JP2005057088A - 多層構造の熱伝導部材、および、それを用いた電子機器 - Google Patents
多層構造の熱伝導部材、および、それを用いた電子機器 Download PDFInfo
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- JP2005057088A JP2005057088A JP2003287063A JP2003287063A JP2005057088A JP 2005057088 A JP2005057088 A JP 2005057088A JP 2003287063 A JP2003287063 A JP 2003287063A JP 2003287063 A JP2003287063 A JP 2003287063A JP 2005057088 A JP2005057088 A JP 2005057088A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
【解決手段】基板に実装された発熱素子に密着できる熱伝導性シートを可撓性を有するグラファイト・シートに貼り付け、そのグラファイト・シートの縁端部をアルミニウム製のヒートシンクに直接圧接する。そして、熱伝導性シートには不導体を用いる。
【選択図】図4
Description
310,410 ヒートシンク
311,411 流路
320,420 伝熱部材
321,421 グラファイト・シート
322,422,423 熱伝導性シート
330a,330b,330c,330d,330e 発熱素子
340,440 平板
350,450 ネジ
430a,430b,430c,430d,430e 発熱素子
530a,530b,530c 発熱素子
Claims (10)
- それぞれの形状が不均一な複数の発熱素子に取り付けられ、前記複数の発熱素子が発生する熱を放熱部材へ伝達するための熱伝導部材であって、
熱的に結合された第一の熱伝導性シートと第二の熱伝導性シートとを備え、
前記第一の熱伝導性シートは、前記複数の発熱素子に密着できるような柔軟性を有する不導体であり、
前記第二の熱伝導性シートは、前記複数の発熱素子に密着した前記第一の熱伝導性シートに追随できるような可撓性と前記第二の熱伝導性シートに比べて高い熱伝導性とを有する、
ことを特徴とする熱伝導部材。 - 前記第二の熱伝導性シートは、その面方向の熱伝導性がその厚さ方向の熱伝導性に比べて高く、かつ、その厚さ方向の熱伝導性が前記第二の熱伝導性シートの熱伝導性に比べて高い、
ことを特徴とする請求項1に記載の熱伝導部材。 - 前記第二の熱伝導性シートは、前記放熱部材と直接接触するための部分を有する、
ことを特徴とする請求項1または請求項2に記載の熱伝導部材。 - 前記第二の熱伝導性シートは、グラファイト・シートまたはダイヤモンド・シートである、
ことを特徴とする請求項1乃至請求項3のいずれかに記載の熱伝導部材。 - 前記第一の熱伝導性シートは、その内部にダイヤモンド粉が含まれる、
ことを特徴とする請求項1乃至請求項4のいずれかに記載の熱伝導部材。 - それぞれの形状が不均一な複数の発熱素子に取り付けられ、前記複数の発熱素子が発生する熱を放熱部材へ伝達するための熱伝導部材を備える電子機器であって、
熱的に結合された第一の熱伝導性シートと第二の熱伝導性シートとを備え、
前記第一の熱伝導性シートは、前記複数の発熱素子に密着できるような柔軟性を有する不導体であり、
前記第二の熱伝導性シートは、前記複数の発熱素子に密着した前記第一の熱伝導性シートに追随できるような可撓性と前記第二の熱伝導性シートに比べて高い熱伝導性とを有する、
ことを特徴とする電子機器。 - 前記第二の熱伝導性シートは、その面方向の熱伝導性がその厚さ方向の熱伝導性に比べて高く、かつ、その厚さ方向の熱伝導性が前記第二の熱伝導性シートの熱伝導性に比べて高い、
ことを特徴とする請求項6に記載の電子機器。 - 前記第二の熱伝導性シートは、前記放熱部材と直接接触するための部分を有する、
ことを特徴とする請求項6または請求項7に記載の電子機器。 - 前記第二の熱伝導性シートは、グラファイト・シートまたはダイヤモンド・シートである、
ことを特徴とする請求項6乃至請求項8のいずれかに記載の電子機器。 - 前記第一の熱伝導性シートは、その内部にダイヤモンド粉が含まれる、
ことを特徴とする請求項6乃至請求項9のいずれかに記載の電子機器。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003287063A JP2005057088A (ja) | 2003-08-05 | 2003-08-05 | 多層構造の熱伝導部材、および、それを用いた電子機器 |
US10/885,214 US20050039879A1 (en) | 2003-08-05 | 2004-07-06 | Heat transmission member and an electronics device using the member |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003287063A JP2005057088A (ja) | 2003-08-05 | 2003-08-05 | 多層構造の熱伝導部材、および、それを用いた電子機器 |
Publications (1)
Publication Number | Publication Date |
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JP2005057088A true JP2005057088A (ja) | 2005-03-03 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2003287063A Pending JP2005057088A (ja) | 2003-08-05 | 2003-08-05 | 多層構造の熱伝導部材、および、それを用いた電子機器 |
Country Status (2)
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US (1) | US20050039879A1 (ja) |
JP (1) | JP2005057088A (ja) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007103365A (ja) * | 2005-09-30 | 2007-04-19 | Valeo Vision | 熱異方性を有する材料を使用した自動車用の照明または信号伝達装置 |
JP2007165687A (ja) * | 2005-12-15 | 2007-06-28 | Matsushita Electric Ind Co Ltd | 熱伝達体とそれを用いた電子機器 |
JP2008041893A (ja) * | 2006-08-04 | 2008-02-21 | Denso Corp | 放熱装置 |
EP1976005A2 (en) | 2007-03-29 | 2008-10-01 | Polymatech Co., Ltd. | Thermally conductive sheet and method of manufacturing the same |
US7772692B2 (en) | 2006-08-29 | 2010-08-10 | Kabushiki Kaisha Toshiba | Semiconductor device with cooling member |
JP2012049496A (ja) * | 2010-01-29 | 2012-03-08 | Nitto Denko Corp | 放熱構造体 |
JP2014187355A (ja) * | 2013-03-22 | 2014-10-02 | Toyota Motor Engineering & Manufacturing North America Inc | 異方性熱案内被覆を有する熱エネルギ案内装置及びその製造方法 |
JP2017093145A (ja) * | 2015-11-10 | 2017-05-25 | Tdk株式会社 | 電源装置 |
JP2021500695A (ja) * | 2017-10-26 | 2021-01-07 | 信越ポリマー株式会社 | 放熱構造体およびそれを備えるバッテリー |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
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US7292441B2 (en) * | 2003-11-25 | 2007-11-06 | Advanced Energy Technology Inc. | Thermal solution for portable electronic devices |
KR100677620B1 (ko) * | 2005-11-22 | 2007-02-02 | 삼성전자주식회사 | 전자기기의 냉각 방법 및 냉각 효율이 향상된 전자기기 |
US20100142154A1 (en) * | 2008-12-04 | 2010-06-10 | Microvision, Inc. | Thermally Dissipative Enclosure Having Shock Absorbing Properties |
US8081468B2 (en) | 2009-06-17 | 2011-12-20 | Laird Technologies, Inc. | Memory modules including compliant multilayered thermally-conductive interface assemblies |
US20100321897A1 (en) * | 2009-06-17 | 2010-12-23 | Laird Technologies, Inc. | Compliant multilayered thermally-conductive interface assemblies |
US8776868B2 (en) * | 2009-08-28 | 2014-07-15 | International Business Machines Corporation | Thermal ground plane for cooling a computer |
US20140284040A1 (en) | 2013-03-22 | 2014-09-25 | International Business Machines Corporation | Heat spreading layer with high thermal conductivity |
CN105706541B (zh) * | 2013-10-29 | 2019-02-05 | 积水保力马科技株式会社 | 充液散热构件 |
US10458716B2 (en) * | 2014-11-04 | 2019-10-29 | Roccor, Llc | Conformal thermal ground planes |
US11059278B2 (en) | 2016-02-28 | 2021-07-13 | Roccor, Llc | Two-phase thermal management devices, methods, and systems |
JP2018018853A (ja) * | 2016-07-25 | 2018-02-01 | レノボ・シンガポール・プライベート・リミテッド | 電子デバイス及び電子機器 |
EP3531811A4 (en) * | 2016-11-25 | 2019-10-30 | Huawei Technologies Co., Ltd. | HEAT EXCHANGE PLATE, HEAT DISPOSAL DEVICE AND ELECTRONIC DEVICE |
US10306356B2 (en) * | 2017-03-31 | 2019-05-28 | Bose Corporation | Acoustic deflector as heat sink |
NL2019888B1 (en) * | 2017-11-10 | 2019-05-17 | Shinetsu Polymer Co | Heat dissipating structure, and battery provided with the same |
KR20200100973A (ko) * | 2019-02-19 | 2020-08-27 | 삼성전자주식회사 | 열전달 부재 및 이를 포함하는 전자 장치 |
CN113453483A (zh) * | 2020-03-26 | 2021-09-28 | 中科寒武纪科技股份有限公司 | 用于散热的装置及其电子器件 |
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US5315480A (en) * | 1991-11-14 | 1994-05-24 | Digital Equipment Corporation | Conformal heat sink for electronic module |
US6264882B1 (en) * | 1994-05-20 | 2001-07-24 | The Regents Of The University Of California | Process for fabricating composite material having high thermal conductivity |
JPH09262917A (ja) * | 1996-03-28 | 1997-10-07 | Mitsubishi Electric Corp | 伝熱素子 |
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DE69825153D1 (de) * | 1997-10-14 | 2004-08-26 | Matsushita Electric Ind Co Ltd | Wärmeleitende einheit und wärmeverbindungsstruktur welche diese einheit verwendet |
US6060166A (en) * | 1998-02-05 | 2000-05-09 | Raytheon Company | Flexible graphite fiber thermal shunt |
US6367541B2 (en) * | 1999-05-06 | 2002-04-09 | Cool Options, Inc. | Conforming heat sink assembly |
US20030128519A1 (en) * | 2002-01-08 | 2003-07-10 | International Business Machine Corporartion | Flexible, thermally conductive, electrically insulating gap filler, method to prepare same, and method using same |
US6721182B1 (en) * | 2002-10-10 | 2004-04-13 | Harris Corporation | Circuit card module including mezzanine card heat sink and related methods |
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2003
- 2003-08-05 JP JP2003287063A patent/JP2005057088A/ja active Pending
-
2004
- 2004-07-06 US US10/885,214 patent/US20050039879A1/en not_active Abandoned
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007103365A (ja) * | 2005-09-30 | 2007-04-19 | Valeo Vision | 熱異方性を有する材料を使用した自動車用の照明または信号伝達装置 |
JP2007165687A (ja) * | 2005-12-15 | 2007-06-28 | Matsushita Electric Ind Co Ltd | 熱伝達体とそれを用いた電子機器 |
JP2008041893A (ja) * | 2006-08-04 | 2008-02-21 | Denso Corp | 放熱装置 |
US7772692B2 (en) | 2006-08-29 | 2010-08-10 | Kabushiki Kaisha Toshiba | Semiconductor device with cooling member |
EP1976005A2 (en) | 2007-03-29 | 2008-10-01 | Polymatech Co., Ltd. | Thermally conductive sheet and method of manufacturing the same |
US8691368B2 (en) | 2007-03-29 | 2014-04-08 | Polymatech Co., Ltd. | Thermally conductive sheet and method of manufacturing the same |
JP2012049496A (ja) * | 2010-01-29 | 2012-03-08 | Nitto Denko Corp | 放熱構造体 |
JP2014187355A (ja) * | 2013-03-22 | 2014-10-02 | Toyota Motor Engineering & Manufacturing North America Inc | 異方性熱案内被覆を有する熱エネルギ案内装置及びその製造方法 |
JP2017093145A (ja) * | 2015-11-10 | 2017-05-25 | Tdk株式会社 | 電源装置 |
JP2021500695A (ja) * | 2017-10-26 | 2021-01-07 | 信越ポリマー株式会社 | 放熱構造体およびそれを備えるバッテリー |
JP7116781B2 (ja) | 2017-10-26 | 2022-08-10 | 信越ポリマー株式会社 | 放熱構造体およびそれを備えるバッテリー |
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