an electronic device according to an embodiment of the present invention.
【図５】本発明の第２の実施の形態のヒートシンクの例
を示す。FIG. 5 shows an example of a heat sink according to a second embodiment of the present invention.
【図６】従来例を示す。FIG. 6 shows a conventional example.
１ ヒートシンク ２ ヒートシンク基板 ３ フィン ４ 切り欠き部 ５−１ 電子部品 ５−２ 発熱量の大きい電子部品 ６ 風洞カバー ７ ファン １０ ヒートシンク １１ ヒートシンク基板 １２ ピン １３ 切り欠き部 DESCRIPTION OF SYMBOLS 1 Heat sink 2 Heat sink board 3 Fin 4 Notch 5-1 Electronic component 5-2 Electronic component with large calorific value 6 Wind tunnel cover 7 Fan 10 Heat sink 11 Heat sink board 12 Pin 13 Notch
Claims (2)
ヒートシンクを強制冷却する電子機器の冷却装置におい
て、 ヒートシンクの外側に風洞カバーを設け、 冷却風が風洞カバーの外側に漏れないようにこの風洞カ
バーの内側に冷却風を発生するファンを設け、 前記ヒートシンクには複数の冷却フィンを形成するとと
もに、その風上側のフィンに部分的に切り欠き部を設
け、 前記ヒートシンクには前記切り欠き部を設けた側に、前
記複数の電子部品のうちの発熱量の大きい電子部品を配
置したことを特徴とする電子機器の冷却装置。A plurality of electronic components arranged on a heat sink;
In a cooling device for electronic equipment for forcibly cooling a heat sink, a wind tunnel cover is provided outside the heat sink, and a fan is provided inside the wind tunnel cover to generate cooling air so that the cooling wind does not leak outside the wind tunnel cover. A plurality of cooling fins are formed, and a notch is provided partially in the fin on the windward side, and the heat generation amount of the plurality of electronic components is provided on the heat sink on the side where the notch is provided. A cooling device for electronic equipment, wherein electronic components having a large size are arranged.
ヒートシンクを強制冷却する電子機器の冷却装置におい
て、 ヒートシンクの外側に風洞カバーを設け、 冷却風が風洞カバーの外側に漏れないように、この風洞
カバーの内側に冷却風を発生するファンを設け、 前記ヒートシンクには複数の冷却ピンを形成するととも
に、その風上側の冷却ピンが部分的に存在しない切り欠
き部を設け、 前記ヒートシンクには前記切り欠き部を設けた側に、前
記複数の電子部品のうちの発熱量の大きいものを配置し
たことを特徴とする電子機器の冷却装置。2. A plurality of electronic components are arranged on a heat sink,
In a cooling device for an electronic device that forcibly cools a heat sink, a wind tunnel cover is provided outside the heat sink, and a fan that generates cooling air is provided inside the wind tunnel cover so that the cooling wind does not leak outside the wind tunnel cover. A plurality of cooling pins are formed on the heat sink, and a cutout portion in which the cooling pin on the windward side is partially absent is provided, and the heat sink is provided with the plurality of electronic components on the side where the cutout portion is provided. A cooling device for an electronic device, wherein a device having a large calorific value is arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001075520A JP3566935B2 (en) | 2001-03-16 | 2001-03-16 | Electronic equipment cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001075520A JP3566935B2 (en) | 2001-03-16 | 2001-03-16 | Electronic equipment cooling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002280779A true JP2002280779A (en) | 2002-09-27 |
| JP3566935B2 JP3566935B2 (en) | 2004-09-15 |
Family
ID=18932586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001075520A Expired - Fee Related JP3566935B2 (en) | 2001-03-16 | 2001-03-16 | Electronic equipment cooling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3566935B2 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20040052009A (en) * | 2002-12-13 | 2004-06-19 | 엘지이노텍 주식회사 | CPU Cooling Module |
| JP2007250893A (en) * | 2006-03-16 | 2007-09-27 | Yaskawa Electric Corp | Electronic equipment |
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| KR20040052009A (en) * | 2002-12-13 | 2004-06-19 | 엘지이노텍 주식회사 | CPU Cooling Module |
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