KR20080006507A - 조명 장치 - Google Patents
조명 장치 Download PDFInfo
- Publication number
- KR20080006507A KR20080006507A KR1020070122255A KR20070122255A KR20080006507A KR 20080006507 A KR20080006507 A KR 20080006507A KR 1020070122255 A KR1020070122255 A KR 1020070122255A KR 20070122255 A KR20070122255 A KR 20070122255A KR 20080006507 A KR20080006507 A KR 20080006507A
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- South Korea
- Prior art keywords
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- light emitting
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Classifications
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- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
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- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
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- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
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- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B60R11/00—Arrangements for holding or mounting articles, not otherwise provided for
- B60R2011/0001—Arrangements for holding or mounting articles, not otherwise provided for characterised by position
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- B60R2300/80—Details of viewing arrangements using cameras and displays, specially adapted for use in a vehicle characterised by the intended use of the viewing arrangement
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- H—ELECTRICITY
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- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
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- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6835—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during build up manufacturing of active devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68363—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
Description
Claims (6)
- 조명 장치에 있어서:가요성 기판;상기 가요성 기판상의 접착층; 및상기 접착층상의 발광 소자를 포함하고,상기 발광 소자는 제1 전극, 제2 전극, 및 상기 제1 전극과 상기 제2 전극 사이의 발광층을 포함하고, 상기 발광층은 유기 화합물을 포함하는, 조명 장치.
- 자동차에 탑재되는 조명 장치에 있어서:가요성 기판;상기 가요성 기판상의 접착층; 및상기 접착층상의 발광 소자를 포함하고,상기 발광 소자는 제1 전극, 제2 전극, 및 상기 제1 전극과 상기 제2 전극 사이의 발광층을 포함하고, 상기 발광층은 유기 화합물을 포함하는, 조명 장치.
- 제1항 또는 제2항에 따른 조명 장치는 수동 매트릭스형인, 조명 장치.
- 제1항 또는 제2항에 있어서,상기 발광층은 형광을 방사하는 발광 물질을 더 포함하는, 조명 장치.
- 제1항 또는 제2항에 있어서,상기 발광층은 인광을 방사하는 발광 물질을 더 포함하는, 조명 장치.
- 제1항 또는 제2항에 있어서,상기 유기 화합물은 고분자 화합물(high molecular compound)인, 조명 장치.
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JPJP-P-2001-00367412 | 2001-11-30 | ||
JP2001367412 | 2001-11-30 |
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KR1020020074787A Division KR100944887B1 (ko) | 2001-11-30 | 2002-11-28 | 반도체 장치의 제조 방법 |
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KR1020090056860A Division KR100929129B1 (ko) | 2001-11-30 | 2009-06-25 | 표시 장치의 제조 방법 |
KR1020090056857A Division KR100929128B1 (ko) | 2001-11-30 | 2009-06-25 | 반도체 장치의 제조 방법 |
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KR1020020074787A KR100944887B1 (ko) | 2001-11-30 | 2002-11-28 | 반도체 장치의 제조 방법 |
KR1020070122255A KR100929127B1 (ko) | 2001-11-30 | 2007-11-28 | 조명 장치 |
KR1020070122256A KR101095294B1 (ko) | 2001-11-30 | 2007-11-28 | 자동차 |
KR1020090056857A KR100929128B1 (ko) | 2001-11-30 | 2009-06-25 | 반도체 장치의 제조 방법 |
KR1020090056860A KR100929129B1 (ko) | 2001-11-30 | 2009-06-25 | 표시 장치의 제조 방법 |
KR1020090103929A KR101098781B1 (ko) | 2001-11-30 | 2009-10-30 | 표시 장치를 갖는 자동차 |
KR1020090108435A KR100952320B1 (ko) | 2001-11-30 | 2009-11-11 | 반도체 장치의 제조 방법 |
KR1020100092767A KR101243622B1 (ko) | 2001-11-30 | 2010-09-24 | 디스플레이 장치를 포함하는 자동차 |
KR1020110111558A KR101142313B1 (ko) | 2001-11-30 | 2011-10-28 | 발광 장치를 제조하는 방법 |
KR1020120093695A KR101219070B1 (ko) | 2001-11-30 | 2012-08-27 | 디스플레이 장치를 포함하는 자동차 |
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KR1020020074787A KR100944887B1 (ko) | 2001-11-30 | 2002-11-28 | 반도체 장치의 제조 방법 |
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KR1020070122256A KR101095294B1 (ko) | 2001-11-30 | 2007-11-28 | 자동차 |
KR1020090056857A KR100929128B1 (ko) | 2001-11-30 | 2009-06-25 | 반도체 장치의 제조 방법 |
KR1020090056860A KR100929129B1 (ko) | 2001-11-30 | 2009-06-25 | 표시 장치의 제조 방법 |
KR1020090103929A KR101098781B1 (ko) | 2001-11-30 | 2009-10-30 | 표시 장치를 갖는 자동차 |
KR1020090108435A KR100952320B1 (ko) | 2001-11-30 | 2009-11-11 | 반도체 장치의 제조 방법 |
KR1020100092767A KR101243622B1 (ko) | 2001-11-30 | 2010-09-24 | 디스플레이 장치를 포함하는 자동차 |
KR1020110111558A KR101142313B1 (ko) | 2001-11-30 | 2011-10-28 | 발광 장치를 제조하는 방법 |
KR1020120093695A KR101219070B1 (ko) | 2001-11-30 | 2012-08-27 | 디스플레이 장치를 포함하는 자동차 |
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US (6) | US7335573B2 (ko) |
JP (13) | JP5020370B2 (ko) |
KR (10) | KR100944887B1 (ko) |
CN (4) | CN103258839B (ko) |
TW (1) | TWI264121B (ko) |
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