KR20070087270A - Led 패키지 - Google Patents
Led 패키지 Download PDFInfo
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- KR20070087270A KR20070087270A KR1020060017476A KR20060017476A KR20070087270A KR 20070087270 A KR20070087270 A KR 20070087270A KR 1020060017476 A KR1020060017476 A KR 1020060017476A KR 20060017476 A KR20060017476 A KR 20060017476A KR 20070087270 A KR20070087270 A KR 20070087270A
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- 238000000465 moulding Methods 0.000 claims abstract description 17
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
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- HHXNVASVVVNNDG-UHFFFAOYSA-N 1,2,3,4,5-pentachloro-6-(2,3,6-trichlorophenyl)benzene Chemical compound ClC1=CC=C(Cl)C(C=2C(=C(Cl)C(Cl)=C(Cl)C=2Cl)Cl)=C1Cl HHXNVASVVVNNDG-UHFFFAOYSA-N 0.000 description 4
- 239000004677 Nylon Substances 0.000 description 3
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- 230000003321 amplification Effects 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 238000003199 nucleic acid amplification method Methods 0.000 description 3
- 229920001778 nylon Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 2
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
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- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
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- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D43/00—Feeding, positioning or storing devices combined with, or arranged in, or specially adapted for use in connection with, apparatus for working or processing sheet metal, metal tubes or metal profiles; Associations therewith of cutting devices
- B21D43/02—Advancing work in relation to the stroke of the die or tool
- B21D43/04—Advancing work in relation to the stroke of the die or tool by means in mechanical engagement with the work
- B21D43/05—Advancing work in relation to the stroke of the die or tool by means in mechanical engagement with the work specially adapted for multi-stage presses
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D43/00—Feeding, positioning or storing devices combined with, or arranged in, or specially adapted for use in connection with, apparatus for working or processing sheet metal, metal tubes or metal profiles; Associations therewith of cutting devices
- B21D43/02—Advancing work in relation to the stroke of the die or tool
- B21D43/021—Control or correction devices in association with moving strips
- B21D43/023—Centering devices, e.g. edge guiding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Led Device Packages (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
Claims (9)
- 패키지 하우징;상기 패키지 하우징의 하부에 형성된 다수의 리드;상기 패키지 하우징의 내부에 실장된 다수의 LED;상기 다수의 LED와 상기 다수의 리드를 전기적으로 연결하는 다수의 전기적 연결수단;상기 패키지 하우징의 내부에 충진된 몰딩부;를 포함하며,상기 다수의 리드 중에서 적어도 하나의 리드는 복수의 LED에 전기적으로 공통 연결된 LED 패키지.
- 제 1항에 있어서,상기 전기적 연결수단은 와이어인 LED 패키지.
- 제 1항에 있어서,상기 LED에 구동을 위한 제 1 전극과 제 2 전극이 형성됨에 있어, 상기 LED의 상부에 상기 제 1 전극과 상기 제 2 전극이 모두 형성되거나 또는 상기 LED의 상부에 상기 제 1 전극이 형성되고 하부에 상기 제 2 전극이 형성된 LED 패키지.
- 제 1항에 있어서,상기 복수의 LED에 전기적으로 공통 연결되는 리드는 상기 연결된 복수의 LED에 대하여 양극의 기능을 수행하는 LED 패키지.
- 제 1항에 있어서,상기 복수의 LED에 전기적으로 공통 연결되는 리드는 상기 연결된 복수의 LED에 대하여 음극의 기능을 수행하는 LED 패키지.
- 제 1항에 있어서,상기 복수의 LED는 순차적으로 직렬 연결된 LED 패키지.
- 제 1항에 있어서,상기 몰딩부는 투명 에폭시 또는 실리콘의 재질로 형성된 몰딩 수지이고, 상기 LED와 상기 전기적 연결수단을 덮도록 충진된 LED 패키지.
- 제 1항에 있어서,상기 몰딩부에는 소정 비율의 형광체 물질을 함유하여 상기 LED에서 발생하는 광과 반응하여 소정 색상으로 발광하는 LED 패키지.
- 제 1 항에 있어서,상기 LED 각각의 광출력비를 조절하여 백색발광을 수행하는 LED 패키지.
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060017476A KR100828891B1 (ko) | 2006-02-23 | 2006-02-23 | Led 패키지 |
JP2007038381A JP2007227925A (ja) | 2006-02-23 | 2007-02-19 | Ledパッケージ及びその製造方法 |
US11/709,764 US8115214B2 (en) | 2006-02-23 | 2007-02-23 | Light emitting diode package and method of manufacturing the same |
US12/772,968 US7956378B2 (en) | 2006-02-23 | 2010-05-03 | Light emitting diode package and method of manufacturing the same |
US12/814,336 US8471271B2 (en) | 2006-02-23 | 2010-06-11 | Light emitting diode package and method of manufacturing the same |
US13/914,119 US9029903B2 (en) | 2006-02-23 | 2013-06-10 | Light emitting diode package and method of manufacturing the same |
JP2013247571A JP2014060443A (ja) | 2006-02-23 | 2013-11-29 | Ledパッケージ及びその製造方法 |
JP2013266885A JP5813086B2 (ja) | 2006-02-23 | 2013-12-25 | Ledパッケージ及びその製造方法 |
US14/704,678 US9502617B2 (en) | 2006-02-23 | 2015-05-05 | Light emitting diode package and method of manufacturing the same |
JP2017025979A JP6648048B2 (ja) | 2006-02-23 | 2017-02-15 | Ledパッケージ及びその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060017476A KR100828891B1 (ko) | 2006-02-23 | 2006-02-23 | Led 패키지 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070087270A true KR20070087270A (ko) | 2007-08-28 |
KR100828891B1 KR100828891B1 (ko) | 2008-05-09 |
Family
ID=38427296
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020060017476A KR100828891B1 (ko) | 2006-02-23 | 2006-02-23 | Led 패키지 |
Country Status (3)
Country | Link |
---|---|
US (5) | US8115214B2 (ko) |
JP (4) | JP2007227925A (ko) |
KR (1) | KR100828891B1 (ko) |
Cited By (5)
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WO2009113838A3 (ko) * | 2008-03-14 | 2009-11-05 | 엘지이노텍주식회사 | 발광 장치 및 이를 구비한 표시장치 |
US8638037B2 (en) | 2010-04-23 | 2014-01-28 | Samsung Electronics Co., Ltd. | Lead frame for light emitting device package, light emitting device package, and illumination apparatus employing the light emitting device package |
US8796706B2 (en) | 2009-07-03 | 2014-08-05 | Seoul Semiconductor Co., Ltd. | Light emitting diode package |
TWI476963B (zh) * | 2009-08-18 | 2015-03-11 | Samsung Electronics Co Ltd | 發光二極體封裝件 |
KR20190028134A (ko) | 2017-09-08 | 2019-03-18 | 중앙대학교 산학협력단 | 비콘의 저전력 위치기반 통신 기술을 이용한 효율적인 호텔 서비스 대체 어플리케이션 장치 및 방법 |
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KR100828891B1 (ko) * | 2006-02-23 | 2008-05-09 | 엘지이노텍 주식회사 | Led 패키지 |
WO2008024761A2 (en) | 2006-08-21 | 2008-02-28 | Innotec Corporation | Electrical device having boardless electrical component mounting arrangement |
US7712933B2 (en) | 2007-03-19 | 2010-05-11 | Interlum, Llc | Light for vehicles |
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KR100986359B1 (ko) * | 2008-03-14 | 2010-10-08 | 엘지이노텍 주식회사 | 발광 장치 및 이를 구비한 표시 장치 |
US8278670B2 (en) | 2008-03-14 | 2012-10-02 | Lg Innotek Co., Ltd. | Light emitting apparatus and display apparatus having the same |
US8796706B2 (en) | 2009-07-03 | 2014-08-05 | Seoul Semiconductor Co., Ltd. | Light emitting diode package |
US9048391B2 (en) | 2009-07-03 | 2015-06-02 | Seoul Semiconductor Co., Ltd. | Light emitting diode package |
US9257624B2 (en) | 2009-07-03 | 2016-02-09 | Seoul Semiconductor Co., Ltd. | Light emitting diode package |
US9472743B2 (en) | 2009-07-03 | 2016-10-18 | Seoul Semiconductor Co., Ltd. | Light emitting diode package |
US9786827B2 (en) | 2009-07-03 | 2017-10-10 | Seoul Semiconductor Co., Ltd. | Light emitting diode package |
TWI476963B (zh) * | 2009-08-18 | 2015-03-11 | Samsung Electronics Co Ltd | 發光二極體封裝件 |
US8638037B2 (en) | 2010-04-23 | 2014-01-28 | Samsung Electronics Co., Ltd. | Lead frame for light emitting device package, light emitting device package, and illumination apparatus employing the light emitting device package |
US9099332B2 (en) | 2010-04-23 | 2015-08-04 | Samsung Electronics Co., Ltd. | Lead frame for light emitting device package, light emitting device package, and illumination apparatus employing the light emitting device package |
KR20190028134A (ko) | 2017-09-08 | 2019-03-18 | 중앙대학교 산학협력단 | 비콘의 저전력 위치기반 통신 기술을 이용한 효율적인 호텔 서비스 대체 어플리케이션 장치 및 방법 |
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JP2014060443A (ja) | 2014-04-03 |
JP5813086B2 (ja) | 2015-11-17 |
US9502617B2 (en) | 2016-11-22 |
US8471271B2 (en) | 2013-06-25 |
JP6648048B2 (ja) | 2020-02-14 |
US20100258823A1 (en) | 2010-10-14 |
JP2007227925A (ja) | 2007-09-06 |
US7956378B2 (en) | 2011-06-07 |
JP2014112688A (ja) | 2014-06-19 |
US20150235997A1 (en) | 2015-08-20 |
US20130270586A1 (en) | 2013-10-17 |
US9029903B2 (en) | 2015-05-12 |
JP2017085186A (ja) | 2017-05-18 |
US8115214B2 (en) | 2012-02-14 |
KR100828891B1 (ko) | 2008-05-09 |
US20070194333A1 (en) | 2007-08-23 |
US20100213475A1 (en) | 2010-08-26 |
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