JPS60118269U - 電子機器用ケ−ス - Google Patents
電子機器用ケ−スInfo
- Publication number
- JPS60118269U JPS60118269U JP623084U JP623084U JPS60118269U JP S60118269 U JPS60118269 U JP S60118269U JP 623084 U JP623084 U JP 623084U JP 623084 U JP623084 U JP 623084U JP S60118269 U JPS60118269 U JP S60118269U
- Authority
- JP
- Japan
- Prior art keywords
- case
- circuit board
- electronic device
- electronic equipment
- corner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/006—Casings specially adapted for signal processing applications, e.g. CATV, tuner, antennas amplifier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/04—Metal casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1178—Means for venting or for letting gases escape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第1図は従来の電子機器用ケースの分解状態を示す断面
図、第2A図と第2B図は枠体を開口部方向から示す斜
視図、第3図以下の図面は本考案の実施例を示すもので
あり、第3図は電子機器用ケニスの分解状態を示す断面
図、第4A図と第4B図は枠体を開口部方向から示す斜
視図である。 11・・・・・・枠体、lla・・・・・・係止突起、
llb・・・・・・開口部、llc・・・・・・支持片
、lld、lle・・・・・・切欠き、iff・・・・
・・固着片、13・・・・・・回路基。 板、14,15・・・・・・カバー、16・・・・・・
半田。
図、第2A図と第2B図は枠体を開口部方向から示す斜
視図、第3図以下の図面は本考案の実施例を示すもので
あり、第3図は電子機器用ケニスの分解状態を示す断面
図、第4A図と第4B図は枠体を開口部方向から示す斜
視図である。 11・・・・・・枠体、lla・・・・・・係止突起、
llb・・・・・・開口部、llc・・・・・・支持片
、lld、lle・・・・・・切欠き、iff・・・・
・・固着片、13・・・・・・回路基。 板、14,15・・・・・・カバー、16・・・・・・
半田。
Claims (2)
- (1)金属板製の枠体の内部に回路基板が設置されてい
る電子機器用ケースにおいて、前記枠体の開口部の各コ
ーナ一部の近傍には切欠きが形成されており、且つ前記
回路基板の縁部は上記コーナ一部に対して半田付けされ
ていることを特徴とする電子機器用ケース。 - (2)回路基板の縁部が半田付けされる各コーナ一部は
、回路基板を仮止めする弾性支持片になっている実用新
案登録請求の範囲(1)項記載の電子機器用ケース。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP623084U JPS60118269U (ja) | 1984-01-20 | 1984-01-20 | 電子機器用ケ−ス |
GB08420438A GB2153152B (en) | 1984-01-20 | 1984-08-10 | Case for electronic devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP623084U JPS60118269U (ja) | 1984-01-20 | 1984-01-20 | 電子機器用ケ−ス |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60118269U true JPS60118269U (ja) | 1985-08-09 |
Family
ID=11632710
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP623084U Pending JPS60118269U (ja) | 1984-01-20 | 1984-01-20 | 電子機器用ケ−ス |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS60118269U (ja) |
GB (1) | GB2153152B (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3537669C2 (de) * | 1985-10-23 | 1994-02-24 | Bosch Gmbh Robert | Hochfrequenzdichtes Gehäuse |
US4716499A (en) * | 1986-07-28 | 1987-12-29 | Hayes Microcomputer Products, Inc. | Enclosed circuit board assembly |
JPH062316Y2 (ja) * | 1988-07-08 | 1994-01-19 | アルプス電気株式会社 | シールドケースの底面カバー取付構造 |
JP2501638Y2 (ja) * | 1991-11-25 | 1996-06-19 | 船井電機株式会社 | プリント基板装着用シ―ルド板 |
GB2285181A (en) * | 1993-12-23 | 1995-06-28 | Hitec Sheet Metal Limited | Electromagnetic radiation shielding for printed circuit boards |
AU2003224018A1 (en) | 2002-04-30 | 2003-11-17 | Sony Ericsson Mobile Communications Ab | A method for attaching a shield can to a pcb and a shield can therefor |
EP1359794A1 (en) | 2002-04-30 | 2003-11-05 | Sony Ericsson Mobile Communications AB | A method for soldering a shield can to a PCB and shield can therefor |
DE10326458B4 (de) | 2003-06-12 | 2006-05-04 | Phoenix Contact Gmbh & Co. Kg | Kühlanordnung für elektronische Bauelemente |
US7654304B2 (en) * | 2007-03-27 | 2010-02-02 | Adc Telecommunications, Inc. | Clamshell chassis assembly |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2932015C2 (de) * | 1978-08-07 | 1983-12-29 | Mitsumi Electric Co., Ltd., Tokyo | Abschirmvorrichtung für Hochfrequenzschaltungen |
-
1984
- 1984-01-20 JP JP623084U patent/JPS60118269U/ja active Pending
- 1984-08-10 GB GB08420438A patent/GB2153152B/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB8420438D0 (en) | 1984-09-12 |
GB2153152B (en) | 1987-10-21 |
GB2153152A (en) | 1985-08-14 |
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