ITTO20020416A0 - Struttura di contenimento e dissipazione termica per apparecchiature elettroniche. - Google Patents

Struttura di contenimento e dissipazione termica per apparecchiature elettroniche.

Info

Publication number
ITTO20020416A0
ITTO20020416A0 IT2002TO000416A ITTO20020416A ITTO20020416A0 IT TO20020416 A0 ITTO20020416 A0 IT TO20020416A0 IT 2002TO000416 A IT2002TO000416 A IT 2002TO000416A IT TO20020416 A ITTO20020416 A IT TO20020416A IT TO20020416 A0 ITTO20020416 A0 IT TO20020416A0
Authority
IT
Italy
Prior art keywords
electronic equipment
dissipation structure
thermal containment
containment
thermal
Prior art date
Application number
IT2002TO000416A
Other languages
English (en)
Inventor
Fabrizio Boer
Mario Biserni
Original Assignee
Negesat Di Boer Fabrizio E C S
Laben Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Negesat Di Boer Fabrizio E C S, Laben Spa filed Critical Negesat Di Boer Fabrizio E C S
Priority to IT2002TO000416A priority Critical patent/ITTO20020416A1/it
Publication of ITTO20020416A0 publication Critical patent/ITTO20020416A0/it
Priority to PCT/IB2003/001873 priority patent/WO2003098987A1/en
Priority to US10/512,854 priority patent/US7099157B2/en
Priority to AU2003223066A priority patent/AU2003223066A1/en
Priority to EP03719037A priority patent/EP1504637B1/en
Priority to CNB038140055A priority patent/CN100431398C/zh
Priority to DE60302785T priority patent/DE60302785T2/de
Priority to AT03719037T priority patent/ATE341926T1/de
Publication of ITTO20020416A1 publication Critical patent/ITTO20020416A1/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20463—Filling compound, e.g. potted resin

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cable Accessories (AREA)
IT2002TO000416A 2002-05-16 2002-05-16 Struttura di contenimento e dissipazione termica per apparecchiature elettroniche. ITTO20020416A1 (it)

Priority Applications (8)

Application Number Priority Date Filing Date Title
IT2002TO000416A ITTO20020416A1 (it) 2002-05-16 2002-05-16 Struttura di contenimento e dissipazione termica per apparecchiature elettroniche.
PCT/IB2003/001873 WO2003098987A1 (en) 2002-05-16 2003-05-07 Retaining and heat dissipating structure for electronic equipment
US10/512,854 US7099157B2 (en) 2002-05-16 2003-05-07 Retaining and heat dissipating structure for electronic equipment
AU2003223066A AU2003223066A1 (en) 2002-05-16 2003-05-07 Retaining and heat dissipating structure for electronic equipment
EP03719037A EP1504637B1 (en) 2002-05-16 2003-05-07 Retaining and heat dissipating structure for electronic equipment
CNB038140055A CN100431398C (zh) 2002-05-16 2003-05-07 电子设备的保持和散热结构
DE60302785T DE60302785T2 (de) 2002-05-16 2003-05-07 Wärmeableitende haltestruktur für elektronisches gerät
AT03719037T ATE341926T1 (de) 2002-05-16 2003-05-07 Wärmeableitende haltestruktur für elektronisches gerät

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT2002TO000416A ITTO20020416A1 (it) 2002-05-16 2002-05-16 Struttura di contenimento e dissipazione termica per apparecchiature elettroniche.

Publications (2)

Publication Number Publication Date
ITTO20020416A0 true ITTO20020416A0 (it) 2002-05-16
ITTO20020416A1 ITTO20020416A1 (it) 2003-11-17

Family

ID=27639084

Family Applications (1)

Application Number Title Priority Date Filing Date
IT2002TO000416A ITTO20020416A1 (it) 2002-05-16 2002-05-16 Struttura di contenimento e dissipazione termica per apparecchiature elettroniche.

Country Status (8)

Country Link
US (1) US7099157B2 (it)
EP (1) EP1504637B1 (it)
CN (1) CN100431398C (it)
AT (1) ATE341926T1 (it)
AU (1) AU2003223066A1 (it)
DE (1) DE60302785T2 (it)
IT (1) ITTO20020416A1 (it)
WO (1) WO2003098987A1 (it)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7843689B2 (en) * 2005-04-22 2010-11-30 Robby Jay Moore Fire resistant and water resistant enclosure for operable computer digital data storage device
KR100677620B1 (ko) * 2005-11-22 2007-02-02 삼성전자주식회사 전자기기의 냉각 방법 및 냉각 효율이 향상된 전자기기
CN101018472A (zh) * 2007-02-18 2007-08-15 华为技术有限公司 一种电子设备及其装配方法
US8360390B2 (en) * 2009-01-13 2013-01-29 Enphase Energy, Inc. Method and apparatus for potting an electronic device
US8419385B2 (en) * 2009-06-15 2013-04-16 Sunonwealth Electric Machine Industry Co., Ltd. Heat-dissipating fan
JP2011176096A (ja) * 2010-02-24 2011-09-08 Mitsumi Electric Co Ltd 電子機器
DE102010016288B4 (de) * 2010-04-01 2011-12-15 Jena-Optronik Gmbh Elektronische Baueinheit und Weltraumfahrzeug damit
CN102223781A (zh) * 2010-04-16 2011-10-19 华广光电股份有限公司 积层式复合导散热构造
EP3252810B1 (en) * 2015-01-29 2020-01-08 Kyocera Corporation Circuit board and electronic device
EP3565395B1 (en) * 2016-12-28 2022-03-16 Mitsubishi Electric Corporation Power supply device
CN109693812A (zh) * 2017-10-23 2019-04-30 中国科学院空间应用工程与技术中心 一种用于为多个空间实验设备提供实验服务的系统及方法
EP3817529B1 (en) 2018-06-27 2023-10-04 Mitsubishi Electric Corporation Power supply device

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3888691A (en) 1972-10-06 1975-06-10 Lockheed Aircraft Corp Porous ceramic
US5420085A (en) 1985-02-04 1995-05-30 Lanxide Technology Company, Lp Methods of making composite aluminum nitride ceramic articles having embedded filler
US5060114A (en) 1990-06-06 1991-10-22 Zenith Electronics Corporation Conformable pad with thermally conductive additive for heat dissipation
US5307508A (en) * 1991-05-13 1994-04-26 Motorola, Inc. Shock isolation for selective call receivers
CN2135871Y (zh) * 1992-01-09 1993-06-09 王刚 大功率直流/直流变换电源器件
CA2120468A1 (en) * 1993-04-05 1994-10-06 Kenneth Alan Salisbury Electronic module containing an internally ribbed, integral heat sink and bonded, flexible printed wiring board with two-sided component population
US5756934A (en) * 1994-10-11 1998-05-26 Loral Fairchild Corp. Flight crash survivable storage unit with aquarium container for flight recorder memory
US5932839A (en) * 1997-11-04 1999-08-03 Ren; Jane Method for dissipating heat away from a heat sensitive device using bicarbonate compositions
DE69800442T2 (de) 1998-03-23 2001-07-12 Negesat Di Boer Fabrizio & C S Schutzgehäuse für Anwendungen in der Raumfahrt
US6013592A (en) * 1998-03-27 2000-01-11 Siemens Westinghouse Power Corporation High temperature insulation for ceramic matrix composites
IT1308435B1 (it) 1999-04-01 2001-12-17 Negesat Di Boer Fabrizio & C S Struttura di contenimento e dissipazione termica per equipaggiamentiin un veicolo aeronautico o spaziale
EP0992430A3 (en) * 1998-10-07 2000-09-13 Negesat Di Boer Fabrizio & C. SNC Housing providing cooling for equipment aboard aircraft or spacecraft
US6549409B1 (en) * 2000-08-21 2003-04-15 Vlt Corporation Power converter assembly
DE10130592C1 (de) * 2001-06-27 2002-10-24 Infineon Technologies Ag Modulbaugruppe für Speicher-Module und Verfahren zu ihrer Herstellung

Also Published As

Publication number Publication date
CN1717966A (zh) 2006-01-04
WO2003098987A1 (en) 2003-11-27
AU2003223066A1 (en) 2003-12-02
US7099157B2 (en) 2006-08-29
DE60302785D1 (de) 2006-01-19
EP1504637A1 (en) 2005-02-09
EP1504637B1 (en) 2006-10-04
ATE341926T1 (de) 2006-10-15
DE60302785T2 (de) 2007-03-15
US20060133045A1 (en) 2006-06-22
CN100431398C (zh) 2008-11-05
AU2003223066A8 (en) 2003-12-02
ITTO20020416A1 (it) 2003-11-17

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