CN201112413Y - 大功率led封装结构 - Google Patents
大功率led封装结构 Download PDFInfo
- Publication number
- CN201112413Y CN201112413Y CNU2007201720113U CN200720172011U CN201112413Y CN 201112413 Y CN201112413 Y CN 201112413Y CN U2007201720113 U CNU2007201720113 U CN U2007201720113U CN 200720172011 U CN200720172011 U CN 200720172011U CN 201112413 Y CN201112413 Y CN 201112413Y
- Authority
- CN
- China
- Prior art keywords
- power led
- copper
- lens
- silica gel
- encapsulation structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2007201720113U CN201112413Y (zh) | 2007-09-21 | 2007-09-21 | 大功率led封装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2007201720113U CN201112413Y (zh) | 2007-09-21 | 2007-09-21 | 大功率led封装结构 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201112413Y true CN201112413Y (zh) | 2008-09-10 |
Family
ID=39964160
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2007201720113U Expired - Lifetime CN201112413Y (zh) | 2007-09-21 | 2007-09-21 | 大功率led封装结构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201112413Y (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101964391A (zh) * | 2010-08-12 | 2011-02-02 | 刘雪峰 | 一种新型集成防水大功率led散热发光一体管 |
CN101684924B (zh) * | 2008-09-23 | 2011-07-27 | 宁波升谱光电半导体有限公司 | 一种led照明模块及制备方法 |
CN102610600A (zh) * | 2012-04-05 | 2012-07-25 | 天津大学 | 纳米银焊膏封装大功率白光发光二极管led模块及其封装方法 |
US20130248584A1 (en) * | 2011-11-09 | 2013-09-26 | Xiaofeng Bi | Process for making a heat radiating structure for high-power led |
WO2017041280A1 (zh) * | 2015-09-11 | 2017-03-16 | 佛山市国星光电股份有限公司 | 一种具有过渡基板的led器件及其封装方法 |
-
2007
- 2007-09-21 CN CNU2007201720113U patent/CN201112413Y/zh not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101684924B (zh) * | 2008-09-23 | 2011-07-27 | 宁波升谱光电半导体有限公司 | 一种led照明模块及制备方法 |
CN101964391A (zh) * | 2010-08-12 | 2011-02-02 | 刘雪峰 | 一种新型集成防水大功率led散热发光一体管 |
US20130248584A1 (en) * | 2011-11-09 | 2013-09-26 | Xiaofeng Bi | Process for making a heat radiating structure for high-power led |
US8757473B2 (en) * | 2011-11-09 | 2014-06-24 | Dongguan Kingsun Optoelectronic Co., Ltd | Process for making a heat radiating structure for high-power LED |
CN102610600A (zh) * | 2012-04-05 | 2012-07-25 | 天津大学 | 纳米银焊膏封装大功率白光发光二极管led模块及其封装方法 |
WO2017041280A1 (zh) * | 2015-09-11 | 2017-03-16 | 佛山市国星光电股份有限公司 | 一种具有过渡基板的led器件及其封装方法 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Free format text: FORMER OWNER: LEI YUHOU LUO LONG Owner name: SHENZHEN LIGHTNING OPTOELECTRONIC (SZ) CO., LTD. Free format text: FORMER OWNER: WAN XIHONG Effective date: 20100604 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518000 6, BUILDING 17, INDUSTRIAL DISTRICT, GUANGQIAN VILLAGE, XILI TOWN, NANSHAN DISTRICT, SHENZHEN CITY, GUANGDONG PROVINCE TO: 518000 5/F, BUILDING 8, XINWEI SHILING INDUSTRIAL DISTRICT, SHIXIN ROAD, NANSHAN DISTRICT, SHENZHEN CITY, GUANGDONG PROVINCE |
|
TR01 | Transfer of patent right |
Effective date of registration: 20100604 Address after: 518000 Guangdong city of Shenzhen province Nanshan District new Shiling Wai Shi Xin Lu Industrial District eight building five floor Patentee after: Lighting Optoectronic(SZ) Co., Ltd. Address before: 518000 Guangdong city of Shenzhen province Nanshan District Xili Town Village Optical Industrial District 17 building 6 floor Co-patentee before: Lei Yuhou Patentee before: Wan Xihong Co-patentee before: Luo Long |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20080910 |