JP2008251664A - 照明装置 - Google Patents
照明装置 Download PDFInfo
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- JP2008251664A JP2008251664A JP2007088435A JP2007088435A JP2008251664A JP 2008251664 A JP2008251664 A JP 2008251664A JP 2007088435 A JP2007088435 A JP 2007088435A JP 2007088435 A JP2007088435 A JP 2007088435A JP 2008251664 A JP2008251664 A JP 2008251664A
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- light emitting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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Abstract
【解決手段】請求項1記載の発明は、平面状の表面を有する装置基板2と;この装置基板の表面側において間隔を存し配設された複数の半導体発光素子11と;前記半導体発光素子を電気的に接続するボンディングワイヤ17と;蛍光体および樹脂を含み膜厚が0.3〜1.5mmであるとともに前記蛍光体の充填率が0.04〜0.6g/cm3を有してなり前記半導体発光素子の発光色と前記蛍光体の発光色により2850〜7000Kの色温度となるように構成され、前記半導体発光素子および前記ボンディングワイヤを覆うように前記装置基板上に配設される蛍光体層19と;を具備することを特徴とする。
【選択図】図2
Description
Claims (2)
- 平面状の表面を有する装置基板と;
この装置基板の表面側において間隔を存し配設された複数の半導体発光素子と;
前記半導体発光素子を電気的に接続するボンディングワイヤと;
蛍光体および樹脂を含み膜厚が0.3〜1.5mmであるとともに前記蛍光体の充填率が0.04〜0.6g/cm3を有してなり前記半導体発光素子の発光色と前記蛍光体の発光色により2850〜7000Kの色温度となるように構成され、前記半導体発光素子および前記ボンディングワイヤを覆うように前記装置基板上に配設される蛍光体層と;
を具備することを特徴とする照明装置。 - 前記蛍光体層の樹脂は線膨張係数が2.0×10−5〜7.0×10−4/K、硬度(JISタイプA)が80以下のシリコーン樹脂であることを特徴とする請求項1記載の照明装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007088435A JP2008251664A (ja) | 2007-03-29 | 2007-03-29 | 照明装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007088435A JP2008251664A (ja) | 2007-03-29 | 2007-03-29 | 照明装置 |
Publications (1)
Publication Number | Publication Date |
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JP2008251664A true JP2008251664A (ja) | 2008-10-16 |
Family
ID=39976303
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2007088435A Pending JP2008251664A (ja) | 2007-03-29 | 2007-03-29 | 照明装置 |
Country Status (1)
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JP (1) | JP2008251664A (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010113852A1 (ja) * | 2009-03-31 | 2010-10-07 | 東芝ライテック株式会社 | 発光装置および照明装置 |
JP2010287657A (ja) * | 2009-06-10 | 2010-12-24 | Toshiba Lighting & Technology Corp | 発光モジュール及びその製造方法 |
WO2011122576A1 (ja) | 2010-03-30 | 2011-10-06 | 三菱化学株式会社 | 発光装置 |
CN102252176A (zh) * | 2010-03-25 | 2011-11-23 | 东芝照明技术株式会社 | 发光装置以及照明装置 |
JP2014064003A (ja) * | 2012-09-21 | 2014-04-10 | Advanced Optoelectronic Technology Inc | 発光ダイオードパッケージ及びその製造方法 |
CN104253200A (zh) * | 2013-06-27 | 2014-12-31 | 广镓光电股份有限公司 | 发光组件及制作方法 |
CN104282817A (zh) * | 2013-07-01 | 2015-01-14 | 广镓光电股份有限公司 | 发光二极管组件及制作方法 |
JP2016092419A (ja) * | 2014-10-31 | 2016-05-23 | 日亜化学工業株式会社 | 発光装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002299694A (ja) * | 2001-03-29 | 2002-10-11 | Mitsubishi Electric Lighting Corp | 照明用led光源デバイス及び照明器具 |
JP2002314143A (ja) * | 2001-04-09 | 2002-10-25 | Toshiba Corp | 発光装置 |
JP2005252219A (ja) * | 2004-02-06 | 2005-09-15 | Toyoda Gosei Co Ltd | 発光装置及び封止部材 |
JP2006049799A (ja) * | 2004-04-27 | 2006-02-16 | Matsushita Electric Ind Co Ltd | 発光装置 |
JP2006269756A (ja) * | 2005-03-24 | 2006-10-05 | Fujikura Ltd | 発光素子ユニットとその製造方法、表示装置、照明装置及び交通信号機 |
-
2007
- 2007-03-29 JP JP2007088435A patent/JP2008251664A/ja active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002299694A (ja) * | 2001-03-29 | 2002-10-11 | Mitsubishi Electric Lighting Corp | 照明用led光源デバイス及び照明器具 |
JP2002314143A (ja) * | 2001-04-09 | 2002-10-25 | Toshiba Corp | 発光装置 |
JP2005252219A (ja) * | 2004-02-06 | 2005-09-15 | Toyoda Gosei Co Ltd | 発光装置及び封止部材 |
JP2006049799A (ja) * | 2004-04-27 | 2006-02-16 | Matsushita Electric Ind Co Ltd | 発光装置 |
JP2006269756A (ja) * | 2005-03-24 | 2006-10-05 | Fujikura Ltd | 発光素子ユニットとその製造方法、表示装置、照明装置及び交通信号機 |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010113852A1 (ja) * | 2009-03-31 | 2010-10-07 | 東芝ライテック株式会社 | 発光装置および照明装置 |
US8783914B2 (en) | 2009-03-31 | 2014-07-22 | Toshiba Lighting & Technology Corporation | Light emitting apparatus and illumination apparatus |
JP2010287657A (ja) * | 2009-06-10 | 2010-12-24 | Toshiba Lighting & Technology Corp | 発光モジュール及びその製造方法 |
CN102252176A (zh) * | 2010-03-25 | 2011-11-23 | 东芝照明技术株式会社 | 发光装置以及照明装置 |
EP2369223A3 (en) * | 2010-03-25 | 2013-03-20 | Toshiba Lighting & Technology Corporation | Light-emitting device and illumination device |
US8446082B2 (en) | 2010-03-25 | 2013-05-21 | Toshiba Lighting & Technology Corporation | Light-emitting device and illumination device |
WO2011122576A1 (ja) | 2010-03-30 | 2011-10-06 | 三菱化学株式会社 | 発光装置 |
JP2014064003A (ja) * | 2012-09-21 | 2014-04-10 | Advanced Optoelectronic Technology Inc | 発光ダイオードパッケージ及びその製造方法 |
CN104253200A (zh) * | 2013-06-27 | 2014-12-31 | 广镓光电股份有限公司 | 发光组件及制作方法 |
US20150003038A1 (en) * | 2013-06-27 | 2015-01-01 | Huga Optotech Inc. | Led assembly with omnidirectional light field |
JP2015012292A (ja) * | 2013-06-27 | 2015-01-19 | 廣▲ジャー▼光電股▲ふん▼有限公司 | 発光モジュール及びその製造方法 |
CN111457260A (zh) * | 2013-06-27 | 2020-07-28 | 晶元光电股份有限公司 | 发光组件及制作方法 |
CN111457260B (zh) * | 2013-06-27 | 2022-06-07 | 晶元光电股份有限公司 | 灯泡 |
US11543081B2 (en) | 2013-06-27 | 2023-01-03 | Epistar Corporation | LED assembly with omnidirectional light field |
CN104282817A (zh) * | 2013-07-01 | 2015-01-14 | 广镓光电股份有限公司 | 发光二极管组件及制作方法 |
JP2016092419A (ja) * | 2014-10-31 | 2016-05-23 | 日亜化学工業株式会社 | 発光装置 |
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