KR20130031571A - Cooling device for electronic components - Google Patents

Abstract

PURPOSE: An electronic component cooling apparatus is provided to control a distance between a center of a nozzle in which a liquid coolant is emitted and a heat radiation pin adjacent to it, thereby improve the cooling efficiency. CONSTITUTION: A heat sink(120) is equipped in a bottom plane of a substrate and has a plurality of heat radiation pin(130). A first side wall(70) contacts with the heat sink and surrounds the plurality of pin, but separates with the pin and has a vent. A first cover(80) covers the first side wall and the plurality of pin, separates with the pin and has a through-hole. A second side wall contacts with bottom of the first cover, and surrounds a part of the first cover. The second cover covers the second side wall. An inlet port is formed in any one of the second side wall and the second cover. The through-hole of the first cover is equipped in a position corresponding to a heating component.

Description

Cooling device for electronic components

One embodiment of the present invention relates to a cooling device, and more particularly, to a cooling device for cooling an electronic component.

Electronics consume power during operation, and part of the power consumed is released as heat, so that the temperature of certain parts of the electronics can be high. Thus, in order to use electronics normally, the heat generating portion of the electronics is kept below a given temperature. To this end, the electronic product may be provided with a cooling system or a device for lowering the temperature of the heating portion.

For example, when the heat generating portion of the electronic product is a power module, the liquid may be cooled by spraying a liquid on the rear surface of the power module substrate. When the heat generating portion of the electronic product is a CPU, a heat sink may be attached to the CPU, and the liquid refrigerant may be injected and cooled therein.

One embodiment of the present invention provides an electronic component cooling apparatus that can increase the cooling efficiency.

An electronic component cooling apparatus according to an embodiment of the present invention includes a substrate on which a heating component is mounted on an upper surface, a heat sink provided on a bottom surface of the substrate, and having a plurality of heat dissipation fins, and in contact with the heat sink. A first sidewall spaced from the pin and spaced apart from the pin, the first sidewall having the outlet, a first cover covering the first sidewall and the plurality of pins and spaced apart from the pin and having a through hole; And a second sidewall contacting and surrounding a portion of the first lid, and a second lid covering the second sidewall, wherein an inlet is present in any one of the second sidewall and the second lid, 1 The through hole of the cover is provided at a position corresponding to the heat generating part.

In the cooling device, the plurality of fins may be provided around an area corresponding to the heat generating part.

The plurality of pins may have the same length or different lengths.

The substrate may be a direct bonding copper (DBC) substrate.

The distance R between the line passing through the center of the through hole formed in the first cover and the pin at the shortest distance from the line may be 0.8 to 1.4 times the diameter d of the through hole.

The first cover has a plurality of through-holes corresponding to the heating element in a one-to-one relationship, and divides an internal space formed by the first and second covers and the second sidewall between the first and second covers. A partition wall exists, and the partition wall may be positioned between the plurality of through holes.

An electronic component cooling apparatus according to another embodiment of the present invention includes a substrate on which a heating component is mounted, a heat sink having a plurality of fins in contact with a bottom surface of the substrate, and a first space surrounding the plurality of fins. A first side wall and a first cover, a second side wall and a second cover forming a second space connected to the first space under the first space, and having a discharge port at the first side wall, One of the second sidewall and the second cover has an inlet.

In such a cooling device, the first and second spaces may be connected to a plurality of through holes.

The plurality of through holes may correspond one-to-one with the heat generating part.

The plurality of pins may have the same length or different lengths.

The second space may be divided equally to the number of the heating parts.

In the electronic component cooling apparatus according to an embodiment of the present invention, the distance R between the center of the nozzle (or orifice) in which the liquid refrigerant is injected and the heat dissipation fin adjacent thereto is 0.8 to 1.4 times the diameter d of the nozzle ( R / d = 0.8 to 1.4), the maximum cooling efficiency can be obtained.

1 is a cross-sectional view of an electronic component cooling apparatus according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view illustrating a case in which the second space 150 into which the liquid refrigerant flows in FIG. 1 is divided into two parts.
3 is a cross-sectional view illustrating an example of a configuration of the substrate 100 in the electronic component cooling apparatus illustrated in FIGS. 1 and 2.
4 is a plan view of the first area A1 of FIG. 1.

Hereinafter, an electronic component cooling apparatus according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In this process, the thicknesses of layers or regions illustrated in the drawings are exaggerated for clarity.

Referring to FIG. 1, an electronic component cooling apparatus according to an embodiment of the present invention includes a substrate 110, a heat sink 120, a heat sink accommodating space 140, and a liquid refrigerant accommodating space 150. The substrate 110 and the heat sink 120 may be bonded by paste or solder or may be bonded by sintering. The heating component 100 may be mounted on the upper surface of the substrate 110. The heat generating part 100 may be, for example, a semiconductor chip, a CPU, or a power module. The heat sink 120 is attached to the bottom surface of the substrate 120. The heat sink 120 has a plurality of fins 130 facing downward. However, the fin 130 does not exist in the area under the heat generating part 100. In other words, the area corresponding to the heat generating part 100 on the bottom surface of the heat sink 120 is a flat area without fins. The plurality of fins 130 may be heat dissipation fins for dissipating heat transferred to the heating component 100. The lengths of the plurality of fins 130 are the same, but may be different from each other in part or in different regions. Below the heat sink 120, there is a first sidewall 70 surrounding the plurality of fins 130. The first sidewall 70 is spaced apart from the plurality of fins 130. First and second through holes 70h1 and 70h2 are formed in the first sidewall 70. The first and second through holes 70h1 and 70h2 are disposed to face each other with the plurality of pins 130 interposed therebetween, but may not be the same. The first and second through holes 70h1 and 70h2 are discharge ports through which liquid refrigerant contacted with the plurality of fins 130 is discharged. The plurality of fins 130 surrounded by the first sidewall 70 are covered with the first cover 75. The first cover 75 is spaced apart from the plurality of pins 130. The first cover 130 is in sealing contact with the first side wall 70. The first side wall 70 and the first cover 75 form a first space 140 to receive the plurality of fins 130 under the heat sink 120. The liquid refrigerant introduced into the first space 140 absorbs heat from the plurality of fins 130 and is discharged through the first and second through holes 70h1 and 70h2. Third and fourth through holes 75h1 and 75h2 are formed in the first cover 75. The third and fourth through holes 75h1 and 75h2 may be represented by nozzles or orifices. The liquid refrigerant flows into the first space 140 through the third and fourth through holes 75h1 and 75h2. The third and fourth through holes 75h1 and 75h2 are formed at positions corresponding one-to-one with the heating component 100, respectively. Accordingly, the third and fourth through holes 75h1 and 75h2 face the center of the flat portion of the heat sink 120 in which the plurality of fins 130 under the heat generating part 100 do not exist, respectively. Accordingly, the liquid refrigerant flowing into the first space 140 is sprayed (contacted) to the flat area of the heat sink 120 under the heat generating component 100 as indicated by the dotted arrow, and flows around the fin 130. After contacting, the gas is discharged out of the first space 140 through the first and second through holes 70h1 and 70h2.

The virtual lines L1 and L2 passing through the centers of the third and fourth through holes 75h1 and 75h2 in the first space 140 and the third and fourth through holes 75h1 and 75h2 among the fins 130. The distance R between adjacent pins satisfies Equation 1 below.

[Equation 1]

R ≥ 0.8 × d

In Equation 1, d is the diameter of the third and fourth through holes 75h1 and 75h2.

When the distance R satisfies the condition of Equation 1 in the Nusselt number measurement experiment for the cooling device of FIG. 1, for example, the ratio of the distance R / diameter d is about 0.8 to 1.4. When the Nusselt number came out larger than in other ranges.

From this result, the relationship between the third and fourth through holes 75h1 and 75h2 and the fin 130 does not satisfy Equation 1 than between the liquid sink and the heat sink 120 including the fin 130. It can be seen that the heat transfer efficiency is high. As a result, the cooling efficiency of the cooling device of FIG. 1 becomes higher.

Subsequently, there is a second sidewall 80 perpendicular to the first lid 75 at the bottom of the first lid 75. The first cover 75 and the second side wall 80 are in sealing contact. The second sidewall 80 is located below the first sidewall 70. The second side wall 80 surrounds a predetermined area of the first cover 75, and corresponds to the area surrounded by the first side wall 75. The second side wall 80 is covered with a second cover 60. The second cover 60 and the second side wall 80 are in sealing contact. The fifth through hole 60h1 is formed in the second cover 60. The fifth through hole 60h1 may be located between the third and fourth through holes 75h1 and 75h2. The liquid refrigerant flows through the fifth through hole 60h1. The second side wall 80 and the second cover 60 form a second volume 150 of a given volume under the first cover 75. The liquid refrigerant flowing through the fifth through hole 60h1 is filled in the second space 150, and flows into the first space 140 through the third and fourth through holes 75h1 and 75h2. The inflow amount and inflow pressure of the liquid refrigerant flowing through the fifth through hole 60h1 may be controlled by a flow controller (not shown) installed outside.

Instead of providing the through holes 60h1 in the second cover 60, the sixth and seventh through holes 80h1 and 80h2 facing each other may be provided on the second sidewall 80.

On the other hand, as shown in FIG. 2, the second space 150 of FIG. 1 may be divided into third and fourth spaces 170 and 180. An airtight partition wall 50 is present between the third and fourth spaces 170 and 180. The partition wall 50 may be located between the third and fourth through holes 75h1 and 75h2. The third and fourth spaces 170 and 180 correspond one-to-one with the heating component 100, respectively. The liquid refrigerant flowing into the third and fourth spaces 170 and 180 flows through the sixth and seventh through holes 80h1 and 80h2 formed in the second sidewall 80, respectively. The sixth and seventh through holes 80h1 and 80h2 may be connected to separate flow controllers, respectively. In FIG. 2, the sixth and seventh through holes 80h1 and 80h2 may be formed in the second cover 60 instead of the second sidewall 80. The second space 150 may be divided into the same number as the number of the heating parts 100.

1 and 2, the top and bottom surfaces of the substrate 110 are relative representations. 1 and 2, the upper surface of the substrate 110 may be a bottom surface, and the bottom surface may be represented by an upper surface, depending on the direction in which the cooling apparatus is viewed in FIGS. 1 and 2.

 In the cooling apparatus of FIGS. 1 and 2, the substrate 110 may be, for example, a DBC substrate as illustrated in FIG. 3. Referring to FIG. 3, the substrate 110 may include a first copper layer 110a, an insulating layer 110b, and a second copper layer 110c sequentially stacked. The insulating layer 110b may be, for example, aluminum nitride (eg, AlN) or aluminum oxide (eg, Al 2 O 3).

4 is a plan view of the first region A1 of the cooling device of FIG. 1.

Referring to FIG. 4, the fins 130 are distributed around the third through hole 75h1 in the first cover 75. The fin 130 may be symmetrically distributed about the third through hole 75h1. However, it can also be distributed asymmetrically. In FIG. 4, the dashed circle is written for convenience in order to indicate the distance R. FIG.

While many details are set forth in the foregoing description, they should be construed as illustrative of preferred embodiments, rather than to limit the scope of the invention. Therefore, the scope of the present invention should not be defined by the described embodiments, but should be determined by the technical spirit described in the claims.

50: bulkhead 70, 80: first and second sidewall
70h1, 70h2, 75h1, 75h2, 60h1, 80h1, 80h2: first through seventh through holes
75 and 60: first and second covers 100: heat generating parts
110: substrate 120: heat sink
130: multiple pins
140, 150, 170, 180: first to fourth spaces
R: Distance between nozzle and adjacent pin
d: Nozzle diameter L1, L2: Virtual line passing through the center of the nozzle

Claims (12)

A substrate on which heat generating parts are mounted;
A heat sink provided on a bottom surface of the substrate and having a plurality of heat dissipation fins;
A first sidewall in contact with the heat sink and surrounding the plurality of fins, the first sidewalls being spaced apart from the fins and having an outlet;
A first cover covering the first sidewall and the plurality of fins and spaced apart from the fins and having a through hole;
A second sidewall contacting the first cover and surrounding a portion of the first cover; And
A second cover covering the second sidewall;
An inlet is present in any one of the second sidewall and the second lid,
The through hole of the first cover is an electronic component cooling device provided in a position corresponding to the heat generating component. The method of claim 1,
And the plurality of fins are disposed around an area corresponding to the heat generating part. The method of claim 1,
Cooling device of the electronic component of the same or different length of the plurality of fins. The method of claim 1,
The substrate is an electronic component cooling device is a DBC (Direct Bonding Copper) substrate. The method of claim 2,
And a distance (R) between a line passing through the center of the through hole formed in the first cover and a pin at the shortest distance from the line is 0.8 to 1.4 times the diameter (d) of the through hole. The method of claim 1,
The first cover has a plurality of through-holes corresponding to the heating element in a one-to-one relationship, and divides an internal space formed by the first and second covers and the second sidewall between the first and second covers. A partition wall exists, and the partition wall is positioned between the plurality of through holes. A substrate on which heat generating parts are mounted;
A heat sink in contact with the bottom surface of the substrate and having a plurality of fins;
A first sidewall and a first cover forming a first space surrounding the plurality of pins;
And a second sidewall and a second cover forming a second space connected to the first space below the first space.
An outlet on the first sidewall,
And an inlet in one of said second sidewall and said second cover. The method of claim 7, wherein
The electronic component cooling apparatus of which the first and second spaces are connected by a plurality of through holes. The method of claim 8,
And a distance (R) between a line passing through the center of each of the plurality of through holes and a pin at the shortest distance from the line is 0.8 to 1.4 times the diameter (d) of the through hole. The method of claim 8,
And the plurality of through holes correspond one-to-one with the heat generating parts. The method of claim 7, wherein
And the plurality of fins have the same length or different lengths. The method of claim 7, wherein
And the second space is divided equally to the number of heat generating parts.

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