ITRE20040068A1 - Termodissipatore per la dissipazione di calore per componenti elettronici - Google Patents

Termodissipatore per la dissipazione di calore per componenti elettronici

Info

Publication number
ITRE20040068A1
ITRE20040068A1 IT000068A ITRE20040068A ITRE20040068A1 IT RE20040068 A1 ITRE20040068 A1 IT RE20040068A1 IT 000068 A IT000068 A IT 000068A IT RE20040068 A ITRE20040068 A IT RE20040068A IT RE20040068 A1 ITRE20040068 A1 IT RE20040068A1
Authority
IT
Italy
Prior art keywords
heat
electronic components
dissipator
heat dissipation
dissipation
Prior art date
Application number
IT000068A
Other languages
English (en)
Inventor
Elmar Schaper
Original Assignee
Phoenix C0Ntact Gmbh & Co Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoenix C0Ntact Gmbh & Co Kg filed Critical Phoenix C0Ntact Gmbh & Co Kg
Publication of ITRE20040068A1 publication Critical patent/ITRE20040068A1/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
IT000068A 2003-06-12 2004-06-04 Termodissipatore per la dissipazione di calore per componenti elettronici ITRE20040068A1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10326458A DE10326458B4 (de) 2003-06-12 2003-06-12 Kühlanordnung für elektronische Bauelemente

Publications (1)

Publication Number Publication Date
ITRE20040068A1 true ITRE20040068A1 (it) 2004-09-04

Family

ID=33482824

Family Applications (1)

Application Number Title Priority Date Filing Date
IT000068A ITRE20040068A1 (it) 2003-06-12 2004-06-04 Termodissipatore per la dissipazione di calore per componenti elettronici

Country Status (5)

Country Link
US (2) US7185696B2 (it)
JP (1) JP4587279B2 (it)
DE (1) DE10326458B4 (it)
FR (1) FR2856195B1 (it)
IT (1) ITRE20040068A1 (it)

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US7193851B2 (en) * 2004-12-09 2007-03-20 Cray Inc. Assemblies for holding heat sinks and other structures in contact with electronic devices and other apparatuses
DE102005022226B4 (de) * 2005-05-10 2008-05-15 RUNGE, André Kühlanordnung für in einem Gehäuse angeordnete elektronische Bauelemente
US7336491B2 (en) 2005-09-06 2008-02-26 Lear Corporation Heat sink
US7411785B2 (en) * 2006-06-05 2008-08-12 Cray Inc. Heat-spreading devices for cooling computer systems and associated methods of use
TWI303973B (en) * 2006-09-06 2008-12-01 Delta Electronics Inc Heat sink fastening device and manufacturing method thereof
US20090154091A1 (en) * 2007-12-17 2009-06-18 Yatskov Alexander I Cooling systems and heat exchangers for cooling computer components
US8170724B2 (en) 2008-02-11 2012-05-01 Cray Inc. Systems and associated methods for controllably cooling computer components
US7898799B2 (en) 2008-04-01 2011-03-01 Cray Inc. Airflow management apparatus for computer cabinets and associated methods
US7903403B2 (en) 2008-10-17 2011-03-08 Cray Inc. Airflow intake systems and associated methods for use with computer cabinets
US8081459B2 (en) 2008-10-17 2011-12-20 Cray Inc. Air conditioning systems for computer systems and associated methods
DE102009044368B4 (de) * 2009-10-30 2014-07-03 Lear Corporation Gmbh Kühlanordnung
US8472181B2 (en) 2010-04-20 2013-06-25 Cray Inc. Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use
CN102986318B (zh) 2010-04-23 2015-04-15 纳派泰克股份公司 热控制组件
US9591788B2 (en) * 2011-04-13 2017-03-07 Siemens Aktiengesellschaft Coupling system between a waste-heat generator and a waste-heat receiver
DE202012101076U1 (de) * 2011-04-14 2012-04-19 Visteon Global Technologies, Inc. Vorrichtung zum Kühlen von Batterien, insbesondere für Kraftfahrzeuge
CN102299127B (zh) * 2011-07-13 2013-12-11 台达电子企业管理（上海）有限公司 用于封装元件的双向散热器及其组装方法
EP2648495B1 (en) * 2012-04-04 2015-02-25 Inmotion Technologies AB Switched power converter
DE102012222959B4 (de) * 2012-12-12 2015-04-02 Semikron Elektronik Gmbh & Co. Kg Leistungsbauelementeinrichtung
CN108630636B (zh) * 2017-03-24 2022-01-14 德昌电机(深圳)有限公司 Mos器件安装结构、控制器及电动助力转向系统
JP7155571B2 (ja) * 2018-03-27 2022-10-19 ブラザー工業株式会社 電子部品実装装置
CN113161306B (zh) * 2021-04-15 2024-02-13 浙江集迈科微电子有限公司 芯片的高效散热结构及其制备工艺

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Also Published As

Publication number Publication date
FR2856195B1 (fr) 2010-02-19
DE10326458B4 (de) 2006-05-04
US20070125517A1 (en) 2007-06-07
FR2856195A1 (fr) 2004-12-17
DE10326458A1 (de) 2005-01-20
JP2005005712A (ja) 2005-01-06
US20040250990A1 (en) 2004-12-16
US7984754B2 (en) 2011-07-26
US7185696B2 (en) 2007-03-06
JP4587279B2 (ja) 2010-11-24

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