KR100855530B1 - 다층프린트배선판 및 그 제조방법 - Google Patents

다층프린트배선판 및 그 제조방법 Download PDF

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KR100855530B1
KR100855530B1 KR1020077015082A KR20077015082A KR100855530B1 KR 100855530 B1 KR100855530 B1 KR 100855530B1 KR 1020077015082 A KR1020077015082 A KR 1020077015082A KR 20077015082 A KR20077015082 A KR 20077015082A KR 100855530 B1 KR100855530 B1 KR 100855530B1
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South Korea
Prior art keywords
layer
resin
hole
copper
plating
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KR1020077015082A
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English (en)
Korean (ko)
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KR20070086861A (ko
Inventor
나오히로 히로세
코우타 노다
히로시 세가와
혼진 엔
키요타카 츠카다
나오토 이시다
코우지 아사노
아츠시 쇼우다
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이비덴 가부시키가이샤
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Priority claimed from JP24938298A external-priority patent/JP2000077851A/ja
Priority claimed from JP28194098A external-priority patent/JP2000091742A/ja
Priority claimed from JP28194298A external-priority patent/JP2000091750A/ja
Priority claimed from JP30324798A external-priority patent/JP2000114727A/ja
Priority claimed from JP04351499A external-priority patent/JP4127441B2/ja
Priority claimed from JP04351599A external-priority patent/JP4127442B2/ja
Priority claimed from JP6024099A external-priority patent/JP2000261149A/ja
Priority claimed from JP11624699A external-priority patent/JP4137279B2/ja
Application filed by 이비덴 가부시키가이샤 filed Critical 이비덴 가부시키가이샤
Publication of KR20070086861A publication Critical patent/KR20070086861A/ko
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Publication of KR100855530B1 publication Critical patent/KR100855530B1/ko

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    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
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    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
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    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
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    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
KR1020077015082A 1998-09-03 1999-07-30 다층프린트배선판 및 그 제조방법 KR100855530B1 (ko)

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JP24938298A JP2000077851A (ja) 1998-09-03 1998-09-03 多層プリント配線板の製造方法
JPJP-P-1998-00249382 1998-09-03
JPJP-P-1998-00281940 1998-09-16
JP28194098A JP2000091742A (ja) 1998-09-16 1998-09-16 プリント配線板の製造方法
JPJP-P-1998-00281942 1998-09-16
JP28194298A JP2000091750A (ja) 1998-09-16 1998-09-16 スルーホールの形成方法、多層プリント配線板の製造方法、およびスルーホール形成基板、多層プリント配線板
JPJP-P-1998-00303247 1998-10-09
JP30324798A JP2000114727A (ja) 1998-10-09 1998-10-09 多層プリント配線板
JP04351499A JP4127441B2 (ja) 1999-02-22 1999-02-22 多層ビルドアップ配線板の製造方法
JPJP-P-1999-00043514 1999-02-22
JPJP-P-1999-00043515 1999-02-22
JP04351599A JP4127442B2 (ja) 1999-02-22 1999-02-22 多層ビルドアップ配線板及びその製造方法
JPJP-P-1999-00060240 1999-03-08
JP6024099A JP2000261149A (ja) 1999-03-08 1999-03-08 多層プリント配線板およびその製造方法
JPJP-P-1999-00116246 1999-04-23
JP11624699A JP4137279B2 (ja) 1999-04-23 1999-04-23 プリント配線板及びその製造方法
KR1020017002801A KR20010088796A (ko) 1998-09-03 1999-07-30 다층프린트배선판 및 그 제조방법

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US20040025333A1 (en) 2004-02-12
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US20080189943A1 (en) 2008-08-14
DE69939221D1 (de) 2008-09-11
US20120125680A1 (en) 2012-05-24
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EP1843650A3 (en) 2007-11-07
KR20010088796A (ko) 2001-09-28
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US20080173473A1 (en) 2008-07-24
EP1121008A4 (en) 2005-02-02
US20010042637A1 (en) 2001-11-22
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EP1121008B1 (en) 2008-07-30
EP1121008A1 (en) 2001-08-01
US6591495B2 (en) 2003-07-15
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MY123228A (en) 2006-05-31
MY139553A (en) 2009-10-30
EP1843650B1 (en) 2012-03-07
US7415761B2 (en) 2008-08-26
EP1843650A2 (en) 2007-10-10
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US7832098B2 (en) 2010-11-16
US8148643B2 (en) 2012-04-03
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