KR101098781B1 - 표시 장치를 갖는 자동차 - Google Patents
표시 장치를 갖는 자동차 Download PDFInfo
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- KR101098781B1 KR101098781B1 KR1020090103929A KR20090103929A KR101098781B1 KR 101098781 B1 KR101098781 B1 KR 101098781B1 KR 1020090103929 A KR1020090103929 A KR 1020090103929A KR 20090103929 A KR20090103929 A KR 20090103929A KR 101098781 B1 KR101098781 B1 KR 101098781B1
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- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6835—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during build up manufacturing of active devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68363—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
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- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
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Abstract
Description
Claims (8)
- 유리창; 및상기 유리창에 부착된 표시 장치를 포함하고,상기 표시 장치는:가요성 기판;상기 가요성 기판 위의 접착층;상기 접착층 위의 산화물층; 및상기 산화물층 위의 발광 소자를 포함하고,상기 발광 소자는 제1 전극, 제2 전극, 및 상기 제1 전극과 상기 제2 전극 사이의 발광층을 포함하고, 상기 발광층은 유기 화합물을 포함하고,상기 산화물층은 상기 발광 소자가 형성되는 기판으로부터 상기 발광 소자를 박리하기 위해 사용되고,상기 산화물층은 금속 산화 물질을 포함하는, 표시 장치를 갖는 자동차.
- 유리창;상기 유리창에 부착된 표시 장치; 및카메라를 포함하고,상기 표시 장치는:가요성 기판;상기 가요성 기판 위의 접착층;상기 접착층 위의 산화물층; 및상기 산화물층 위의 발광 소자를 포함하고,상기 발광 소자는 제1 전극, 제2 전극, 및 상기 제1 전극과 상기 제2 전극 사이의 발광층을 포함하고, 상기 발광층은 유기 화합물을 포함하고,상기 표시 장치는 상기 카메라에 의해 포착된 화상을 표시하고,상기 산화물층은 상기 발광 소자가 형성되는 기판으로부터 상기 발광 소자를 박리하기 위해 사용되고,상기 산화물층은 금속 산화 물질을 포함하는, 표시 장치를 갖는 자동차.
- 제1항 또는 제2항에 있어서,상기 표시 장치는 수동 매트릭스형인, 표시 장치를 갖는 자동차.
- 제1항 또는 제2항에 있어서,상기 발광층은 형광을 방사하는 발광 물질을 더 포함하는, 표시 장치를 갖는 자동차.
- 제1항 또는 제2항에 있어서,상기 발광층은 인광을 방사하는 발광 물질을 더 포함하는, 표시 장치를 갖는 자동차.
- 제1항 또는 제2항에 있어서,상기 유기 화합물은 고분자 화합물인, 표시 장치를 갖는 자동차.
- 삭제
- 제2항에 있어서,상기 화상은 운전자의 사각지대의 시야를 나타내는, 표시 장치를 갖는 자동차.
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JPJP-P-2001-00367412 | 2001-11-30 | ||
JP2001367412 | 2001-11-30 |
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KR1020070122256A Division KR101095294B1 (ko) | 2001-11-30 | 2007-11-28 | 자동차 |
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KR1020100092767A Division KR101243622B1 (ko) | 2001-11-30 | 2010-09-24 | 디스플레이 장치를 포함하는 자동차 |
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KR1020070122255A KR100929127B1 (ko) | 2001-11-30 | 2007-11-28 | 조명 장치 |
KR1020070122256A KR101095294B1 (ko) | 2001-11-30 | 2007-11-28 | 자동차 |
KR1020090056857A KR100929128B1 (ko) | 2001-11-30 | 2009-06-25 | 반도체 장치의 제조 방법 |
KR1020090056860A KR100929129B1 (ko) | 2001-11-30 | 2009-06-25 | 표시 장치의 제조 방법 |
KR1020090103929A KR101098781B1 (ko) | 2001-11-30 | 2009-10-30 | 표시 장치를 갖는 자동차 |
KR1020090108435A KR100952320B1 (ko) | 2001-11-30 | 2009-11-11 | 반도체 장치의 제조 방법 |
KR1020100092767A KR101243622B1 (ko) | 2001-11-30 | 2010-09-24 | 디스플레이 장치를 포함하는 자동차 |
KR1020110111558A KR101142313B1 (ko) | 2001-11-30 | 2011-10-28 | 발광 장치를 제조하는 방법 |
KR1020120093695A KR101219070B1 (ko) | 2001-11-30 | 2012-08-27 | 디스플레이 장치를 포함하는 자동차 |
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KR1020070122255A KR100929127B1 (ko) | 2001-11-30 | 2007-11-28 | 조명 장치 |
KR1020070122256A KR101095294B1 (ko) | 2001-11-30 | 2007-11-28 | 자동차 |
KR1020090056857A KR100929128B1 (ko) | 2001-11-30 | 2009-06-25 | 반도체 장치의 제조 방법 |
KR1020090056860A KR100929129B1 (ko) | 2001-11-30 | 2009-06-25 | 표시 장치의 제조 방법 |
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KR1020090108435A KR100952320B1 (ko) | 2001-11-30 | 2009-11-11 | 반도체 장치의 제조 방법 |
KR1020100092767A KR101243622B1 (ko) | 2001-11-30 | 2010-09-24 | 디스플레이 장치를 포함하는 자동차 |
KR1020110111558A KR101142313B1 (ko) | 2001-11-30 | 2011-10-28 | 발광 장치를 제조하는 방법 |
KR1020120093695A KR101219070B1 (ko) | 2001-11-30 | 2012-08-27 | 디스플레이 장치를 포함하는 자동차 |
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US (6) | US7335573B2 (ko) |
JP (13) | JP5020370B2 (ko) |
KR (10) | KR100944887B1 (ko) |
CN (4) | CN103258839B (ko) |
TW (1) | TWI264121B (ko) |
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JP2001261864A (ja) * | 2000-03-16 | 2001-09-26 | Ube Nitto Kasei Co Ltd | 有機−無機ハイブリッド傾斜材料およびその用途 |
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US8006164B2 (en) | 2006-09-29 | 2011-08-23 | Intel Corporation | Memory cell supply voltage control based on error detection |
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