KR20020079516A - 발광장치 - Google Patents

발광장치 Download PDF

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Publication number
KR20020079516A
KR20020079516A KR1020020019014A KR20020019014A KR20020079516A KR 20020079516 A KR20020079516 A KR 20020079516A KR 1020020019014 A KR1020020019014 A KR 1020020019014A KR 20020019014 A KR20020019014 A KR 20020019014A KR 20020079516 A KR20020079516 A KR 20020079516A
Authority
KR
South Korea
Prior art keywords
light emitting
semiconductor
emitting device
opening
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
KR1020020019014A
Other languages
English (en)
Korean (ko)
Inventor
니타고이치
시모무라겐지
오시오히로아키
고마츠다케시
Original Assignee
가부시끼가이샤 도시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 도시바 filed Critical 가부시끼가이샤 도시바
Publication of KR20020079516A publication Critical patent/KR20020079516A/ko
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
    • F24C15/00—Details
    • F24C15/20—Removing cooking fumes
    • F24C15/2071—Removing cooking fumes mounting of cooking hood
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/831—Electrodes characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/882—Scattering means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H10W72/07252—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/221—Structures or relative sizes
    • H10W72/227—Multiple bumps having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Semiconductor Lasers (AREA)
KR1020020019014A 2001-04-09 2002-04-08 발광장치 Abandoned KR20020079516A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001110676A JP2002314143A (ja) 2001-04-09 2001-04-09 発光装置
JPJP-P-2001-00110676 2001-04-09

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR10-2004-0077336A Division KR100514609B1 (ko) 2001-04-09 2004-09-24 발광장치

Publications (1)

Publication Number Publication Date
KR20020079516A true KR20020079516A (ko) 2002-10-19

Family

ID=18962399

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020020019014A Abandoned KR20020079516A (ko) 2001-04-09 2002-04-08 발광장치
KR10-2004-0077336A Expired - Fee Related KR100514609B1 (ko) 2001-04-09 2004-09-24 발광장치
KR1020050013570A Ceased KR20050039764A (ko) 2001-04-09 2005-02-18 발광장치

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR10-2004-0077336A Expired - Fee Related KR100514609B1 (ko) 2001-04-09 2004-09-24 발광장치
KR1020050013570A Ceased KR20050039764A (ko) 2001-04-09 2005-02-18 발광장치

Country Status (5)

Country Link
US (2) US6747293B2 (https=)
EP (1) EP1249874A3 (https=)
JP (1) JP2002314143A (https=)
KR (3) KR20020079516A (https=)
CN (2) CN1797766A (https=)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100707870B1 (ko) * 2004-04-27 2007-04-13 럭스피아(주) 복수개의 발광 다이오드칩이 배치된 발광 다이오드 패캐지
KR100709092B1 (ko) * 2004-09-30 2007-04-18 교리츠 엘렉스 가부시키가이샤 반사판, 발광 다이오드용 패키지 및 발광 다이오드
KR100780215B1 (ko) 2006-07-27 2007-11-27 삼성전기주식회사 다수의 엘이디가 실장된 엘이디 패키지
KR100853240B1 (ko) * 2005-04-08 2008-08-20 샤프 가부시키가이샤 발광다이오드
KR100890724B1 (ko) * 2006-04-26 2009-03-26 롬 앤드 하아스 컴패니 향상된 광 추출 효율을 가지는 발광 장치 및 그 장치의제조 방법
KR101115536B1 (ko) * 2010-05-11 2012-02-27 서울옵토디바이스주식회사 다색 발광 다이오드
US8421088B2 (en) 2007-02-22 2013-04-16 Sharp Kabushiki Kaisha Surface mounting type light emitting diode
US8604506B2 (en) 2007-02-22 2013-12-10 Sharp Kabushiki Kaisha Surface mounting type light emitting diode and method for manufacturing the same
KR20160026159A (ko) * 2014-08-29 2016-03-09 서울반도체 주식회사 발광 다이오드 패키지
KR20160041469A (ko) * 2014-10-07 2016-04-18 서울반도체 주식회사 발광 다이오드 패키지
KR20160041672A (ko) * 2014-10-08 2016-04-18 서울반도체 주식회사 발광 다이오드 패키지
KR20160060397A (ko) * 2014-11-20 2016-05-30 서울반도체 주식회사 발광 장치
KR20160060398A (ko) * 2014-11-20 2016-05-30 서울반도체 주식회사 발광 장치
KR20160101056A (ko) * 2013-12-18 2016-08-24 코닌클리케 필립스 엔.브이. Led 형광체 패키지를 위한 반사성 땜납 마스크 층
KR20180097474A (ko) * 2018-08-16 2018-08-31 엘지이노텍 주식회사 발광소자 패키지
US12349519B2 (en) 2014-10-08 2025-07-01 Seoul Semiconductor Co., Ltd. Light emitting device

Families Citing this family (197)

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JP2002314138A (ja) * 2001-04-09 2002-10-25 Toshiba Corp 発光装置
JP4101468B2 (ja) * 2001-04-09 2008-06-18 豊田合成株式会社 発光装置の製造方法
JP2002374007A (ja) * 2001-06-15 2002-12-26 Toyoda Gosei Co Ltd 発光装置
DE10241989A1 (de) 2001-11-30 2003-06-18 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
USD557224S1 (en) 2001-12-28 2007-12-11 Nichia Corporation Light emitting diode
USD547736S1 (en) 2001-12-28 2007-07-31 Nichia Corporation Light emitting diode
USD534505S1 (en) * 2001-12-28 2007-01-02 Nichia Corporation Light emitting diode
USD565516S1 (en) 2001-12-28 2008-04-01 Nichia Corporation Light emitting diode
DE10237084A1 (de) * 2002-08-05 2004-02-19 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines elektrischen Leiterrahmens und Verfahren zum Herstellen eines oberflächenmontierbaren Halbleiterbauelements
JP4360788B2 (ja) * 2002-08-29 2009-11-11 シチズン電子株式会社 液晶表示板用のバックライト及びそれに用いる発光ダイオードの製造方法
USD536672S1 (en) 2002-09-05 2007-02-13 Nichia Corporation Light emitting diode
TWI292961B (en) * 2002-09-05 2008-01-21 Nichia Corp Semiconductor device and an optical device using the semiconductor device
USD537047S1 (en) 2002-09-05 2007-02-20 Nichia Corporation Light emitting diode
JP2004186168A (ja) * 2002-11-29 2004-07-02 Shin Etsu Chem Co Ltd 発光ダイオード素子用シリコーン樹脂組成物
JP2004266246A (ja) 2003-02-12 2004-09-24 Toyoda Gosei Co Ltd 発光装置
EP1604385B1 (de) * 2003-03-10 2019-12-11 OSRAM Opto Semiconductors GmbH Optoelektronisches bauelement mit einem gehäusekörper aus kunststoffmaterial
TW200427111A (en) 2003-03-12 2004-12-01 Shinetsu Chemical Co Material for coating/protecting light-emitting semiconductor and the light-emitting semiconductor device
US7777235B2 (en) 2003-05-05 2010-08-17 Lighting Science Group Corporation Light emitting diodes with improved light collimation
US7633093B2 (en) * 2003-05-05 2009-12-15 Lighting Science Group Corporation Method of making optical light engines with elevated LEDs and resulting product
US7528421B2 (en) * 2003-05-05 2009-05-05 Lamina Lighting, Inc. Surface mountable light emitting diode assemblies packaged for high temperature operation
US7157745B2 (en) * 2004-04-09 2007-01-02 Blonder Greg E Illumination devices comprising white light emitting diodes and diode arrays and method and apparatus for making them
TWI373150B (en) 2003-07-09 2012-09-21 Shinetsu Chemical Co Silicone rubber composition, light-emitting semiconductor embedding/protecting material and light-emitting semiconductor device
JP4586967B2 (ja) * 2003-07-09 2010-11-24 信越化学工業株式会社 発光半導体被覆保護材及び発光半導体装置
WO2005025933A2 (en) * 2003-09-08 2005-03-24 Schefenacker Vision Systems Usa Inc. Led light source
US7723740B2 (en) * 2003-09-18 2010-05-25 Nichia Corporation Light emitting device
JP2005093913A (ja) * 2003-09-19 2005-04-07 Nichia Chem Ind Ltd 発光装置
TWI291770B (en) 2003-11-14 2007-12-21 Hon Hai Prec Ind Co Ltd Surface light source device and light emitting diode
JP4803339B2 (ja) 2003-11-20 2011-10-26 信越化学工業株式会社 エポキシ・シリコーン混成樹脂組成物及び発光半導体装置
CN100377370C (zh) * 2003-11-22 2008-03-26 鸿富锦精密工业（深圳）有限公司 发光二极管和面光源装置
US7518158B2 (en) * 2003-12-09 2009-04-14 Cree, Inc. Semiconductor light emitting devices and submounts
US7087465B2 (en) * 2003-12-15 2006-08-08 Philips Lumileds Lighting Company, Llc Method of packaging a semiconductor light emitting device
JP2005183531A (ja) * 2003-12-17 2005-07-07 Sharp Corp 半導体発光装置
JP4309242B2 (ja) * 2003-12-19 2009-08-05 Ｎｅｃライティング株式会社 赤色蛍光体材料、赤色蛍光体材料を用いた白色発光ダイオードおよび白色発光ダイオードを用いた照明機器
DE10361650A1 (de) * 2003-12-30 2005-08-04 Osram Opto Semiconductors Gmbh Optoelektronisches Modul und Verfahren zu dessen Herstellung
JP4614679B2 (ja) * 2004-01-29 2011-01-19 京セラ株式会社 発光装置およびその製造方法ならびに照明装置
JP4163641B2 (ja) * 2004-02-25 2008-10-08 株式会社東芝 Ｌｅｄ素子
JP4632677B2 (ja) * 2004-03-11 2011-02-16 オリンパス株式会社 内視鏡装置
JP2006066868A (ja) * 2004-03-23 2006-03-09 Toyoda Gosei Co Ltd 固体素子および固体素子デバイス
JP4300418B2 (ja) 2004-04-30 2009-07-22 信越化学工業株式会社 エポキシ・シリコーン混成樹脂組成物及び発光半導体装置
JP4593974B2 (ja) * 2004-05-27 2010-12-08 京セラ株式会社 発光装置および照明装置
JP2008504698A (ja) * 2004-06-30 2008-02-14 オスラム　オプト　セミコンダクターズ　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング 発光ダイオード装置、光学式記録装置および少なくとも１つの発光ダイオードをパルス状に作動させる方法
WO2006005062A2 (en) * 2004-06-30 2006-01-12 Cree, Inc. Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices
JP2006019598A (ja) * 2004-07-05 2006-01-19 Citizen Electronics Co Ltd 発光ダイオード
TW200614548A (en) * 2004-07-09 2006-05-01 Matsushita Electric Industrial Co Ltd Light-emitting device
KR100674827B1 (ko) * 2004-07-28 2007-01-25 삼성전기주식회사 백라이트 유니트용 ｌｅｄ 패키지
JP4547569B2 (ja) * 2004-08-31 2010-09-22 スタンレー電気株式会社 表面実装型ｌｅｄ
WO2006059828A1 (en) * 2004-09-10 2006-06-08 Seoul Semiconductor Co., Ltd. Light emitting diode package having multiple molding resins
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US20020190262A1 (en) 2002-12-19
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EP1249874A2 (en) 2002-10-16

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