TW520821U - Laminated heat dissipating device - Google Patents

Laminated heat dissipating device

Info

Publication number
TW520821U
TW520821U TW091200918U TW91200918U TW520821U TW 520821 U TW520821 U TW 520821U TW 091200918 U TW091200918 U TW 091200918U TW 91200918 U TW91200918 U TW 91200918U TW 520821 U TW520821 U TW 520821U
Authority
TW
Taiwan
Prior art keywords
heat dissipating
dissipating device
laminated heat
laminated
heat
Prior art date
Application number
TW091200918U
Other languages
Chinese (zh)
Inventor
Tzung-Lung Li
Shiou-Ming Jang
Original Assignee
Advanced Thermal Technologies
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Thermal Technologies filed Critical Advanced Thermal Technologies
Priority to TW091200918U priority Critical patent/TW520821U/en
Priority to US10/336,826 priority patent/US20030141040A1/en
Publication of TW520821U publication Critical patent/TW520821U/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
TW091200918U 2002-01-29 2002-01-29 Laminated heat dissipating device TW520821U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW091200918U TW520821U (en) 2002-01-29 2002-01-29 Laminated heat dissipating device
US10/336,826 US20030141040A1 (en) 2002-01-29 2003-01-06 Heat dissipating device for an electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW091200918U TW520821U (en) 2002-01-29 2002-01-29 Laminated heat dissipating device

Publications (1)

Publication Number Publication Date
TW520821U true TW520821U (en) 2003-02-11

Family

ID=27608866

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091200918U TW520821U (en) 2002-01-29 2002-01-29 Laminated heat dissipating device

Country Status (2)

Country Link
US (1) US20030141040A1 (en)
TW (1) TW520821U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI638436B (en) * 2017-01-10 2018-10-11 奇鋐科技股份有限公司 Thermal module

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070240865A1 (en) * 2006-04-13 2007-10-18 Zhang Chao A High performance louvered fin for heat exchanger
US20080112134A1 (en) * 2006-11-09 2008-05-15 Brandon Rubenstein Dust accumulation resistant heat sink
US8479806B2 (en) * 2007-11-30 2013-07-09 University Of Hawaii Two-phase cross-connected micro-channel heat sink
JP2009253231A (en) * 2008-04-10 2009-10-29 Fujitsu Ten Ltd Electronic equipment
CN104602490B (en) * 2015-01-15 2017-09-22 华为技术有限公司 Heat abstractor
CN110543069A (en) * 2018-05-28 2019-12-06 中强光电股份有限公司 Liquid cooling type radiator
CN113365466B (en) * 2020-03-02 2022-09-16 杭州海康威视数字技术股份有限公司 Electronic equipment
FR3130950A1 (en) * 2021-12-17 2023-06-23 Safran DOUBLE-STAGE HEAT EXCHANGER AND TURBOMACHINE EQUIPPED WITH SUCH HEAT EXCHANGER

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI638436B (en) * 2017-01-10 2018-10-11 奇鋐科技股份有限公司 Thermal module

Also Published As

Publication number Publication date
US20030141040A1 (en) 2003-07-31

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees