DE60213925D1 - Kühlungsvorrichtung - Google Patents

Kühlungsvorrichtung

Info

Publication number
DE60213925D1
DE60213925D1 DE60213925T DE60213925T DE60213925D1 DE 60213925 D1 DE60213925 D1 DE 60213925D1 DE 60213925 T DE60213925 T DE 60213925T DE 60213925 T DE60213925 T DE 60213925T DE 60213925 D1 DE60213925 D1 DE 60213925D1
Authority
DE
Germany
Prior art keywords
cooling device
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60213925T
Other languages
English (en)
Other versions
DE60213925T2 (de
Inventor
Hiroshi Takigawa
Tetsuro Sakano
Yuji Nishikawa
Masao Sato
Shinya Naito
Koji Hayano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fanuc Corp
Original Assignee
Fanuc Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fanuc Corp filed Critical Fanuc Corp
Publication of DE60213925D1 publication Critical patent/DE60213925D1/de
Application granted granted Critical
Publication of DE60213925T2 publication Critical patent/DE60213925T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • F28F3/086—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning having one or more openings therein forming tubular heat-exchange passages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02423—Liquid cooling, e.g. a liquid cools a mount of the laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4031—Edge-emitting structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4031—Edge-emitting structures
    • H01S5/4043—Edge-emitting structures with vertically stacked active layers
    • H01S5/405—Two-dimensional arrays

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Semiconductor Lasers (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Lasers (AREA)
DE60213925T 2001-06-25 2002-06-25 Kühlungsvorrichtung Expired - Fee Related DE60213925T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001191707 2001-06-25
JP2001191707A JP2003008273A (ja) 2001-06-25 2001-06-25 冷却装置及び光源装置

Publications (2)

Publication Number Publication Date
DE60213925D1 true DE60213925D1 (de) 2006-09-28
DE60213925T2 DE60213925T2 (de) 2006-12-07

Family

ID=19030290

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60213925T Expired - Fee Related DE60213925T2 (de) 2001-06-25 2002-06-25 Kühlungsvorrichtung

Country Status (4)

Country Link
US (1) US6865200B2 (de)
EP (1) EP1271723B1 (de)
JP (1) JP2003008273A (de)
DE (1) DE60213925T2 (de)

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EP1716624B1 (de) 2004-02-20 2009-01-28 Electrovac AG Verfahren zum herstellen von plattenstapeln, insbesondere von aus plattenstapeln bestehenden kühlern oder kühlerelementen
JP4522725B2 (ja) * 2004-03-16 2010-08-11 三菱電機株式会社 ヒートシンク
JP2005268445A (ja) * 2004-03-17 2005-09-29 Hamamatsu Photonics Kk 半導体レーザ装置
JP4074259B2 (ja) 2004-03-17 2008-04-09 浜松ホトニクス株式会社 半導体レーザ装置
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JP2008300596A (ja) * 2007-05-31 2008-12-11 Sony Corp ヒートシンクおよび半導体レーザ装置
US7738249B2 (en) * 2007-10-25 2010-06-15 Endicott Interconnect Technologies, Inc. Circuitized substrate with internal cooling structure and electrical assembly utilizing same
US7660335B2 (en) 2008-04-17 2010-02-09 Lasertel, Inc. Liquid cooled laser bar arrays incorporating diamond/copper expansion matched materials
DE102009024310A1 (de) * 2008-06-05 2010-05-27 Jenoptik Laserdiode Gmbh Vorrichtung mit einer Halbleiterbauelement-Anordnung und einem Kühlelement
DE102008026856A1 (de) * 2008-06-05 2009-12-17 Jenoptik Laserdiode Gmbh Kühlelement für ein elektronisches Bauelement und Vorrichtung mit einem elektronischen Bauelement
US9590388B2 (en) 2011-01-11 2017-03-07 Northrop Grumman Systems Corp. Microchannel cooler for a single laser diode emitter based system
US9960463B2 (en) 2011-05-05 2018-05-01 Flagship Enterprise Center, Inc. Close-coupled dry battery system for hybrid and electric vehicles
US8804781B2 (en) * 2012-10-29 2014-08-12 Coherent, Inc. Macro channel water-cooled heat-sink for diode-laser bars
US8804782B2 (en) 2012-10-29 2014-08-12 Coherent, Inc. Macro-channel water-cooled heat-sink for diode-laser bars
JP2014146663A (ja) * 2013-01-28 2014-08-14 Fujitsu Ltd 冷却装置の製造方法、冷却装置及びこれを備えた電子部品パッケージ
CN103956649B (zh) * 2014-05-15 2017-01-25 西安炬光科技股份有限公司 一种具有防腐结构的液体制冷型半导体激光器
CN104051952B (zh) * 2014-07-04 2017-06-16 成都三鼎日新激光科技有限公司 一种内微通道冷却热沉
GB2518794B (en) * 2015-01-23 2016-01-13 Rofin Sinar Uk Ltd Laser beam amplification by homogenous pumping of an amplification medium
KR101655304B1 (ko) * 2015-04-08 2016-09-07 국방과학연구소 레이저 다이오드 바의 교차 배열 방식을 이용한 여기빔 균일화 장치
US20180254606A1 (en) 2015-06-02 2018-09-06 Lasertel, Inc. Liquid cooled laser bar arrays incorporating thermal expansion matched materials
CN106816804B (zh) * 2015-11-30 2020-10-09 中国科学院大连化学物理研究所 一种微通道金属泡沫碟状激光器晶体冷却装置
US11025031B2 (en) 2016-11-29 2021-06-01 Leonardo Electronics Us Inc. Dual junction fiber-coupled laser diode and related methods
US10454250B2 (en) 2017-05-22 2019-10-22 Lasertel Inc. Thermal contact for semiconductors and related methods
US11406004B2 (en) 2018-08-13 2022-08-02 Leonardo Electronics Us Inc. Use of metal-core printed circuit board (PCB) for generation of ultra-narrow, high-current pulse driver
US11056854B2 (en) 2018-08-14 2021-07-06 Leonardo Electronics Us Inc. Laser assembly and related methods
US11296481B2 (en) 2019-01-09 2022-04-05 Leonardo Electronics Us Inc. Divergence reshaping array
US11752571B1 (en) 2019-06-07 2023-09-12 Leonardo Electronics Us Inc. Coherent beam coupler
US11629917B2 (en) * 2019-07-23 2023-04-18 Dana Canada Corporation Three-layer heat exchanger with internal manifold for battery thermal management
CN111082310A (zh) * 2019-12-25 2020-04-28 苏州长光华芯光电技术有限公司 半导体激光器、半导体激光器制冷结构及其制造方法
CN111129943A (zh) * 2019-12-25 2020-05-08 苏州长光华芯光电技术有限公司 半导体激光器阵列、半导体激光器制冷装置及其制备方法
CN112435976B (zh) * 2020-11-06 2024-04-16 西安交通大学 基于仿生分形结构的超低流阻微通道散热器及其制造方法
CN114845517B (zh) * 2022-03-25 2023-10-24 中国电子科技集团公司第二十九研究所 一种多路液体均匀分流方法

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Also Published As

Publication number Publication date
US6865200B2 (en) 2005-03-08
EP1271723B1 (de) 2006-08-16
DE60213925T2 (de) 2006-12-07
EP1271723A3 (de) 2005-02-02
EP1271723A2 (de) 2003-01-02
JP2003008273A (ja) 2003-01-10
US20020195238A1 (en) 2002-12-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee