JP2013135082A - 発光装置 - Google Patents
発光装置 Download PDFInfo
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- JP2013135082A JP2013135082A JP2011284431A JP2011284431A JP2013135082A JP 2013135082 A JP2013135082 A JP 2013135082A JP 2011284431 A JP2011284431 A JP 2011284431A JP 2011284431 A JP2011284431 A JP 2011284431A JP 2013135082 A JP2013135082 A JP 2013135082A
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- Prior art keywords
- light
- light emitting
- emitting device
- phosphor
- emitting element
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 47
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 229920005989 resin Polymers 0.000 description 20
- 239000011347 resin Substances 0.000 description 20
- 239000003086 colorant Substances 0.000 description 7
- 238000007789 sealing Methods 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000295 emission spectrum Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
【解決手段】本発明の一態様に係る発光装置1は、基板2と、基板2に実装された、LEDチップ4a、4bとその表面上の蛍光体層5a、5bを有する発光素子3a、3bと、を有し、発光素子3a、3bが発する光の色度座標のx値の偏差の最大値が0.0125以上である。
【選択図】図1
Description
図1は、本発明の実施の形態に係る発光装置1の垂直断面図である。発光装置1は、基板2と、基板2上に実装された発光素子3a、3bと、基板2上に発光素子3a、3bを囲む又は挟むように形成されたリフレクタ6と、基板2上のリフレクタ6の内側にLEDチップ3a、3bを覆うように充填された透明封止樹脂7を有する。
上記実施の形態によれば、従来は廃棄されていたような製品規格から外れた色度を有するLEDチップを適切な条件で組み合わせて用いることにより、所望の色度の光を発する発光装置を得ることができる。このため、蛍光体層の膜厚の制御が難しいために色度に個体差が生じやすい、LEDチップ及びその表面上の蛍光体層を有する発光素子の歩留まりを向上させることができる。
2 基板
3a、3b 発行素子
4a、4b LEDチップ
5a、5b 蛍光体層
Claims (4)
- 基板と、
前記基板に実装された、LEDチップとその表面上の蛍光体層を有する複数の発光素子と、
を有し、
前記複数の発光素子が発する光の色度座標のx値の偏差の最大値が0.0125以上である発光装置。 - 前記色度座標のx値の偏差の最大値は0.1000以下である、
請求項1に記載の発光装置。 - 前記色度座標のx値の偏差の最大値が0.0250以上である、
請求項1又は2に記載の発光装置。 - 前記色度座標のx値の偏差の最大値が0.0375以上である、
請求項3に記載の発光装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011284431A JP2013135082A (ja) | 2011-12-26 | 2011-12-26 | 発光装置 |
US13/691,577 US9236414B2 (en) | 2011-12-26 | 2012-11-30 | Light-emitting device |
KR1020120152068A KR20130074762A (ko) | 2011-12-26 | 2012-12-24 | 발광 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011284431A JP2013135082A (ja) | 2011-12-26 | 2011-12-26 | 発光装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2013135082A true JP2013135082A (ja) | 2013-07-08 |
Family
ID=48653655
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011284431A Pending JP2013135082A (ja) | 2011-12-26 | 2011-12-26 | 発光装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9236414B2 (ja) |
JP (1) | JP2013135082A (ja) |
KR (1) | KR20130074762A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015070242A (ja) * | 2013-10-01 | 2015-04-13 | シチズン電子株式会社 | 半導体発光装置 |
US9502317B2 (en) | 2014-06-26 | 2016-11-22 | Toyoda Gosei Co., Ltd. | Method for manufacturing light emitting device |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9761763B2 (en) * | 2012-12-21 | 2017-09-12 | Soraa, Inc. | Dense-luminescent-materials-coated violet LEDs |
KR20180090002A (ko) * | 2017-02-02 | 2018-08-10 | 서울반도체 주식회사 | 발광 다이오드 패키지 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002170999A (ja) * | 2000-12-04 | 2002-06-14 | Nichia Chem Ind Ltd | 発光装置及びその製造方法 |
JP2009088299A (ja) * | 2007-09-29 | 2009-04-23 | Nichia Corp | 発光素子及びこれを備える発光装置 |
WO2009101718A1 (ja) * | 2008-02-13 | 2009-08-20 | Canon Components, Inc. | 白色発光ダイオード、白色発光装置及びそれらを用いたライン状照明装置 |
JP2011040366A (ja) * | 2010-03-05 | 2011-02-24 | Canon Components Inc | 画像読取装置における白色発光装置およびそれを用いたライン状照明装置 |
JP2011249751A (ja) * | 2010-05-26 | 2011-12-08 | Intematix Technology Center Corp | Ledパッケージ構造体 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4081985B2 (ja) | 2001-03-02 | 2008-04-30 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
JPWO2003034508A1 (ja) | 2001-10-12 | 2005-02-03 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
US6943379B2 (en) * | 2002-04-04 | 2005-09-13 | Toyoda Gosei Co., Ltd. | Light emitting diode |
KR101030068B1 (ko) | 2002-07-08 | 2011-04-19 | 니치아 카가쿠 고교 가부시키가이샤 | 질화물 반도체 소자의 제조방법 및 질화물 반도체 소자 |
KR100533635B1 (ko) * | 2003-11-20 | 2005-12-06 | 삼성전기주식회사 | Led 패키지 |
JP4667803B2 (ja) * | 2004-09-14 | 2011-04-13 | 日亜化学工業株式会社 | 発光装置 |
JP5106761B2 (ja) * | 2005-07-14 | 2012-12-26 | 株式会社フジクラ | 高演色性発光ダイオードランプユニット |
KR100828891B1 (ko) * | 2006-02-23 | 2008-05-09 | 엘지이노텍 주식회사 | Led 패키지 |
US8531126B2 (en) | 2008-02-13 | 2013-09-10 | Canon Components, Inc. | White light emitting apparatus and line illuminator using the same in image reading apparatus |
JPWO2011021402A1 (ja) * | 2009-08-21 | 2013-01-17 | パナソニック株式会社 | 発光装置 |
KR20110073114A (ko) * | 2009-12-23 | 2011-06-29 | 엘지디스플레이 주식회사 | 발광 장치 및 그 제조 방법 |
-
2011
- 2011-12-26 JP JP2011284431A patent/JP2013135082A/ja active Pending
-
2012
- 2012-11-30 US US13/691,577 patent/US9236414B2/en not_active Expired - Fee Related
- 2012-12-24 KR KR1020120152068A patent/KR20130074762A/ko active Search and Examination
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002170999A (ja) * | 2000-12-04 | 2002-06-14 | Nichia Chem Ind Ltd | 発光装置及びその製造方法 |
JP2009088299A (ja) * | 2007-09-29 | 2009-04-23 | Nichia Corp | 発光素子及びこれを備える発光装置 |
WO2009101718A1 (ja) * | 2008-02-13 | 2009-08-20 | Canon Components, Inc. | 白色発光ダイオード、白色発光装置及びそれらを用いたライン状照明装置 |
JP2011040366A (ja) * | 2010-03-05 | 2011-02-24 | Canon Components Inc | 画像読取装置における白色発光装置およびそれを用いたライン状照明装置 |
JP2011249751A (ja) * | 2010-05-26 | 2011-12-08 | Intematix Technology Center Corp | Ledパッケージ構造体 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015070242A (ja) * | 2013-10-01 | 2015-04-13 | シチズン電子株式会社 | 半導体発光装置 |
US9502317B2 (en) | 2014-06-26 | 2016-11-22 | Toyoda Gosei Co., Ltd. | Method for manufacturing light emitting device |
Also Published As
Publication number | Publication date |
---|---|
US20130161659A1 (en) | 2013-06-27 |
KR20130074762A (ko) | 2013-07-04 |
US9236414B2 (en) | 2016-01-12 |
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