DE60111235D1 - Wärmeableitungsstruktur - Google Patents
WärmeableitungsstrukturInfo
- Publication number
- DE60111235D1 DE60111235D1 DE60111235T DE60111235T DE60111235D1 DE 60111235 D1 DE60111235 D1 DE 60111235D1 DE 60111235 T DE60111235 T DE 60111235T DE 60111235 T DE60111235 T DE 60111235T DE 60111235 D1 DE60111235 D1 DE 60111235D1
- Authority
- DE
- Germany
- Prior art keywords
- heat dissipation
- dissipation structure
- heat
- dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0213—Venting apertures; Constructional details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01125557A EP1307081B1 (de) | 2001-10-25 | 2001-10-25 | Wärmeableitungsstruktur |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60111235D1 true DE60111235D1 (de) | 2005-07-07 |
DE60111235T2 DE60111235T2 (de) | 2006-03-23 |
Family
ID=8179079
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60111235T Expired - Lifetime DE60111235T2 (de) | 2001-10-25 | 2001-10-25 | Thermische ableitungsstruktur |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP1307081B1 (de) |
DE (1) | DE60111235T2 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005007830A (ja) * | 2003-06-20 | 2005-01-13 | Brother Ind Ltd | 筐体の通風構造及び筐体の通風構造を備えた印字装置 |
CN201663105U (zh) * | 2010-03-10 | 2010-12-01 | 泰科电子(深圳)有限公司 | 应用于电子元件外壳上的气孔结构 |
WO2016004951A1 (en) * | 2014-07-11 | 2016-01-14 | Vestas Wind Systems A/S | A casing for electronics equipment with an integrated heat sink |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4840286A (en) * | 1988-02-23 | 1989-06-20 | Hayes Microcomputer Products, Inc. | Equipment enclosure with internal fasteners |
US5730512A (en) * | 1995-04-07 | 1998-03-24 | Apple Computer, Inc. | Multipiece monitor housing having vented joints |
-
2001
- 2001-10-25 DE DE60111235T patent/DE60111235T2/de not_active Expired - Lifetime
- 2001-10-25 EP EP01125557A patent/EP1307081B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1307081A1 (de) | 2003-05-02 |
DE60111235T2 (de) | 2006-03-23 |
EP1307081B1 (de) | 2005-06-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |