TW581291U - Improved computer heat dissipating structure - Google Patents

Improved computer heat dissipating structure

Info

Publication number
TW581291U
TW581291U TW92203960U TW92203960U TW581291U TW 581291 U TW581291 U TW 581291U TW 92203960 U TW92203960 U TW 92203960U TW 92203960 U TW92203960 U TW 92203960U TW 581291 U TW581291 U TW 581291U
Authority
TW
Taiwan
Prior art keywords
heat dissipating
dissipating structure
computer heat
improved computer
improved
Prior art date
Application number
TW92203960U
Other languages
Chinese (zh)
Inventor
Bau-Lung Lin
Original Assignee
Polo Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polo Tech Co Ltd filed Critical Polo Tech Co Ltd
Priority to TW92203960U priority Critical patent/TW581291U/en
Publication of TW581291U publication Critical patent/TW581291U/en

Links

TW92203960U 2003-03-14 2003-03-14 Improved computer heat dissipating structure TW581291U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW92203960U TW581291U (en) 2003-03-14 2003-03-14 Improved computer heat dissipating structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW92203960U TW581291U (en) 2003-03-14 2003-03-14 Improved computer heat dissipating structure

Publications (1)

Publication Number Publication Date
TW581291U true TW581291U (en) 2004-03-21

Family

ID=32924830

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92203960U TW581291U (en) 2003-03-14 2003-03-14 Improved computer heat dissipating structure

Country Status (1)

Country Link
TW (1) TW581291U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI698955B (en) 2019-03-26 2020-07-11 鼎瀚實業有限公司 Improvement of the connecting rod assembly of semiconductor etching machine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI698955B (en) 2019-03-26 2020-07-11 鼎瀚實業有限公司 Improvement of the connecting rod assembly of semiconductor etching machine

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Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees