JP6670683B2 - キャリア基板と樹脂層からなるワークの分離方法および分離装置 - Google Patents
キャリア基板と樹脂層からなるワークの分離方法および分離装置 Download PDFInfo
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Description
図1に、分離対象としてのワーク1Aを示す。同図に示すように、ワーク1Aは、一端2aおよび該一端2aに対向する他端2bを有する矩形状のキャリア基板2と、その表面上に形成された略矩形状の樹脂層3とからなる。キャリア基板2は、0.5〜1.1mm厚のガラス基板からなる。樹脂層3は、ポリイミド樹脂を塗布することにより形成されたポリイミド層に発光素子(有機EL素子)のアレイを形成したものであり、約10μmの厚みを有する。
図13に、本発明の第1変形例に係る分離方法のフロー図を示す。同図に示すように、本変形例に係る分離方法は、ステップS5(第3ポジションへの搬送)、ステップS6(第1切込工程)およびステップS9(第2切込工程)を備えていない。また、これに対応して、本変形例に係る分離装置20Bは、第4カッターユニット29が省略されている(図14参照)。このため、制御部80Bは、第4カッターユニット29の制御を行わない(図15参照)。
図16に、本発明の第2変形例に係る分離装置20Cを示す。同図に示すように、本変形例に係る分離装置20Cは、第2支持ローラーユニット28を備えていない。このため、制御部80Cは、第2支持ローラーユニット28の制御を行わない(図17参照)。
図18に、図3に示すワーク1Bの変形例を示す。同図に示すように、変形例に係るワーク1B’においては、保護膜6’が樹脂層3の素子部4および縁部5を完全に覆っている。すなわち、保護膜6’のX方向およびY方向の寸法は、樹脂層3の寸法よりも大きい。ただし、保護膜6’のX方向およびY方向の寸法は、キャリア基板2の寸法よりも小さい。
2 キャリア基板
2a (キャリア基板の)一端
2b (キャリア基板の)他端
3 樹脂層
4 素子部
5,5a,5b,5c,5d 縁部
6,6’ 保護膜
7 切り込み
10 搬送ローラー
11 位置決め板
12 第1カッター
13 第2カッター
14 第3カッター
20A,20B,20C 分離装置
21 吸着ステージ
21a 吸着面
21b 吸着ノズル
22 基台
23 外側ガイド
24 内側ガイド
25 一端側支持ユニット
26 他端側支持ユニット
27 第1支持ローラーユニット
28 第2支持ローラーユニット
29 第4カッターユニット
30 第1ピロー
31 第1ピロー第1支持部(第1ピロー昇降手段)
32 第1ピロー第2支持部(第1ピロー昇降手段)
33 ガイド(第1ピロー昇降手段)
34 第1ピロー走行手段
40 第2ピロー
41 第2ピロー第1支持部(第2ピロー昇降手段)
42 第2ピロー第2支持部(第2ピロー昇降手段)
43 ガイド(第2ピロー昇降手段)
44 第2ピロー走行手段
50 第1支持ローラー
51 第1支持ローラー昇降手段
52 第1支持ローラー走行手段
60 第2支持ローラー
61 第2支持ローラー昇降手段
62 第2支持ローラー走行手段
70 第4カッター
71 第4カッター第1支持部(第4カッター昇降手段)
72 第4カッター第2支持部(第4カッター昇降手段)
73 ガイド(第4カッター昇降手段)
74 第4カッター走行手段
75 ガイド
80A,80B,80C 制御部
81 ポンプ
90 第3支持ローラー
Claims (11)
- 一端および該一端に対向する他端を有する矩形状のキャリア基板および該キャリア基板の表面上に形成された略矩形状の樹脂層からなるワークを前記キャリア基板と前記樹脂層とに分離する分離方法であって、
前記樹脂層の表面を保護膜で覆う保護工程と、
前記保護膜で覆われた前記樹脂層を平坦な吸着面を有する吸着ステージに吸着させる吸着保持工程と、
前記キャリア基板の前記一端から前記他端に向かって移動可能な支持ローラーに前記キャリア基板の前記一端側の裏面を支持させる支持工程と、
前記支持ローラーを前記他端に向かって移動させながら前記キャリア基板の前記一端を下降させていくことにより、前記キャリア基板を前記支持ローラーによって支持された部分において屈曲させながら前記樹脂層から剥がしていく剥離工程と、
を備えたことを特徴とする分離方法。 - 前記樹脂層が、前記キャリア基板の表面上に塗布により形成されたポリイミド層であることを特徴とする請求項1に記載の分離方法。
- 前記樹脂層が、発光素子のアレイが形成された略矩形状の素子部と、前記素子部を取り囲む4つの縁部とを有することを特徴とする請求項1または請求項2に記載の分離方法。
- 前記保護工程と前記吸着保持工程の間に実行される、前記キャリア基板の裏面側から前記樹脂層にレーザを照射して前記樹脂層と前記キャリア基板との結合を解くレーザリフトオフ工程をさらに備えたことを特徴とする請求項3に記載の分離方法。
- 前記レーザリフトオフ工程と前記吸着保持工程の間に実行される、前記キャリア基板の前記一端に平行な前記縁部を除く3つの前記縁部に切り込みを入れる第1切込工程をさらに備えたことを特徴とする請求項4に記載の分離方法。
- 前記支持工程と前記剥離工程の間に実行される、前記キャリア基板の前記一端に平行な前記縁部に切り込みを入れる第2切込工程をさらに備えたことを特徴とする請求項5に記載の分離方法。
- 一端および該一端に対向する他端を有する矩形状のキャリア基板および該キャリア基板の表面上に形成された略矩形状の樹脂層からなるワークを前記キャリア基板と前記樹脂層とに分離する分離装置であって、
下方を向いた平坦な吸着面を有し、前記樹脂層上に予め設けられた保護膜を介して該樹脂層側から前記ワークを吸着保持する吸着ステージと、
吸着保持された前記ワークを構成する前記キャリア基板の前記一端から前記他端に向かって移動可能な、前記キャリア基板の裏面を下方から支持する支持ローラーと、
前記キャリア基板の前記一端の上下への移動を規制する、昇降可能な一端側支持部と、
前記キャリア基板の前記他端の上下への移動を規制する、昇降可能な他端側支持部と、
前記支持ローラーの移動、並びに前記一端側支持部および前記他端側支持部の昇降を制御する制御部と、を備え、
前記制御部は、前記支持ローラーを前記他端に向かって移動させながら、前記他端側支持部を昇降させずに前記一端側支持部を下降させて前記キャリア基板の前記一端を下降させていくことにより、前記キャリア基板を前記支持ローラーによって支持された部分において屈曲させながら前記樹脂層から剥がしていく
ことを特徴とする分離装置。 - 前記樹脂層が、前記キャリア基板の表面上に塗布により形成されたポリイミド層であることを特徴とする請求項7に記載の分離装置。
- 前記樹脂層が、発光素子のアレイが形成された略矩形状の素子部と、前記素子部を取り囲む4つの縁部とを有することを特徴とする請求項7または請求項8に記載の分離装置。
- 前記キャリア基板の前記一端に平行な前記縁部を除く3つの前記縁部に、予め切り込みが入れられていることを特徴とする請求項9に記載の分離装置。
- 前記キャリア基板の前記一端に平行な前記縁部に切れ込みを入れるカッターユニットをさらに備えたことを特徴とする請求項10に記載の分離装置。
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