CL2013002183A1 - Metodo de manufactura de una estructura de didipacion de claor para un led que comprende: d9 colocar la palaca de conducccion de calo (6) y la terjeta pcb (4) - Google Patents

Metodo de manufactura de una estructura de didipacion de claor para un led que comprende: d9 colocar la palaca de conducccion de calo (6) y la terjeta pcb (4)

Info

Publication number
CL2013002183A1
CL2013002183A1 CL2013002183A CL2013002183A CL2013002183A1 CL 2013002183 A1 CL2013002183 A1 CL 2013002183A1 CL 2013002183 A CL2013002183 A CL 2013002183A CL 2013002183 A CL2013002183 A CL 2013002183A CL 2013002183 A1 CL2013002183 A1 CL 2013002183A1
Authority
CL
Chile
Prior art keywords
claipation
led
manufacture
place
driving rod
Prior art date
Application number
CL2013002183A
Other languages
English (en)
Inventor
Xiaofeng Bi
Original Assignee
Dongguan Kingsun Optoelect Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan Kingsun Optoelect Co filed Critical Dongguan Kingsun Optoelect Co
Publication of CL2013002183A1 publication Critical patent/CL2013002183A1/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4878—Mechanical treatment, e.g. deforming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
CL2013002183A 2011-11-09 2013-07-30 Metodo de manufactura de una estructura de didipacion de claor para un led que comprende: d9 colocar la palaca de conducccion de calo (6) y la terjeta pcb (4) CL2013002183A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011103514395A CN102403418A (zh) 2011-11-09 2011-11-09 一种大功率led的散热结构的制作方法

Publications (1)

Publication Number Publication Date
CL2013002183A1 true CL2013002183A1 (es) 2014-06-27

Family

ID=45885421

Family Applications (1)

Application Number Title Priority Date Filing Date
CL2013002183A CL2013002183A1 (es) 2011-11-09 2013-07-30 Metodo de manufactura de una estructura de didipacion de claor para un led que comprende: d9 colocar la palaca de conducccion de calo (6) y la terjeta pcb (4)

Country Status (11)

Country Link
US (1) US9153760B2 (es)
EP (1) EP2626919A4 (es)
JP (1) JP5725522B2 (es)
KR (1) KR101524388B1 (es)
CN (1) CN102403418A (es)
AU (1) AU2012333908C1 (es)
BR (1) BR112013015297A2 (es)
CA (1) CA2818085C (es)
CL (1) CL2013002183A1 (es)
MY (1) MY170785A (es)
WO (1) WO2013067840A1 (es)

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US11089671B2 (en) * 2019-11-26 2021-08-10 Eridan Communications, Inc. Integrated circuit / printed circuit board assembly and method of manufacture
CN110888506B (zh) * 2019-11-29 2021-06-25 深圳市核芯智联科技开发有限公司 多媒体双核工控主板
CN111836461B (zh) * 2020-07-21 2022-09-02 深圳市诚之益电路有限公司 一种散热型线路板及其制备方法
CN114126329A (zh) * 2020-08-31 2022-03-01 华为技术有限公司 一种散热组件及汽车
CN112752432B (zh) * 2020-11-20 2022-12-23 成都泰格微电子研究所有限责任公司 一种高效率高可靠性的印制电路板与垫片一体化装配工艺
CN113141755B (zh) * 2021-03-15 2022-06-14 电子科技大学 一种星载射频功率e类放大器散热装置的制备方法
CN113784590B (zh) * 2021-09-06 2022-08-02 无锡华测电子系统有限公司 瓦片式tr组件装置、外部散热结构
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Also Published As

Publication number Publication date
KR20130079618A (ko) 2013-07-10
AU2012333908C1 (en) 2015-08-27
CA2818085C (en) 2016-03-22
AU2012333908A8 (en) 2013-08-01
BR112013015297A2 (pt) 2016-09-20
WO2013067840A9 (zh) 2013-07-04
CN102403418A (zh) 2012-04-04
KR101524388B1 (ko) 2015-05-29
CA2818085A1 (en) 2013-05-16
MY170785A (en) 2019-08-28
US9153760B2 (en) 2015-10-06
EP2626919A4 (en) 2016-03-16
JP2014505373A (ja) 2014-02-27
JP5725522B2 (ja) 2015-05-27
WO2013067840A1 (zh) 2013-05-16
AU2012333908B2 (en) 2015-04-02
US20130298396A1 (en) 2013-11-14
AU2012333908A1 (en) 2013-05-16
EP2626919A1 (en) 2013-08-14

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