WO2004076952A1 - ヒートシンク、レーザモジュール、レーザ装置及びレーザ加工装置 - Google Patents
ヒートシンク、レーザモジュール、レーザ装置及びレーザ加工装置 Download PDFInfo
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- WO2004076952A1 WO2004076952A1 PCT/JP2004/001782 JP2004001782W WO2004076952A1 WO 2004076952 A1 WO2004076952 A1 WO 2004076952A1 JP 2004001782 W JP2004001782 W JP 2004001782W WO 2004076952 A1 WO2004076952 A1 WO 2004076952A1
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- Prior art keywords
- heat sink
- flow path
- heat
- laser
- refrigerant
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/09—Processes or apparatus for excitation, e.g. pumping
- H01S3/091—Processes or apparatus for excitation, e.g. pumping using optical pumping
- H01S3/094—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light
- H01S3/0941—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light of a laser diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02423—Liquid cooling, e.g. a liquid cools a mount of the laser
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
Definitions
- the present invention relates to a heat sink for cooling a heat generating body by flowing a refrigerant, a laser module, a laser device and a laser processing apparatus, and in particular, a heat sink suitable for cooling a laser diode, a laser module, a laser device and a laser cavity It relates to the device.
- a laser diode used as a light source for excitation or direct processing of an N d: YAG laser has a conversion efficiency from electricity to light of about 50%, and was used as a light source for the N d: YAG laser. In this case, heat equal to or more than the laser light output is generated.
- laser diodes have problems such as durability and conversion efficiency falling as temperature rises, so a heat sink with high aging performance is attached to suppress temperature rise. Also, recently, a high-power laser is required for welding or cutting of metal, and accordingly, the output of the laser diode is advanced, and the active region for generating the laser light is laterally offset. The formed laser diode etc. has been developed.
- the size of such a laser diode array is usually about 1 O mm in width, about 1.0 to 1.5 mm in length of the resonator, and about 100 to 150 m in thickness,
- the output is about 20 to 6 OW. Since the wavelength of the laser light output from this laser diode array changes with temperature, in order to generate light of a more uniform wavelength, the temperature in the lateral direction must be kept constant. It is also desirable to cool to lower temperatures to extend the life of the laser diode. Therefore, heat sinks are being studied to efficiently cool the high-power laser diode array to a uniform temperature.
- a heat sink for the laser diode array As a heat sink for the laser diode array, a type in which a refrigerant flows is conventionally used, for example, for example, a heat sink has been proposed in which two flow paths each having an independent inlet and outlet on the same plane (for example, Japanese Patent Laid-Open No. 8-1 394 7 8 See page 3, Figure 1)).
- This heat sink improves the heat conversion efficiency in this region and makes the temperature uniform by forming a bent portion in the flow passage in the lower region of the surface in contact with the laser diode array.
- the flow paths formed above and below are connected by a plurality of holes or microchannels formed in the lower region of the surface in contact with the laser diode array to form one flow path. Furthermore, it has a two-layer flow path which supplies refrigerant from the flow path located at the lower part and discharges the refrigerant from the flow path located at the upper part, and the flow path located at the lower part in the region in contact with the laser diode array.
- a heat sink having a structure in which a refrigerant is jetted out of the nozzle into a flow passage located at the upper part (for example, Japanese Patent Application Laid-Open No. 8-1 379 4 9
- the refrigerant injected from the inlet is divided into a plurality of flow paths and guided to the lower region of the surface in contact with the laser diode array at uniform temperature and flow velocity, and formed in that region
- a heat sink having a structure in which it is led to a plurality of channels formed in the heat sink of the upper layer through channels communicating in the vertical direction, and is led to the discharge port from the channel on the upper layer (for example, 1 0 2 0 9 5 3 1)).
- a method of forming a channel by chemical etching is also devised.
- a heat sink has also been proposed which is provided with fins for guiding the refrigerant injected from the inlet to the flow path connecting the upper and lower sides with equal pressure (for example, WO 00/101203). (See pages 5-7, 2A-2C). Furthermore, the problem of pressure loss and low flow velocity caused by laminating each heat sink A heat sink provided with an intermediate layer for solving the problem has also been proposed (see, for example, Japanese Patent Application Laid-Open No. 2 0 1-1 6 0 6 4 9 (Fig. 3-5, Fig. 1)).
- the conventional heat sink has the following problems.
- the pressure loss when the refrigerant passes through the flow path is large.
- the pressure loss of the refrigerant increases when the flow path connecting the flow paths of the two-layer structure is the microphone port channel, the micro slit, or the capillary tube array. If the pressure loss of the refrigerant is large, the pressure load applied to the flow path will be large, and the possibility of liquid leakage etc. will be high.
- high-performance pumps are required to pump refrigerant, which increases costs.
- An object of the present invention is to provide a heat sink, a laser module, a laser apparatus and a laser processing apparatus which are excellent in thermal efficiency and reliability and can be manufactured at low cost.
- a heat sink according to a first aspect of the present invention is a heat sink formed by stacking two heat dissipation plates, wherein one heat dissipation plate has a refrigerant flow formed of a recess or a groove formed on the overlapping surface with the other heat dissipation plate.
- one or a plurality of protrusions provided so as to be scattered in a specific region of the refrigerant flow path, and at least one of the one heat dissipation plate and the other heat dissipation plate And a pair of openings serving as an inlet and an outlet, and the projections disturb the flow of the refrigerant.
- turbulent flow occurs in the flow of the coolant flowing in the flow path due to the coolant contacting the projections.
- turbulence occurs in the flow of the refrigerant
- mixing of the refrigerant is performed by the vortex motion to promote the transfer of the heat quantity from the heat sink to the refrigerant, so the cooling efficiency is increased compared to the laminar flow.
- the heat sink of the present invention is composed of two heat radiation plates, and there are few joints, so it is possible to reduce the occurrence rate of refrigerant leakage etc. due to joint failure and further reduce the manufacturing cost. be able to.
- the specific area is provided at a position matching the area to which the heating element to be cooled is thermally connected.
- the protrusion has a smaller cross section in the upward direction from the bottom surface of the flow passage or in the downward direction from the upper surface of the flow passage. In the present invention, by making the cross section smaller as it goes to the upper surface or the bottom surface of the flow path, the refrigerant flowing in the flow path is more effectively stirred in the vertical direction, and the cooling efficiency is improved. It can be improved.
- a part of the outer edge of the cross section of the protrusion is formed by a curve.
- the shape of the cross section of the protrusion is circular, elliptical, or streamlined with respect to the flow of the solvent.
- the turbulent flow caused by the projections is greater than when the cross section is rectangular or polygonal. It includes suppressing pressure loss.
- the protrusion is in contact with the other heat sink.
- the protrusion by bringing the protrusion into contact with the other heat dissipation plate, it becomes possible to diffuse the heat to the two heat dissipation plates via the protrusion, and it is also possible to improve the stirring effect of the refrigerant. Cooling efficiency can be improved.
- the one heat dissipation plate has a pair of flow paths having a shape in which the refrigerant introduced from the introduction port is separated into the respective flow paths, passes through the specific region, and is then discharged from the discharge port.
- a separation member is provided in a specific area to prevent the refrigerant from merging.
- the separating member by providing the separating member, it is possible to prevent the refrigerant heated by the heat generating body from being mixed in the specific region and the heat conversion efficiency being lowered.
- the flow path has a first area in contact with the inlet, and a second area between the first area and the specific area, and the width of the second area is the second area. It is preferable that the width is smaller than 1.
- the flow velocity of the refrigerant flowing into the specific area can be accelerated by narrowing the width of the flow path in contact with the specific area upstream of the flow path, whereby the cooling efficiency can be achieved. Can be improved.
- at least a part of the inner surface of the flow path is formed by a curved surface. In the present invention, by forming the inner surface of the flow path by a curved surface, it is possible to suppress the turbulent flow that occurs outside the specific region, and to prevent the decrease in the flow velocity and the pressure loss.
- the refrigerant flow path having the same pattern as at least a part of the refrigerant flow path is also formed in the other heat dissipation plate to make the cross-sectional area of the flow path By increasing the size, the pressure loss in the flow path can be reduced to improve the cooling efficiency.
- the flow path is formed by a chemical etching method.
- the chemical etching method for example, by masking the heat sink and immersing in the etching liquid, it is possible to form a flow path of the same depth at one time. As a result, the inner surface of the flow path can be easily curved.
- the heat dissipation plate is made of copper or a copper alloy, and at least 70 mass on the surface of the flow path in contact with the refrigerant. It is preferable that an Eckeno ⁇ layer containing 0 or more nickel is formed. In the present invention, the corrosion of the heat sink can be prevented and the reliability can be improved by forming the eckel layer. Further, the nickel-containing layer can be formed by a plating method.
- the heat dissipation plate is made of copper or a copper alloy, and a copper oxide film having a thickness of at least 50 nm or more is formed on the surface of the flow path in contact with the refrigerant. To improve reliability.
- the copper oxide film may be formed by heating the heat sink in an atmosphere containing oxygen.
- the heating element is, for example, a laser diode.
- a laser module according to a second invention of the present application is characterized by comprising: the heat sink; a fixing jig fixed to the heat sink; and a laser diode fixed to one heat radiating plate of the heat sink. .
- the heat sink having a small number of joints, the incidence of refrigerant leakage is low, and the reliability is low. It is possible to manufacture a highly reliable laser module at low cost.
- the laser module includes one or more heat sinks, and a region of the heat sink where the flow path is not formed is provided with a through hole through which the one or more heat sinks extend. It is preferable that the heat sink be fixed to the fixing jig by screwing a screw through the hole into the fixing jig.
- a flow path for supplying a refrigerant to the heat sink is formed in the fixing jig.
- a laser apparatus comprising: the laser module; and a laser diode which is excited by a laser beam oscillated by the laser module to oscillate a laser beam.
- the laser module by using the laser module, it is possible to manufacture a highly reliable laser device at low cost.
- a laser beam machine according to a fourth invention of the present application is characterized by including the laser module. In the present invention, by using the laser module, a highly reliable laser processing machine can be manufactured.
- a laser beam machine is characterized by including the laser device.
- the laser diode can be cooled stably for a long period of time, so that the running cost can be reduced.
- FIG. 1 (a) is a plan view showing a first heat sink of the heat sink according to the first embodiment of the present invention
- FIG. 1 (b) is a plan view showing a second heat sink.
- FIG. 2 is a perspective view showing a heat sink according to the first embodiment of the present invention.
- FIG. 3 is a cross-sectional view taken along the line A-A shown in FIG.
- FIG. 4 is formed on the first heat sink of the heat sink according to the first embodiment of the present invention.
- FIG. 6 is a cross-sectional view showing a projection.
- FIGS. 5 (a) to 5 (c) are cross-sectional views showing the shapes of the projections formed on the first heat sink of the heat sink according to the first embodiment of the present invention, and are taken along the line B--B shown in FIG. Corresponds to the cross-sectional view of the
- FIG. 6 is a plan view showing a first modification of the flow path in the heat sink of the present invention.
- FIG. 7 is a plan view showing a second modification of the flow path in the heat sink of the present invention.
- FIG. 8 is a plan view showing a third modification of the flow path in the heat sink of the present invention.
- FIG. 9 is a plan view showing a fourth modification of the flow path in the heat sink of the present invention.
- FIG. 10 (a) is a plan view showing a first heat sink of the heat sink according to the second embodiment of the present invention, and
- FIG. 10 (b) is a plan view showing a second heat sink.
- FIG. 11 is a perspective view showing a heat sink according to a second embodiment of the present invention.
- FIG. 12 (a) is a plan view showing a first heat sink of the heat sink according to the third embodiment of the present invention, and
- FIG. 12 (b) is a plan view showing a second heat sink.
- FIG. 13 is a perspective view showing a heat sink according to a third embodiment of the present invention.
- FIG. 14 is a perspective view showing the configuration in the case where the heat sinks according to the third embodiment of the present invention are vertically stacked.
- FIG. 15 is a perspective view showing a structure in the case where five stages of heat sinks according to the third embodiment of the present invention are stacked.
- FIG. 16 is a cross-sectional view showing a laser module according to a fourth embodiment of the present invention.
- FIG. 17 is a schematic view showing a configuration of a laser device according to a fifth embodiment of the present invention.
- FIG. 18 is a schematic view showing a configuration of a laser processing apparatus according to a sixth embodiment of the present invention.
- FIG. 19 is a cross-sectional view showing a protrusion formed on the heat sink of the first embodiment of the present invention.
- FIG. 20 is a perspective view showing the configuration of a conventional heat sink proposed in Patent Document 7.
- FIG. 21 is a perspective view showing the configuration of a conventional heat sink proposed in Patent Document 8.
- Fig. 2 2 (a) is a cross-sectional view showing a conventional heat sink proposed in Patent Document 4, and Fig. 2 2 (b) is a cross-sectional view along line A-A.
- FIG. 23 is a plan view showing a second heat sink of the heat sink according to the first embodiment in which a flow path is formed.
- FIG. 1 (a) is a plan view showing a first heat dissipation plate of the heat sink according to the first embodiment of the present invention
- FIG. 1 (b) is a plan view showing a second heat dissipation plate
- FIG. 2 is a perspective view showing a heat sink according to a first embodiment of the present invention
- FIG. 3 is a cross-sectional view taken along the line A-A shown in FIG. 1 (a) and FIG.
- FIG. 1 (a) is a plan view showing a first heat dissipation plate of the heat sink according to the first embodiment of the present invention
- FIG. 3 is a cross-sectional view taken along the line A-A shown in FIG. 1 (a) and FIG.
- FIG. 1 (a) is a plan view showing a first heat dissipation plate of the heat sink according to the first embodiment of the present invention
- FIG. 3 is a cross-sectional view taken along the line A-A shown in FIG. 1 (a) and FIG.
- the heat sink according to the first embodiment of the present invention includes: a first heat radiation plate 1 in which a flow path 2 in which a refrigerant flows is formed; The second heat sink 6 is joined to the heat sink 1 and the second heat sink 6 is formed. The second heat radiation plate 6 is flat and no flow passage is formed.
- first heat dissipation plate 1 two openings 3a and 3b serving as an inlet for injecting a refrigerant and a discharge for discharging a solvent are arranged in the longitudinal direction of the first heat dissipation plate 1 It is formed. Further, in the first heat radiation plate 1, a pair of flow paths 2 are formed from the opening 3 b toward the opening 3 b. The flow path 2 is separated from the opening 3 b in the direction of the long side of the first heat sink 1, extends along the long side of the first heat sink 1 in the direction of the opening 3 b, and opens near the short side. It is folded in the direction of the part 3 b and reaches the opening 3 b.
- This flow path 2 is As shown in FIG. 3, it has a groove shape whose cross section is semicircular.
- the cross section in the direction perpendicular to the second heat dissipation plate 6 and the first heat dissipation plate 1 in the projection 4 is from the first heat dissipation plate 1 side to the second heat dissipation plate 6 side as shown in FIG. It is preferable that the shape is in the form of a diverging end.
- the cross section in the direction parallel to the second heat dissipation plate 6 and the first heat dissipation plate 1 in the protrusion 4 has, for example, a circular shape (see FIG.
- first heat dissipation plate 1 is provided with a separate rod 5 extending in the longitudinal direction of the first heat dissipation plate 1 from the central portion of the short side on the opening 3 b side of the first heat dissipation plate 1. ing.
- a pattern having the same shape as that of the flow path 2 formed in the first heat sink 1 may be formed in the second heat sink 6 as shown in FIG.
- the flow path 2, the protrusion 4, the separate rod 5 and the like are formed in a plate-like metal material having high thermal conductivity such as copper. It is referred to as the first heat sink 1.
- a method such as performing isotropic chemical etching after masking a copper plate in the shape of the flow path 2, the protrusion 4 and the separation rod 5 can be applied.
- the flat second heat dissipation plate 6 shown in FIG. 1 (b) is joined to the top of the first heat dissipation plate 1 shown in FIG. 1 (a), and the heat sink shown in FIG. 2 is assembled.
- the heat generating body 8 such as a laser diode array is joined to the position of the heat generating body joint 7 of the second heat sink 6.
- the heat-generating-member joint 7 is aligned with the area where the protrusions 4 are formed on the first heat sink 1.
- the opening 3a is used as an inlet
- the opening 3b is used as an outlet
- a coolant such as water is injected from the opening 3a.
- the injected refrigerant is divided into left and right It flows into the flow path 2 and the flow velocity is accelerated at the portion where the flow path immediately before the protrusion 4 is narrowed.
- the separate rod 5 also serves to rectify the refrigerant flowing through the left and right flow paths.
- the refrigerant passing through the region in which the projections 4 are formed is rectified by the separate rod 5 and discharged from the opening 3 b following the flow path 2.
- the opening 3a is the introduction port
- the opening 3b is the discharge port, but the invention is not limited to this.
- the opening 3b is the introduction port, and the opening 3a is the discharge port. It may be an exit.
- the flow path 2 is formed separately from the opening 3 b to the left and right, and the flow paths on the left and right sides are the thermal connection area with the heating element 8.
- a separate bar 5 is provided which prevents merging in the lower region.
- a plurality of protrusions 4 are formed in the flow path corresponding to the lower region of the heat generating body bonding region 7, and the cross sectional shape of the protrusions 4 is a diverging shape.
- the vertical stirring effect of the refrigerant flowing in the flow path can be promoted, and the cooling performance can be improved. Since the tip of the protruding projection structure is in contact with the wall surface of the flow path, the reduction of the flow velocity due to the reduction of the flow path cross-sectional area is prevented, and the stirring effect in the vertical direction of the flow path is further promoted to cool It can enhance the effect.
- the flow velocity of the refrigerant can be accelerated by reducing the cross-sectional area of the flow passage following the hole into which the refrigerant is injected, and then flowing the refrigerant into the region where the projections are formed. Yes, cooling efficiency is improved.
- the flow path 2 formed in the first heat dissipation plate 1 has the above-described configuration, whereby the first heat dissipation plate 1 in which the flow path 2 is formed and the first flat plate Since the heat sink can be manufactured simply by bonding the two heat sinks of the second heat sink 6, the bonding process can be reduced compared to the conventional heat sink manufacturing process in which the flow path is formed across multiple layers, The manufacturing cost can be reduced.
- there are fewer joints so the possibility of water leakage due to joint failure can be reduced, and reliability is improved.
- the turbulent flow of the refrigerant that is not related to the cooling of the heating element increases the pressure loss and reduces the flow velocity, so it is necessary to suppress it as much as possible. Therefore, in the heat sink of the present embodiment, the cross-sectional structure of the flow path is not rectangular but is surrounded by curves. As a result, it is possible to suppress the turbulent flow at the bending portion. This effect is obtained even if only the flow path is surrounded by a curve. Furthermore, by forming the flow path by metal isotropic etching, when forming the heat sink, it is possible to form a U-shape that is partially curved. By joining the flat heat sink 6 to the heat sink 1, a flow path 2 having a semicircular cross section can be formed.
- the projections 4 and the flow paths 2 having a shape in which the cross sections in the vertical direction of the heat sink 1 and the heat sink 6 are expanded in a short time and inexpensively.
- the protrusion 4 in such a shape, the heat sink 1 and the heat sink 6 can be joined without etching the tip thereof.
- the heat sink of the present embodiment is also effective for heating elements other than laser diodes such as electronic devices using silicon or compound semiconductors, for example.
- the refrigerant used in the heat sink of the present embodiment one other than water may be used, and the same applies to the embodiments described below.
- the position, direction, and number of the protrusions 4 in the present embodiment are not limited to the configuration shown in FIG. 1 (a), and may be appropriately selected according to the shape of the flow path 2, the manufacturing method, and the required characteristics.
- the shape shown below can also be used.
- 6 to 9 are plan views showing modifications of the flow passage shape in the heat sink of the present embodiment. In the first modified example shown in FIG. 6, the width of the flow path in the region where the protrusions 4 are formed is increased, and two rows of five protrusions 4 are formed in one row. With such a flow path shape, the heating element with a large area can be cooled efficiently.
- the projections 4 are disposed on the long side of the heat sink.
- a projection 23 for increasing the flow velocity is provided separately from the projection 4 for promoting turbulent flow.
- the flow path 2 in this modification is completely separated by the separator rod 5, and the refrigerant injected from the introduction port is discharged from the discharge port without merging in the flow path 2.
- the protrusions 4 are formed in parallel in the longitudinal direction of the heat dissipation plate in each of the left and right flow paths.
- a total of two heating elements can be joined to each other on the opposite long side of the heat sink.
- the ability to cool one heating element is half that when one is joined to the short side. This is effective when it is desired to output the light of the laser diode in the left and right direction.
- a channel 2 is formed in a U shape, an opening 3a is formed at one end, and an opening 3b is formed at the other end. It is.
- the structure is simpler than that in which two flow paths are formed on the left and right, so the same effect can be obtained regardless of which of the opening 3 a and the opening 3 b is the inlet.
- FIG. 10 (a) is a plan view showing a first heat dissipating plate of a heat sink according to a second embodiment of the present invention
- (b) is a plan view showing a second heat dissipating plate
- FIG. 11 is an illustration of the present invention. It is a perspective view showing a 2nd embodiment.
- the heat sink according to the second embodiment of the present invention comprises the heat sink 1 having the flow path 2 similar to that of the first embodiment, and the flat heat sink 6.
- the protrusion 4 and the separate rod 5 are the same as in the first embodiment. It is formed.
- a flow passage is formed in the heat sink 1 disposed at the top, and the cross section of the protrusion in the flow passage is shaped so as to become smaller from the top to the bottom. .
- a through hole 17 is formed in which a screw for fixing the heat sink is inserted into a base for supplying the refrigerant.
- an opening 3 a and an opening 3 b for injecting and discharging the refrigerant are formed in the second heat sink 6.
- a plated layer having a thickness of about 5 / m is formed on the surfaces of the first heat sink 1 and the second heat sink 6.
- the plating film is formed on all surfaces of the heat sink including the flow path 2, the protrusion 4, the separate rod 5 and the like. Furthermore, as shown in FIG. 11, in the heat sink according to the present embodiment, the first heat radiation plate is joined to the upper portion of the second heat radiation plate 6, and the heat source joint 7 is formed on the first heat radiation plate 1. It is provided.
- a plating film is provided on the surface of the flow path 2 to prevent the heat sink from being corroded by the plating film.
- the material of the plating film for example, when the material of the heat sink is copper or a copper alloy, it is preferably nickel, and in particular, the Nickeno content in the plating film is 70% by mass or more. Is preferable. If materials other than Nikkoru are used for the plating film, corrosion may be accelerated due to the effect of galvanic current with copper.
- the difference in ionization tendency between copper and nickel is small, there is no effect of galvanic current. Furthermore, because the nickel is hard, it has excellent durability.
- the heat sink is used as a part of the electrode of the laser module, a large current flows in the entire heat sink. In this case also, the dissimilar metal world The presence of a surface causes corrosion, so it is preferable to form a plating film with a metal closer to the material of the heat sink, with a tendency to ionize, for example, when the material of the heat sink is copper or copper alloy, the material of the plating film is nickel Is preferred.
- a copper oxide film may be formed. Oxidation of copper is a kind of corrosion, but if an oxide is formed on the surface, it is possible to suppress further oxidation inside in water, so corrosion can be prevented.
- FIG. 12 (a) is a plan view showing a first heat sink of the heat sink according to the third embodiment of the present invention
- FIG. 12 (b) is a plan view showing a second heat sink
- FIG. 13 is a perspective view showing a third embodiment of the present invention.
- the heat sink according to the third embodiment of the present invention has the flow path 2, the protrusion 4 and the separator 4 as in the second embodiment.
- the first heat dissipation plate 1 having the rod 5 and the second heat dissipation plate 6 in the form of a flat plate is provided, and the central portion of the first heat dissipation plate 1 and the second heat dissipation plate 6 is A through hole 17 is formed for fixing to a stand for supplying the coolant to the heat sink. Further, a nickel plating layer is formed on the inner surface of the flow path 2. Furthermore, in the heat sink of the present embodiment, the opening 3 a and the opening 3 b for injecting and discharging the refrigerant are formed in both the heat sink 1 and the heat sink 6. These openings 3a and 3b become through holes when the first heat dissipating plate 1 and the second heat dissipating plate 6 are joined to form a heat sink as shown in FIG.
- FIG. 14 is a perspective view showing the configuration in the case where the heat sinks of the present embodiment are vertically stacked
- FIG. 15 shows the structure in the case where five heat sinks according to the third embodiment of the present invention are stacked. It is a perspective view.
- the heat sink 20 shown in FIG. 11 is disposed on the top layer
- the heat sink 18 shown in FIG. 13 is disposed on the second and subsequent layers. At this time, a flow passage of the refrigerant and a through hole for fixing are formed between the heat sinks. Place the server 1-9.
- Fix to The refrigerant supplied from the jig 2 2 is supplied to the respective heat sinks via one of the opening 3 a or the opening 3 b which is continuous in the vertical direction, and then the opening 3 a or the opening 3 b It is discharged through the other and discharged from jig 2 2.
- the openings 3 a and the openings 3 b are formed in both the first heat dissipation plate 1 and the second heat dissipation plate 6, and a plurality of heat sinks are formed by penetrating the heat sink. It is possible to make the coolant flow through multiple heat sinks.
- Such a stack type heat sink is used to connect a laser diode and fix it on a table having a flow path for supplying a refrigerant, flow the refrigerant into these heat sinks, and cause the laser diode to oscillate.
- the laser diode can be oscillated by connecting the electrode of the laser diode to the heat sink and using the heat sink as a part of the electrode to flow current.
- the heat sink of the present embodiment has high cooling performance, and there is very little concern that the refrigerant leaks because there are few joints, so it is possible to provide a highly reliable laser module at low cost.
- the heat sink of the present embodiment is formed of two metal plates each, and its thickness can be reduced to 1.4 mm in the case of the cooling performance of 0.4 ° C./W.
- the same cooling performance can be obtained, which is thinner than a heat sink having a conventional two-stage flow path. Therefore, when producing a stacked laser module in which the heat sinks to which the laser diode array is bonded are stacked in the longitudinal direction, the height in the longitudinal direction can be made lower than in the case where a conventional heat sink is used. It becomes easy to guide the light output from each laser diode array to one optical fiber.
- FIG. 16 is a cross-sectional view showing a laser module using the heat sink of the second embodiment.
- a laser diode 31 is joined to the upper surface of a heat sink 30 having the same structure as that of the second embodiment.
- Upper electrode 33 is connected.
- an insulating spacer 32 having a thickness substantially the same as that of the laser diode 31 is disposed.
- the heat sink 30 is fixed to the refrigerant injection / discharge stand 34, and the heat sink 30 is cooled via the flow path 2 provided in the refrigerant injection / discharge stand 34. Flow in the medium.
- the heat sink 30 can be used as a lower electrode by making the heat sink constituting the heat sink 30 a conductive material, and the upper electrode and the lower electrode can be used.
- the laser can be oscillated by passing a current through the
- the laser module according to this embodiment uses the heat sink according to the second embodiment, so there is no concern about water leakage, and since the Nikkenore layer is provided on the flow path surface, the rate of occurrence of corrosion is low.
- the cooling performance of the heat sink does not deteriorate even if it is subjected to a running test for more than 1,000,000 hours, which is the lifetime of the laser diode.
- maintenance costs can be significantly reduced because the heat sink failure eliminates the need to replace the module.
- FIG. 17 is a schematic view showing a configuration of a laser device according to a fifth embodiment of the present invention.
- the laser apparatus according to the fifth embodiment of the present invention uses a six-row laser module 35 in which six laser modules according to the fifth embodiment are arranged as an excitation light source of N d: Y AG laser rod 36
- the Nd: YAG laser rod 36 is disposed between the pair of laser modules 35.
- 37 and an output mirror 39 are disposed in front of and behind the Nd: YAG laser rod 36.
- the Nd: YAG laser rod may be excited from three or more directions.
- laser light 39 is oscillated from the laser module 35.
- the laser light 39 is absorbed by the Nd: YAG laser port 36, and the light emitted from the Nd: YAG laser port 39 is resonated by the rear mirror 37 and the output mirror 38, d: YAG laser light 40 is generated.
- the laser device uses the laser module using the heat sink according to the second embodiment as an excitation light source, so that stable laser light can be obtained over a long period of time. Can be reduced.
- FIG. 18 is a schematic view showing a configuration of a laser processing machine using a laser device equipped with a laser module using the heat sink according to the first embodiment.
- the light output from the laser device 41 is once coupled to the fiber 42 and then condensed by the lens 43. Welding and cutting are performed by irradiating the workpiece 4 4.
- the laser beam machine according to this embodiment can reduce the cost of the laser device by using the heat sink according to the first embodiment, and the failure probability of the device caused by the heat sink can be significantly reduced. Running costs and maintenance costs can be greatly reduced.
- the structure is the same as that of the first embodiment shown in FIGS. 1 and 2 and has a length of 25 mm, a width of 11 mm and a thickness of 2.5 mm.
- a heat sink was made.
- a copper plate is used for the heat sink, and the copper plate is A flow path with a depth of 0.5 mm was formed by pinching to form a first heat sink.
- the array length is 1 O mm
- the resonator length is 1.3 mm
- the thickness is 130 ⁇
- the heat-generating body joint 7 of this heat sink is 5 0 ⁇ ⁇
- a laser diode array that outputs light of 8 0 8 11 111 was joined, and cooling water at 25 ° C.
- the inlet was an opening 3a
- the outlet was an opening 3b.
- the thermal resistance was 0.5.degree. C./W
- the variation of the wavelength outputted from each light emitting point of the laser diode array was within ⁇ 1 nm.
- the temperature of the bonded laser diode array was cooled to within ⁇ 3 ° C, and performance equivalent to or better than that of the heat sink of the conventional laminated structure was obtained.
- the difference in cooling performance was within 5%.
- the heat sink of the present embodiment can be manufactured by etching a single copper plate to form a first heat sink, which can be manufactured by bonding it to the copper plate. The cost can be reduced to less than half that of the conventional heat sink.
- the same experiment was conducted by changing the size of the heat sink in the range of 15 to 25 mm in length, 10 to 12 mm in width, and 1 to 3 mm in thickness.
- the cooling efficiency in the case of changing the length was consistent within ⁇ 10%.
- the thickness is 3 mm, a thermal resistance of 0.20 ° C./W was obtained.
- the value of this thermal resistance increased as the thickness of the heat sink copper plate decreased, and was 0.3 ° C./W for a heat sink with a thickness of 1 mm.
- a heat sink was manufactured in which the shape, position and orientation of the protrusion 4 were changed, and its cooling performance was examined.
- the heat sink of this example was the same as the heat sink of the first embodiment shown in FIG. 1 and FIG. 2 except for the shape of the protrusion 4.
- the cross section in the vertical direction with respect to the first heat dissipation plate 1 and the second heat dissipation plate 6 is flared (see FIG. 4) as in the first embodiment (see FIG. 19 (a)).
- a protrusion not in contact with the flat plate see Fig. 1 9 (b)
- the resulting heat sink was fabricated and its cooling performance was examined.
- the heat sink having the diverging columnar projections shown in FIG. 4 has a cooling performance 10% or more higher than the heat sink having projections of other shapes.
- the shape of the cross section in the direction parallel to the second heat sink 1 and the first heat sink 2 is circular as shown in FIG. 5 (a), elliptical as shown in FIG. 5 (b), FIG.
- a copper plate is used as a material of the heat sink, and the first embodiment has the same structure, and a nickel plating layer of thickness 5 is formed on the surface of the channel 2.
- Heatsink, Heat sink with a 5 m thick plated layer formed on the surface of the flow channel 2, 5 ⁇ m thick with a nickel plating layer and 1 ⁇ m thick with a gold plated layer A heat sink having a channel surface of copper was produced without forming a heat sink and a plating layer. As a corrosion resistance test, these heat sinks should have a salt solution of 25 ° C. It was circulated for 50 hours and then the inside was observed.
- the corrosion area of the heat sink where only the nickel plating layer is formed is (1 Z 5)
- the nickel plating layer of the heat sink where the surface of the flow path 2 is a copper heat sink (1/5)
- a gold plating layer is formed.
- On top of the heat sink was a (1/2) heat sink with a plated layer.
- FIG. 20 is a perspective view showing the configuration of the conventional heat sink proposed in Patent Document 7.
- This heat sink is formed of a total of three heat sinks, two heat sinks 101 forming a flow path, and one heat sink 125 forming an intermediate layer flow path.
- the refrigerant injected from the opening 103 into the flow channel 102 is dispersed by the fins 124 for rectifying the refrigerant, and then coupled to the flow channel in the longitudinal direction of the intermediate layer, and the flow is rectified again by the fins It is discharged from the opening after being done.
- the heat sink with this structure has a large pressure loss due to the narrow flow path of the middle layer, and the flow rate decreases due to the widening of the flow path. Furthermore, since it is necessary to form a flow path in all three heat sinks, the manufacturing cost is increased. Therefore, the heat sink of the present invention is superior in cooling performance and cost and reliability because the pressure loss is small and the flow velocity is high.
- FIG. 21 is a perspective view showing the structure of a conventional heat sink proposed in Patent Document 8.
- This heat sink forms a flow passage that penetrates the flat plate heat sink 101 with an opening one by one up and down as an intermediate layer.
- the heat sink 1 2 6 is formed of a total of 5 heat sinks of 3 sheets.
- the refrigerant injected into the flow path 102 from the opening 103 flows in the flow path formed between the heat sinks of the intermediate layer up and down, left and right, and then the opening 1 on the opposite side to the injection side 0 3 Force is discharged.
- This heat sink is expensive to manufacture because it needs to use five heat sinks with through holes, and there are many bonding interfaces between the heat sinks, so there are problems with reliability such as liquid leakage.
- this heat sink was superior in cost, reliability and cooling performance.
- FIG. 2 (a) is a cross-sectional view showing the structure of a conventional heat sink proposed in Patent Document 5, and (b) is a plan view thereof.
- This heat sink has two bends facing each other in a region aligned with two flow paths 102 having independent inlets and discharges and a heating element joint 107 for joining the heating elements 108.
- the flow path 1 2 7 is formed.
- the refrigerant injected from the inlet is discharged from the outlet after passing through the bends formed in the respective flow paths.
- this heat sink has a simple structure, the pressure loss at the bend is large, and the refrigerant needs to be injected and discharged separately to the two flow paths.
- the structure of the stand becomes complicated. Therefore, the heat sink of the present invention had a smaller pressure loss and was superior in cooling efficiency.
- the present invention by providing the projections in the flow path formed in the heat sink, turbulence is generated in the refrigerant flowing in the flow path, and mixing by the vortex movement of the refrigerant is performed.
- the transfer efficiency of the heat quantity from the heat sink to the refrigerant is improved to increase the cooling efficiency.
- the cooling efficiency is improved by stirring the refrigerant in the vertical direction. .
- the heat sink can be configured by the heat sink and the flat heat sink. As a result, the number of joints in the heat sink is reduced, thereby improving the reliability and further reducing the manufacturing cost.
- the present invention is useful as a heat sink to efficiently cool high power lasers.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Semiconductor Lasers (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE602004024042T DE602004024042D1 (de) | 2003-02-27 | 2004-02-18 | Wärmeableiter, lasermodul, laser-vorrichtung und laser-verarbeitungsvorrichtung |
US10/547,071 US20060215715A1 (en) | 2003-02-27 | 2004-02-18 | Heat sink, laser module, laser device, and laser-processing device |
EP04712166A EP1605220B1 (en) | 2003-02-27 | 2004-02-18 | Heat sunk, laser module, laser device, and laser-processing device |
JP2005502838A JP4326525B2 (ja) | 2003-02-27 | 2004-02-18 | ヒートシンク、レーザモジュール、レーザ装置及びレーザ加工装置 |
Applications Claiming Priority (2)
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JP2003-052039 | 2003-02-27 | ||
JP2003052039 | 2003-02-27 |
Publications (1)
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WO2004076952A1 true WO2004076952A1 (ja) | 2004-09-10 |
Family
ID=32923386
Family Applications (1)
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PCT/JP2004/001782 WO2004076952A1 (ja) | 2003-02-27 | 2004-02-18 | ヒートシンク、レーザモジュール、レーザ装置及びレーザ加工装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20060215715A1 (ja) |
EP (1) | EP1605220B1 (ja) |
JP (1) | JP4326525B2 (ja) |
DE (1) | DE602004024042D1 (ja) |
WO (1) | WO2004076952A1 (ja) |
Cited By (2)
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JP2014036193A (ja) * | 2012-08-10 | 2014-02-24 | Uacj Corp | 冷却プレートおよび冷却装置 |
JP2019067981A (ja) * | 2017-10-03 | 2019-04-25 | 浜松ホトニクス株式会社 | ヒートシンク |
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JP2005268445A (ja) * | 2004-03-17 | 2005-09-29 | Hamamatsu Photonics Kk | 半導体レーザ装置 |
JP2008040003A (ja) * | 2006-08-03 | 2008-02-21 | Fuji Xerox Co Ltd | フレキシブル光導波路フィルム、光送受信モジュール、マルチチャンネル光送受信モジュール及びフレキシブル光導波路フィルムの製造方法 |
JP2008300596A (ja) * | 2007-05-31 | 2008-12-11 | Sony Corp | ヒートシンクおよび半導体レーザ装置 |
ATE498929T1 (de) * | 2008-09-01 | 2011-03-15 | Iie Ges Fuer Innovative Industrieelektronik Mbh | Laserdioden-anordnung |
DE102008051081B4 (de) * | 2008-10-09 | 2012-09-27 | Dirk Lorenzen | Wärmeableitmodul und Anordnung mit einem solchen Wärmeableitmodul |
TW201124068A (en) * | 2009-12-29 | 2011-07-01 | Ying-Tong Chen | Heat dissipating unit having antioxidant nano-film and its method of depositing antioxidant nano-film. |
JP5765759B2 (ja) | 2010-03-29 | 2015-08-19 | ギガフォトン株式会社 | 極端紫外光生成装置および方法 |
US20110232882A1 (en) * | 2010-03-29 | 2011-09-29 | Zaffetti Mark A | Compact cold plate configuration utilizing ramped closure bars |
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WO2014147033A1 (de) * | 2013-03-18 | 2014-09-25 | Behr Gmbh & Co. Kg | Schichtwärmeübertragungseinrichtung und verfahren zur herstellung einer schichtwärmeübertragungseinrichtung |
US9008137B1 (en) * | 2014-04-01 | 2015-04-14 | Science Research Laboratory, Inc. | Method and apparatus for compact and efficient introduction of high radiant power into an optical fiber |
CN105305226A (zh) * | 2015-12-06 | 2016-02-03 | 北京工业大学 | 一种回水层设有交错排列倾斜柱状扰流脊的微通道热沉 |
CN109273981B (zh) * | 2018-10-18 | 2020-08-18 | 西安炬光科技股份有限公司 | 一种用于半导体激光器的散热装置及激光器模块 |
CN111326949B (zh) * | 2018-12-15 | 2023-04-11 | 深圳市中光工业技术研究院 | 激光器芯片的制造方法及激光器芯片 |
US20200381894A1 (en) * | 2019-05-31 | 2020-12-03 | Trumpf Photonics, Inc. | Uniform Cooling of Laser Diode |
JP2023099244A (ja) * | 2020-06-04 | 2023-07-12 | パナソニックIpマネジメント株式会社 | レーザモジュール |
WO2022038998A1 (ja) * | 2020-08-19 | 2022-02-24 | パナソニックIpマネジメント株式会社 | レーザモジュール |
CN113054527A (zh) * | 2021-03-16 | 2021-06-29 | 北京工业大学 | 一种高功率半导体激光器的散热装置 |
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Also Published As
Publication number | Publication date |
---|---|
US20060215715A1 (en) | 2006-09-28 |
JPWO2004076952A1 (ja) | 2006-06-08 |
EP1605220B1 (en) | 2009-11-11 |
DE602004024042D1 (de) | 2009-12-24 |
JP4326525B2 (ja) | 2009-09-09 |
EP1605220A4 (en) | 2009-01-07 |
EP1605220A1 (en) | 2005-12-14 |
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