KR100677620B1 - 전자기기의 냉각 방법 및 냉각 효율이 향상된 전자기기 - Google Patents
전자기기의 냉각 방법 및 냉각 효율이 향상된 전자기기 Download PDFInfo
- Publication number
- KR100677620B1 KR100677620B1 KR1020050112008A KR20050112008A KR100677620B1 KR 100677620 B1 KR100677620 B1 KR 100677620B1 KR 1020050112008 A KR1020050112008 A KR 1020050112008A KR 20050112008 A KR20050112008 A KR 20050112008A KR 100677620 B1 KR100677620 B1 KR 100677620B1
- Authority
- KR
- South Korea
- Prior art keywords
- conductive filler
- thermally conductive
- electronic device
- printed circuit
- circuit board
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0086—Casings, cabinets or drawers for electric apparatus portable, e.g. battery operated apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (16)
- 전자기기의 조립시, 인쇄회로기판의 상면, 인쇄회로기판의 하면 및 케이스의 내면 중에서 적어도 하나의 위치에 열전도성 충진재를 배치함으로써, 조립 후, 상기 열전도성 충진재가 전자기기 내부의 부품들과 밀착되도록 하는 것으로,상기 열전도성 충진재는 신축성이 있는 실리콘 고무 또는 발포성 수지로 이루어지며,상기 열전도성 충진재의 이완시 두께는 상기 열전도성 충진재가 배치될 공간의 간격 보다 큰 것을 특징으로 하는 전자기기의 냉각 방법.
- 제 1 항에 있어서,상기 열전도성 충진재는 인쇄회로기판의 상면과 상부 케이스 사이의 공간에 배치되며, 상기 열전도성 충진재의 이완시 두께는 인쇄회로기판의 상면과 상부 케이스 사이의 간격 보다 큰 것을 특징으로 하는 전자기기의 냉각 방법.
- 제 1 항에 있어서,상기 열전도성 충진재는 인쇄회로기판의 하면과 하부 케이스 사이의 공간에 배치되며, 상기 열전도성 충진재의 이완시 두께는 인쇄회로기판의 하면과 하부 케이스 사이의 간격 보다 큰 것을 특징으로 하는 전자기기의 냉각 방법.
- 제 1 항에 있어서,상기 열전도성 충진재는 상기 전자기기 내부의 적어도 발열성 부품과 밀착하도록, 전자기기 내부의 공간에 적어도 부분적으로 배치되는 것을 특징으로 하는 전자기기의 냉각 방법.
- 제 1 항 내지 제 4 항 중 어느 한 항에 있어서,상기 열전도성 충진재의 열전달율은 공기의 열전달율의 3배보다 큰 것을 특징으로 하는 전자기기의 냉각 방법.
- 제 5 항에 있어서,상기 열전도성 충진재의 열전달율은 적어도 0.08W/m-K 인 것을 특징으로 하는 전자기기의 냉각 방법.
- 삭제
- 제 6 항에 있어서,상기 열전도성 충진재는 이완시 평탄한 모양을 갖는 것을 특징으로 하는 전자기기의 냉각 방법.
- 전자부품이 실장된 인쇄회로기판 및 상기 인쇄회로기판을 둘러싸는 케이스를 구비하는 전자기기에 있어서,상기 인쇄회로기판의 상면, 인쇄회로기판의 하면 및 케이스의 내면 중에서 적어도 하나의 위치에 열전도성 충진재가 삽입되어 상기 전자기기 내부의 부품들과 밀착되며,상기 열전도성 충진재는 신축성이 있는 실리콘 고무 또는 발포성 수지로 이루어지고,상기 열전도성 충진재의 이완시 두께는 상기 열전도성 충진재가 배치될 공간의 간격 보다 큰 것을 특징으로 하는 전자기기.
- 제 9 항에 있어서,상기 열전도성 충진재는 인쇄회로기판의 상면과 케이스 사이의 공간에 배치되며, 상기 열전도성 충진재의 이완시 두께는 인쇄회로기판의 상면과 케이스 사이의 간격 보다 큰 것을 특징으로 하는 전자기기.
- 제 9 항에 있어서,상기 열전도성 충진재는 인쇄회로기판의 하면과 케이스 사이의 공간에 배치되며, 상기 열전도성 충진재의 이완시 두께는 인쇄회로기판의 하면과 케이스 사이의 간격 보다 큰 것을 특징으로 하는 전자기기.
- 제 9 항에 있어서,상기 열전도성 충진재는 전자기기 내부의 적어도 발열성 부품과 밀착할 수 있도록, 상기 발열성 부품의 주위에 적어도 부분적으로 배치되는 것을 특징으로 하는 전자기기.
- 제 9 항 내지 제 12 항 중 어느 한 항에 있어서,상기 열전도성 충진재의 열전달율은 공기의 열전달율의 3배보다 큰 것을 특징으로 하는 전자기기.
- 제 13 항에 있어서,상기 열전도성 충진재의 열전달율은 적어도 0.08W/m-K 인 것을 특징으로 하는 전자기기.
- 삭제
- 제 14 항에 있어서,상기 열전도성 충진재는 이완시 평탄한 모양을 갖는 것을 특징으로 하는 전자기기.
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050112008A KR100677620B1 (ko) | 2005-11-22 | 2005-11-22 | 전자기기의 냉각 방법 및 냉각 효율이 향상된 전자기기 |
US11/589,740 US20070115644A1 (en) | 2005-11-22 | 2006-10-31 | Method of cooling electronic device and electronic device with improved cooling efficiency |
EP14160581.6A EP2747532B1 (en) | 2005-11-22 | 2006-11-06 | Method of cooling electronic device and electronic device with improved cooling efficiency |
CN201310231688XA CN103327794A (zh) | 2005-11-22 | 2006-11-06 | 冷却电子装置的方法及具有改进的冷却效率的电子装置 |
CNA2006800315221A CN101253696A (zh) | 2005-11-22 | 2006-11-06 | 冷却电子装置的方法及具有改进的冷却效率的电子装置 |
EP06812424A EP1952545A4 (en) | 2005-11-22 | 2006-11-06 | METHOD FOR COOLING ELECTRONIC DEVICE AND ELECTRONIC DEVICE WITH IMPROVED COOLING EFFICIENCY |
PCT/KR2006/004587 WO2007061190A1 (en) | 2005-11-22 | 2006-11-06 | Method of cooling electronic device and electronic device with improved cooling efficiency |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050112008A KR100677620B1 (ko) | 2005-11-22 | 2005-11-22 | 전자기기의 냉각 방법 및 냉각 효율이 향상된 전자기기 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR100677620B1 true KR100677620B1 (ko) | 2007-02-02 |
Family
ID=38053238
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020050112008A KR100677620B1 (ko) | 2005-11-22 | 2005-11-22 | 전자기기의 냉각 방법 및 냉각 효율이 향상된 전자기기 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20070115644A1 (ko) |
EP (2) | EP2747532B1 (ko) |
KR (1) | KR100677620B1 (ko) |
CN (2) | CN103327794A (ko) |
WO (1) | WO2007061190A1 (ko) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101740126B1 (ko) * | 2014-06-13 | 2017-05-25 | 니혼 덴산 산쿄 가부시키가이샤 | 센서 장치 및 인코더 |
KR20190081789A (ko) | 2017-12-29 | 2019-07-09 | 이동진 | 휴대폰 쿨링 케이스 |
KR102292622B1 (ko) * | 2020-12-09 | 2021-08-24 | 주식회사 솔루엠 | 충진체를 이용한 방열 구조를 갖는 전기기기 및 이의 제조 방법 |
US11955755B2 (en) | 2020-12-02 | 2024-04-09 | Solum Co., Ltd. | Electric appliance and adapter |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8576561B2 (en) * | 2010-02-02 | 2013-11-05 | Apple Inc. | Handheld device enclosure |
CN103547111B (zh) * | 2012-07-09 | 2016-08-10 | 光宝电子(广州)有限公司 | 平面式散热结构及电子装置 |
KR101976180B1 (ko) * | 2012-08-13 | 2019-05-08 | 엘지전자 주식회사 | 이동 단말기 |
TWM475135U (zh) * | 2013-06-28 | 2014-03-21 | Fih Hong Kong Ltd | 可攜式電子裝置保護殼 |
KR102184621B1 (ko) * | 2014-02-21 | 2020-11-30 | 삼성전자주식회사 | 방열 쉬트를 구비한 이동 통신 단말기 |
DE202014002060U1 (de) * | 2014-03-06 | 2015-04-08 | HKR Seuffer Automotive GmbH & Co. KG | Kühleinrichtung und Kühlanordnung mit der Kühleinrichtung |
US9690341B2 (en) * | 2015-09-04 | 2017-06-27 | Asia Vital Components Co., Ltd. | Heat insulation structure for hand-held device and hand-held device with same |
CN105636408A (zh) * | 2015-10-29 | 2016-06-01 | 东莞酷派软件技术有限公司 | 移动终端 |
EP3255665B1 (en) | 2016-06-08 | 2022-01-12 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Electronic device with component carrier and method for producing it |
CN108369838B (zh) | 2016-09-22 | 2020-06-02 | 山岸宽光 | 电缆、设备以及电力供给方法 |
EP3302006A1 (en) | 2016-09-30 | 2018-04-04 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier comprising at least one heat pipe and method for producing said component carrier |
US9775229B1 (en) * | 2017-01-25 | 2017-09-26 | Nvidia Corporation | Internally die-referenced thermal transfer plate |
US10886821B2 (en) * | 2018-12-28 | 2021-01-05 | Apple Inc. | Haptic actuator including thermally coupled heat spreading layer and related methods |
CN111328229B (zh) * | 2020-03-20 | 2021-02-12 | 温州高伟通工业设计有限公司 | 一种防高温损坏的家用电子产品充电设备 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000209474A (ja) | 1999-01-20 | 2000-07-28 | Fujitsu General Ltd | Ccdカメラ |
JP2001189582A (ja) | 1999-12-28 | 2001-07-10 | Kitagawa Ind Co Ltd | 電子部品用放熱体 |
JP2005032912A (ja) | 2003-07-10 | 2005-02-03 | Hitachi Industrial Equipment Systems Co Ltd | 電力変換装置 |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3564164A (en) * | 1968-01-25 | 1971-02-16 | Bell Telephone Labor Inc | Method for constructing telephone stations using flowable, adhesive hardening material; and instruments so built |
US4233645A (en) * | 1978-10-02 | 1980-11-11 | International Business Machines Corporation | Semiconductor package with improved conduction cooling structure |
FR2669178B1 (fr) * | 1990-11-09 | 1996-07-26 | Merlin Gerin | Coffre et carte electronique a drain thermique et procede de fabrication d'une telle carte. |
DE4111247C3 (de) * | 1991-04-08 | 1996-11-21 | Export Contor Ausenhandelsgese | Schaltungsanordnung |
JPH0737567A (ja) * | 1993-07-19 | 1995-02-07 | Kanegafuchi Chem Ind Co Ltd | バッテリーの断熱装置 |
JPH08227952A (ja) * | 1995-02-20 | 1996-09-03 | Fujitsu General Ltd | パワーモジュール |
DE29514398U1 (de) * | 1995-09-07 | 1995-10-19 | Siemens AG, 80333 München | Abschirmung für Flachbaugruppen |
DE19649798A1 (de) * | 1996-12-02 | 1998-06-04 | Abb Research Ltd | Leistungshalbleitermodul |
US6665192B2 (en) * | 1997-02-18 | 2003-12-16 | Koninklijke Philips Electronics N.V. | Synthetic resin capping layer on a printed circuit |
DE19734110C1 (de) * | 1997-08-07 | 1998-11-19 | Bosch Gmbh Robert | Elektrisches Gerät mit einer Leiterplatte und Verfahren zum Fügen des Geräts |
US5975922A (en) * | 1998-03-09 | 1999-11-02 | Lucent Technologies Inc. | Device containing directionally conductive composite medium |
TW548641B (en) * | 1998-07-30 | 2003-08-21 | Lg Electronics Inc | Sound muffling and heat-discharging case for computer storage device |
US6101094A (en) | 1998-12-18 | 2000-08-08 | Sun Microsystems, Inc. | Printed circuit board with integrated cooling mechanism |
US6496373B1 (en) * | 1999-11-04 | 2002-12-17 | Amerasia International Technology, Inc. | Compressible thermally-conductive interface |
US6317324B1 (en) * | 2000-02-01 | 2001-11-13 | Shiaw-Jong Steve Chen | Encapsulated power supply with a high thermal conductivity molded insert |
BRPI0100051B1 (pt) * | 2001-01-11 | 2016-11-29 | Brasil Compressores Sa | gabinete de dispositivo eletrônico |
JP2002209474A (ja) * | 2001-01-15 | 2002-07-30 | Fujikyu Kk | 釣 針 |
US6707671B2 (en) * | 2001-05-31 | 2004-03-16 | Matsushita Electric Industrial Co., Ltd. | Power module and method of manufacturing the same |
SE522857C2 (sv) * | 2001-11-23 | 2004-03-09 | Optillion Ab | Värmestyrd optoelektrisk enhet |
US20030128519A1 (en) * | 2002-01-08 | 2003-07-10 | International Business Machine Corporartion | Flexible, thermally conductive, electrically insulating gap filler, method to prepare same, and method using same |
ITTO20020416A1 (it) * | 2002-05-16 | 2003-11-17 | Negesat Di Boer Fabrizio E C S | Struttura di contenimento e dissipazione termica per apparecchiature elettroniche. |
US7023699B2 (en) * | 2002-06-10 | 2006-04-04 | Visteon Global Technologies, Inc. | Liquid cooled metal thermal stack for high-power dies |
US7057896B2 (en) * | 2002-08-21 | 2006-06-06 | Matsushita Electric Industrial Co., Ltd. | Power module and production method thereof |
TW592030B (en) * | 2003-04-29 | 2004-06-11 | Quanta Comp Inc | Functional module and manufacturing method thereof |
JP2005057088A (ja) * | 2003-08-05 | 2005-03-03 | Agilent Technol Inc | 多層構造の熱伝導部材、および、それを用いた電子機器 |
JP4479381B2 (ja) * | 2003-09-24 | 2010-06-09 | セイコーエプソン株式会社 | 電気光学装置、電気光学装置の製造方法、及び電子機器 |
US7292441B2 (en) * | 2003-11-25 | 2007-11-06 | Advanced Energy Technology Inc. | Thermal solution for portable electronic devices |
KR20050061885A (ko) | 2003-12-18 | 2005-06-23 | 엘지전자 주식회사 | 휴대용 단말기의 방열장치 |
-
2005
- 2005-11-22 KR KR1020050112008A patent/KR100677620B1/ko active IP Right Grant
-
2006
- 2006-10-31 US US11/589,740 patent/US20070115644A1/en not_active Abandoned
- 2006-11-06 WO PCT/KR2006/004587 patent/WO2007061190A1/en active Application Filing
- 2006-11-06 EP EP14160581.6A patent/EP2747532B1/en not_active Ceased
- 2006-11-06 CN CN201310231688XA patent/CN103327794A/zh active Pending
- 2006-11-06 CN CNA2006800315221A patent/CN101253696A/zh active Pending
- 2006-11-06 EP EP06812424A patent/EP1952545A4/en not_active Ceased
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000209474A (ja) | 1999-01-20 | 2000-07-28 | Fujitsu General Ltd | Ccdカメラ |
JP2001189582A (ja) | 1999-12-28 | 2001-07-10 | Kitagawa Ind Co Ltd | 電子部品用放熱体 |
JP2005032912A (ja) | 2003-07-10 | 2005-02-03 | Hitachi Industrial Equipment Systems Co Ltd | 電力変換装置 |
Non-Patent Citations (1)
Title |
---|
12209474 * |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101740126B1 (ko) * | 2014-06-13 | 2017-05-25 | 니혼 덴산 산쿄 가부시키가이샤 | 센서 장치 및 인코더 |
KR20190081789A (ko) | 2017-12-29 | 2019-07-09 | 이동진 | 휴대폰 쿨링 케이스 |
US11955755B2 (en) | 2020-12-02 | 2024-04-09 | Solum Co., Ltd. | Electric appliance and adapter |
KR102292622B1 (ko) * | 2020-12-09 | 2021-08-24 | 주식회사 솔루엠 | 충진체를 이용한 방열 구조를 갖는 전기기기 및 이의 제조 방법 |
US12028985B2 (en) | 2020-12-09 | 2024-07-02 | Solum Co., Ltd. | Electrical device having heat dissipation structure using filler and manufacturing method of the same |
Also Published As
Publication number | Publication date |
---|---|
CN101253696A (zh) | 2008-08-27 |
EP1952545A4 (en) | 2010-10-27 |
CN103327794A (zh) | 2013-09-25 |
EP2747532B1 (en) | 2016-12-21 |
US20070115644A1 (en) | 2007-05-24 |
EP2747532A1 (en) | 2014-06-25 |
WO2007061190A1 (en) | 2007-05-31 |
EP1952545A1 (en) | 2008-08-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100677620B1 (ko) | 전자기기의 냉각 방법 및 냉각 효율이 향상된 전자기기 | |
EP2262354B1 (en) | Assemblies and methods for dissipating heat from handheld electronic devices | |
US9258928B2 (en) | Assemblies and methods for dissipating heat from handheld electronic devices | |
US9165854B2 (en) | Heat dissipation features, electronic devices incorporating heat dissipation features, and methods of making heat dissipation features | |
US6347035B1 (en) | Low profile EMI shield with heat spreading plate | |
US8059401B2 (en) | Electronic device with heat dissipation module | |
US5737187A (en) | Apparatus, method and system for thermal management of an unpackaged semiconductor device | |
US20110228485A1 (en) | Cooling structure for electronic equipment | |
US8120917B2 (en) | Heat dissipation device | |
US20070263352A1 (en) | Plastics Utilizing Thermally Conductive Film | |
TWI483672B (zh) | 具有熱管理特徵之電子裝置包封體及散熱結構 | |
US8531841B2 (en) | IC thermal management system | |
US20100155023A1 (en) | Heat dissipation apparatus having heat pipes inserted therein | |
JP2006054356A (ja) | 熱伝導部材 | |
Qiu et al. | Study on heat dissipation in Package-on-Package (POP) | |
Chiriac et al. | Thermal evaluation of power amplifier modules and RF packages in a handheld communicator system | |
Moon et al. | Thermal management of a stacked-die package in a handheld electronic device using passive solutions | |
US20100128443A1 (en) | Heat dissipating module | |
US8934249B2 (en) | Electronic device with heat dissipation assembly | |
Kromann | Thermal modeling and experimental characterization of the C4/surface-mount-array interconnect technologies | |
KR102704160B1 (ko) | 방열부재를 포함하는 인쇄회로기판 어셈블리 | |
US11089714B2 (en) | Electronic device and its heat dissipation assembly | |
KR101493943B1 (ko) | 방열시스템 | |
Kumar | Thermal management of RF and digital electronic assemblies using optimized materials and PCB designs | |
JP2021131683A (ja) | プログラマブルロジックコントローラ、電子装置および接触面の選択方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20121228 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20131230 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20141223 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20151229 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20161228 Year of fee payment: 11 |
|
FPAY | Annual fee payment |
Payment date: 20171228 Year of fee payment: 12 |
|
FPAY | Annual fee payment |
Payment date: 20181227 Year of fee payment: 13 |