JP2007528115A5 - - Google Patents

Download PDF

Info

Publication number
JP2007528115A5
JP2007528115A5 JP2006506634A JP2006506634A JP2007528115A5 JP 2007528115 A5 JP2007528115 A5 JP 2007528115A5 JP 2006506634 A JP2006506634 A JP 2006506634A JP 2006506634 A JP2006506634 A JP 2006506634A JP 2007528115 A5 JP2007528115 A5 JP 2007528115A5
Authority
JP
Japan
Prior art keywords
stage
gap
immersion fluid
optical assembly
fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006506634A
Other languages
English (en)
Japanese (ja)
Other versions
JP4775256B2 (ja
JP2007528115A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/IB2004/002704 external-priority patent/WO2004090634A2/en
Publication of JP2007528115A publication Critical patent/JP2007528115A/ja
Publication of JP2007528115A5 publication Critical patent/JP2007528115A5/ja
Application granted granted Critical
Publication of JP4775256B2 publication Critical patent/JP4775256B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2006506634A 2003-04-10 2004-03-29 液浸リソグラフィ装置用の減圧排出を含む環境システム Expired - Fee Related JP4775256B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US46211203P 2003-04-10 2003-04-10
US60/462,112 2003-04-10
US48447603P 2003-07-01 2003-07-01
US60/484,476 2003-07-01
PCT/IB2004/002704 WO2004090634A2 (en) 2003-04-10 2004-03-29 Environmental system including vaccum scavange for an immersion lithography apparatus

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2010026002A Division JP5152219B2 (ja) 2003-04-10 2010-02-08 液浸リソグラフィ装置用の減圧排出を含む環境システム
JP2011097540A Division JP5550188B2 (ja) 2003-04-10 2011-04-25 露光装置、及び露光方法

Publications (3)

Publication Number Publication Date
JP2007528115A JP2007528115A (ja) 2007-10-04
JP2007528115A5 true JP2007528115A5 (OSRAM) 2010-04-08
JP4775256B2 JP4775256B2 (ja) 2011-09-21

Family

ID=33162259

Family Applications (10)

Application Number Title Priority Date Filing Date
JP2006506634A Expired - Fee Related JP4775256B2 (ja) 2003-04-10 2004-03-29 液浸リソグラフィ装置用の減圧排出を含む環境システム
JP2010026002A Expired - Fee Related JP5152219B2 (ja) 2003-04-10 2010-02-08 液浸リソグラフィ装置用の減圧排出を含む環境システム
JP2011097540A Expired - Fee Related JP5550188B2 (ja) 2003-04-10 2011-04-25 露光装置、及び露光方法
JP2012083119A Expired - Fee Related JP5541309B2 (ja) 2003-04-10 2012-03-30 露光装置及び露光方法
JP2013167890A Expired - Fee Related JP5692304B2 (ja) 2003-04-10 2013-08-12 液浸リソグラフィ装置用の減圧排出を含む環境システム
JP2013272247A Expired - Lifetime JP5745611B2 (ja) 2003-04-10 2013-12-27 液浸リソグラフィ装置用の減圧排出を含む環境システム
JP2014227827A Expired - Fee Related JP5949876B2 (ja) 2003-04-10 2014-11-10 液浸リソグラフィ装置用の減圧排出を含む環境システム
JP2015218810A Expired - Fee Related JP6137276B2 (ja) 2003-04-10 2015-11-06 液浸リソグラフィ装置用の減圧排出を含む環境システム
JP2016201561A Expired - Fee Related JP6332394B2 (ja) 2003-04-10 2016-10-13 露光装置及び露光方法
JP2017229742A Pending JP2018028705A (ja) 2003-04-10 2017-11-30 液浸リソグラフィ装置用の減圧排出を含む環境システム

Family Applications After (9)

Application Number Title Priority Date Filing Date
JP2010026002A Expired - Fee Related JP5152219B2 (ja) 2003-04-10 2010-02-08 液浸リソグラフィ装置用の減圧排出を含む環境システム
JP2011097540A Expired - Fee Related JP5550188B2 (ja) 2003-04-10 2011-04-25 露光装置、及び露光方法
JP2012083119A Expired - Fee Related JP5541309B2 (ja) 2003-04-10 2012-03-30 露光装置及び露光方法
JP2013167890A Expired - Fee Related JP5692304B2 (ja) 2003-04-10 2013-08-12 液浸リソグラフィ装置用の減圧排出を含む環境システム
JP2013272247A Expired - Lifetime JP5745611B2 (ja) 2003-04-10 2013-12-27 液浸リソグラフィ装置用の減圧排出を含む環境システム
JP2014227827A Expired - Fee Related JP5949876B2 (ja) 2003-04-10 2014-11-10 液浸リソグラフィ装置用の減圧排出を含む環境システム
JP2015218810A Expired - Fee Related JP6137276B2 (ja) 2003-04-10 2015-11-06 液浸リソグラフィ装置用の減圧排出を含む環境システム
JP2016201561A Expired - Fee Related JP6332394B2 (ja) 2003-04-10 2016-10-13 露光装置及び露光方法
JP2017229742A Pending JP2018028705A (ja) 2003-04-10 2017-11-30 液浸リソグラフィ装置用の減圧排出を含む環境システム

Country Status (7)

Country Link
US (13) US7321415B2 (OSRAM)
EP (7) EP2667253B1 (OSRAM)
JP (10) JP4775256B2 (OSRAM)
KR (13) KR101364889B1 (OSRAM)
CN (7) CN104597717B (OSRAM)
SG (6) SG2014015176A (OSRAM)
WO (1) WO2004090634A2 (OSRAM)

Families Citing this family (214)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10503084B2 (en) 2002-11-12 2019-12-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9482966B2 (en) 2002-11-12 2016-11-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN101424881B (zh) 2002-11-12 2011-11-30 Asml荷兰有限公司 光刻投射装置
CN100568101C (zh) 2002-11-12 2009-12-09 Asml荷兰有限公司 光刻装置和器件制造方法
TWI232357B (en) 2002-11-12 2005-05-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US7372541B2 (en) 2002-11-12 2008-05-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR20110086130A (ko) 2002-12-10 2011-07-27 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
JP4352874B2 (ja) 2002-12-10 2009-10-28 株式会社ニコン 露光装置及びデバイス製造方法
US7948604B2 (en) 2002-12-10 2011-05-24 Nikon Corporation Exposure apparatus and method for producing device
EP1571694A4 (en) 2002-12-10 2008-10-15 Nikon Corp EXPOSURE APPARATUS AND METHOD FOR MANUFACTURING THE DEVICE
EP1571695A4 (en) 2002-12-10 2008-10-15 Nikon Corp EXPOSURE APPARATUS AND METHOD FOR MANUFACTURING THE SAME
US7242455B2 (en) 2002-12-10 2007-07-10 Nikon Corporation Exposure apparatus and method for producing device
EP1571698A4 (en) 2002-12-10 2006-06-21 Nikon Corp EXPOSURE APPARATUS, EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD
DE10261775A1 (de) 2002-12-20 2004-07-01 Carl Zeiss Smt Ag Vorrichtung zur optischen Vermessung eines Abbildungssystems
KR101381538B1 (ko) 2003-02-26 2014-04-04 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
JP4353179B2 (ja) 2003-03-25 2009-10-28 株式会社ニコン 露光装置、露光方法、及びデバイス製造方法
ATE426914T1 (de) 2003-04-07 2009-04-15 Nikon Corp Belichtungsgerat und verfahren zur herstellung einer vorrichtung
JP4488004B2 (ja) 2003-04-09 2010-06-23 株式会社ニコン 液浸リソグラフィ流体制御システム
WO2004093160A2 (en) 2003-04-10 2004-10-28 Nikon Corporation Run-off path to collect liquid for an immersion lithography apparatus
EP2667253B1 (en) 2003-04-10 2015-06-10 Nikon Corporation Environmental system including vacuum scavenge for an immersion lithography apparatus
KR101745223B1 (ko) 2003-04-10 2017-06-08 가부시키가이샤 니콘 액침 리소그래피 장치용 운반 영역을 포함하는 환경 시스템
SG10201603067VA (en) 2003-04-11 2016-05-30 Nikon Corp Apparatus having an immersion fluid system configured to maintain immersion fluid in a gap adjacent an optical assembly
SG189557A1 (en) 2003-04-11 2013-05-31 Nikon Corp Cleanup method for optics in immersion lithography
JP4582089B2 (ja) 2003-04-11 2010-11-17 株式会社ニコン 液浸リソグラフィ用の液体噴射回収システム
ATE542167T1 (de) 2003-04-17 2012-02-15 Nikon Corp Lithographisches immersionsgerät
TWI295414B (en) * 2003-05-13 2008-04-01 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
JP4552853B2 (ja) 2003-05-15 2010-09-29 株式会社ニコン 露光装置及びデバイス製造方法
TWI503865B (zh) 2003-05-23 2015-10-11 尼康股份有限公司 A method of manufacturing an exposure apparatus and an element
TW201515064A (zh) 2003-05-23 2015-04-16 尼康股份有限公司 曝光方法及曝光裝置以及元件製造方法
KR20150036794A (ko) 2003-05-28 2015-04-07 가부시키가이샤 니콘 노광 방법, 노광 장치, 및 디바이스 제조 방법
TWI442694B (zh) * 2003-05-30 2014-06-21 Asml Netherlands Bv 微影裝置及元件製造方法
US7213963B2 (en) 2003-06-09 2007-05-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7684008B2 (en) 2003-06-11 2010-03-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7317504B2 (en) 2004-04-08 2008-01-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
TW200511388A (en) 2003-06-13 2005-03-16 Nikon Corp Exposure method, substrate stage, exposure apparatus and method for manufacturing device
TWI433212B (zh) 2003-06-19 2014-04-01 尼康股份有限公司 An exposure apparatus, an exposure method, and an element manufacturing method
US6867844B2 (en) 2003-06-19 2005-03-15 Asml Holding N.V. Immersion photolithography system and method using microchannel nozzles
US6809794B1 (en) 2003-06-27 2004-10-26 Asml Holding N.V. Immersion photolithography system and method using inverted wafer-projection optics interface
EP1498778A1 (en) 2003-06-27 2005-01-19 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
DE60308161T2 (de) 2003-06-27 2007-08-09 Asml Netherlands B.V. Lithographischer Apparat und Verfahren zur Herstellung eines Artikels
JP3862678B2 (ja) * 2003-06-27 2006-12-27 キヤノン株式会社 露光装置及びデバイス製造方法
WO2005006026A2 (en) 2003-07-01 2005-01-20 Nikon Corporation Using isotopically specified fluids as optical elements
EP2466382B1 (en) 2003-07-08 2014-11-26 Nikon Corporation Wafer table for immersion lithography
EP1646075B1 (en) 2003-07-09 2011-06-15 Nikon Corporation Exposure apparatus and device manufacturing method
KR101296501B1 (ko) 2003-07-09 2013-08-13 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
KR20060026883A (ko) 2003-07-09 2006-03-24 가부시키가이샤 니콘 결합장치, 노광장치 및 디바이스 제조방법
SG109000A1 (en) * 2003-07-16 2005-02-28 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
EP3346485A1 (en) 2003-07-25 2018-07-11 Nikon Corporation Projection optical system inspecting method and inspection apparatus, and a projection optical system manufacturing method
US7326522B2 (en) 2004-02-11 2008-02-05 Asml Netherlands B.V. Device manufacturing method and a substrate
EP1503244A1 (en) 2003-07-28 2005-02-02 ASML Netherlands B.V. Lithographic projection apparatus and device manufacturing method
KR101641011B1 (ko) 2003-07-28 2016-07-19 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법, 그리고 노광 장치의 제어 방법
US7175968B2 (en) 2003-07-28 2007-02-13 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and a substrate
US7779781B2 (en) 2003-07-31 2010-08-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR101288632B1 (ko) 2003-08-21 2013-07-22 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
KR101094114B1 (ko) * 2003-08-26 2011-12-15 가부시키가이샤 니콘 광학소자 및 노광장치
TWI263859B (en) 2003-08-29 2006-10-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
EP2804048A1 (en) 2003-08-29 2014-11-19 Nikon Corporation Exposure apparatus and device fabricating method
TWI245163B (en) 2003-08-29 2005-12-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
KR101371917B1 (ko) 2003-09-03 2014-03-07 가부시키가이샤 니콘 액침 리소그래피용 유체를 제공하기 위한 장치 및 방법
JP4444920B2 (ja) 2003-09-19 2010-03-31 株式会社ニコン 露光装置及びデバイス製造方法
EP2320273B1 (en) 2003-09-29 2015-01-21 Nikon Corporation Exposure apparatus, exposure method, and method for producing a device
WO2005036623A1 (ja) 2003-10-08 2005-04-21 Zao Nikon Co., Ltd. 基板搬送装置及び基板搬送方法、露光装置及び露光方法、デバイス製造方法
EP1672681B8 (en) 2003-10-08 2011-09-21 Miyagi Nikon Precision Co., Ltd. Exposure apparatus, substrate carrying method, exposure method, and method for producing device
JP2005136364A (ja) 2003-10-08 2005-05-26 Zao Nikon Co Ltd 基板搬送装置、露光装置、並びにデバイス製造方法
TW201738932A (zh) 2003-10-09 2017-11-01 Nippon Kogaku Kk 曝光裝置及曝光方法、元件製造方法
US7411653B2 (en) 2003-10-28 2008-08-12 Asml Netherlands B.V. Lithographic apparatus
EP1679738A4 (en) 2003-10-28 2008-08-06 Nikon Corp EXPOSURE DEVICE, EXPOSURE METHOD AND COMPONENT MANUFACTURING METHOD
US7352433B2 (en) 2003-10-28 2008-04-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4295712B2 (ja) * 2003-11-14 2009-07-15 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置及び装置製造方法
JP2005150533A (ja) * 2003-11-18 2005-06-09 Canon Inc 露光装置
WO2005055296A1 (ja) 2003-12-03 2005-06-16 Nikon Corporation 露光装置、露光方法及びデバイス製造方法、並びに光学部品
KR101119813B1 (ko) 2003-12-15 2012-03-06 가부시키가이샤 니콘 스테이지 장치, 노광 장치, 및 노광 방법
US7394521B2 (en) 2003-12-23 2008-07-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR101324810B1 (ko) 2004-01-05 2013-11-01 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
JP4371822B2 (ja) * 2004-01-06 2009-11-25 キヤノン株式会社 露光装置
JP4429023B2 (ja) * 2004-01-07 2010-03-10 キヤノン株式会社 露光装置及びデバイス製造方法
WO2005071491A2 (en) * 2004-01-20 2005-08-04 Carl Zeiss Smt Ag Exposure apparatus and measuring device for a projection lens
JP4319189B2 (ja) 2004-01-26 2009-08-26 株式会社ニコン 露光装置及びデバイス製造方法
US7589822B2 (en) 2004-02-02 2009-09-15 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
US7990516B2 (en) 2004-02-03 2011-08-02 Nikon Corporation Immersion exposure apparatus and device manufacturing method with liquid detection apparatus
DE102004013886A1 (de) 2004-03-16 2005-10-06 Carl Zeiss Smt Ag Verfahren zur Mehrfachbelichtung, Mikrolithografie-Projektionsbelichtungsanlage und Projektionssystem
TWI402893B (zh) 2004-03-25 2013-07-21 尼康股份有限公司 曝光方法
US7034917B2 (en) 2004-04-01 2006-04-25 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby
US7898642B2 (en) 2004-04-14 2011-03-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR101162938B1 (ko) 2004-04-19 2012-07-05 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
EP1747499A2 (en) 2004-05-04 2007-01-31 Nikon Corporation Apparatus and method for providing fluid for immersion lithography
US7616383B2 (en) 2004-05-18 2009-11-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7486381B2 (en) 2004-05-21 2009-02-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN101833247B (zh) 2004-06-04 2013-11-06 卡尔蔡司Smt有限责任公司 微光刻投影曝光系统的投影物镜的光学测量的测量系统
KR101433496B1 (ko) 2004-06-09 2014-08-22 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
KR101639928B1 (ko) 2004-06-10 2016-07-14 가부시키가이샤 니콘 노광 장치, 노광 방법, 및 디바이스 제조 방법
KR20180072867A (ko) 2004-06-10 2018-06-29 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
US8717533B2 (en) 2004-06-10 2014-05-06 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8373843B2 (en) 2004-06-10 2013-02-12 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8508713B2 (en) 2004-06-10 2013-08-13 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US7688421B2 (en) 2004-06-17 2010-03-30 Nikon Corporation Fluid pressure compensation for immersion lithography lens
US7426014B2 (en) 2004-07-01 2008-09-16 Nikon Corporation Dynamic fluid control system for immersion lithography
US7463330B2 (en) 2004-07-07 2008-12-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR101433491B1 (ko) 2004-07-12 2014-08-22 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
US7304715B2 (en) 2004-08-13 2007-12-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8305553B2 (en) 2004-08-18 2012-11-06 Nikon Corporation Exposure apparatus and device manufacturing method
US7701550B2 (en) 2004-08-19 2010-04-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN100539019C (zh) * 2004-09-17 2009-09-09 株式会社尼康 曝光装置、曝光方法以及器件制造方法
KR101285963B1 (ko) 2004-09-17 2013-07-12 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
US7423720B2 (en) 2004-11-12 2008-09-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7411657B2 (en) 2004-11-17 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
TWI393170B (zh) * 2004-11-18 2013-04-11 尼康股份有限公司 A position measuring method, a position control method, a measuring method, a loading method, an exposure method, an exposure apparatus, and a device manufacturing method
US7446850B2 (en) 2004-12-03 2008-11-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7397533B2 (en) 2004-12-07 2008-07-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7196770B2 (en) 2004-12-07 2007-03-27 Asml Netherlands B.V. Prewetting of substrate before immersion exposure
US7365827B2 (en) 2004-12-08 2008-04-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7352440B2 (en) 2004-12-10 2008-04-01 Asml Netherlands B.V. Substrate placement in immersion lithography
US7403261B2 (en) 2004-12-15 2008-07-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP3285282A1 (en) * 2004-12-15 2018-02-21 Nikon Corporation Exposure apparatus and device fabricating method
US7528931B2 (en) 2004-12-20 2009-05-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7880860B2 (en) 2004-12-20 2011-02-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7405805B2 (en) 2004-12-28 2008-07-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7491661B2 (en) 2004-12-28 2009-02-17 Asml Netherlands B.V. Device manufacturing method, top coat material and substrate
US20060147821A1 (en) 2004-12-30 2006-07-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
DE602006012746D1 (de) 2005-01-14 2010-04-22 Asml Netherlands Bv Lithografische Vorrichtung und Herstellungsverfahren
JP4830303B2 (ja) * 2005-01-27 2011-12-07 Ｊｓｒ株式会社 液浸露光用液体の製造方法およびリサイクル方法
KR20180125636A (ko) 2005-01-31 2018-11-23 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
US8692973B2 (en) 2005-01-31 2014-04-08 Nikon Corporation Exposure apparatus and method for producing device
CN102360170B (zh) 2005-02-10 2014-03-12 Asml荷兰有限公司 浸没液体、曝光装置及曝光方法
US7224431B2 (en) 2005-02-22 2007-05-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7378025B2 (en) 2005-02-22 2008-05-27 Asml Netherlands B.V. Fluid filtration method, fluid filtered thereby, lithographic apparatus and device manufacturing method
US8018573B2 (en) 2005-02-22 2011-09-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7282701B2 (en) 2005-02-28 2007-10-16 Asml Netherlands B.V. Sensor for use in a lithographic apparatus
US7428038B2 (en) 2005-02-28 2008-09-23 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and apparatus for de-gassing a liquid
JP4262252B2 (ja) * 2005-03-02 2009-05-13 キヤノン株式会社 露光装置
US7324185B2 (en) 2005-03-04 2008-01-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7684010B2 (en) 2005-03-09 2010-03-23 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, seal structure, method of removing an object and a method of sealing
US7330238B2 (en) 2005-03-28 2008-02-12 Asml Netherlands, B.V. Lithographic apparatus, immersion projection apparatus and device manufacturing method
US7411654B2 (en) 2005-04-05 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
USRE43576E1 (en) 2005-04-08 2012-08-14 Asml Netherlands B.V. Dual stage lithographic apparatus and device manufacturing method
US7291850B2 (en) 2005-04-08 2007-11-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20060232753A1 (en) 2005-04-19 2006-10-19 Asml Holding N.V. Liquid immersion lithography system with tilted liquid flow
KR101344142B1 (ko) 2005-04-25 2013-12-23 가부시키가이샤 니콘 노광 방법, 노광 장치, 및 디바이스 제조 방법
US8248577B2 (en) 2005-05-03 2012-08-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7433016B2 (en) 2005-05-03 2008-10-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7317507B2 (en) 2005-05-03 2008-01-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4708860B2 (ja) * 2005-05-23 2011-06-22 キヤノン株式会社 液浸露光装置
WO2006130338A1 (en) * 2005-06-01 2006-12-07 Nikon Corporation Immersion fluid containment system and method for immersion lithography
US7385673B2 (en) * 2005-06-10 2008-06-10 International Business Machines Corporation Immersion lithography with equalized pressure on at least projection optics component and wafer
US7652746B2 (en) 2005-06-21 2010-01-26 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2007005731A (ja) * 2005-06-27 2007-01-11 Jsr Corp 液浸露光用液体およびその精製方法
US7834974B2 (en) 2005-06-28 2010-11-16 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7468779B2 (en) 2005-06-28 2008-12-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7474379B2 (en) 2005-06-28 2009-01-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8054445B2 (en) 2005-08-16 2011-11-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2007020067A1 (en) * 2005-08-16 2007-02-22 Carl Zeiss Smt Ag Immersion lithography objective
US7580112B2 (en) * 2005-08-25 2009-08-25 Nikon Corporation Containment system for immersion fluid in an immersion lithography apparatus
US20090130604A1 (en) * 2005-08-29 2009-05-21 Mitsui Chemicals, Inc. Solution for immersion exposure and immersion exposure method
EP1950793A1 (en) * 2005-10-05 2008-07-30 Nikon Corporation Exposure apparatus and exposure method
US7411658B2 (en) 2005-10-06 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7864292B2 (en) 2005-11-16 2011-01-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7804577B2 (en) 2005-11-16 2010-09-28 Asml Netherlands B.V. Lithographic apparatus
US7633073B2 (en) 2005-11-23 2009-12-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7773195B2 (en) 2005-11-29 2010-08-10 Asml Holding N.V. System and method to increase surface tension and contact angle in immersion lithography
US7782442B2 (en) 2005-12-06 2010-08-24 Nikon Corporation Exposure apparatus, exposure method, projection optical system and device producing method
US7420194B2 (en) 2005-12-27 2008-09-02 Asml Netherlands B.V. Lithographic apparatus and substrate edge seal
KR20080088579A (ko) 2005-12-28 2008-10-02 가부시키가이샤 니콘 노광 장치 및 노광 방법, 디바이스 제조 방법
US7649611B2 (en) 2005-12-30 2010-01-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR20080102192A (ko) 2006-02-16 2008-11-24 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
WO2007094407A1 (ja) 2006-02-16 2007-08-23 Nikon Corporation 露光装置、露光方法及びデバイス製造方法
SG170012A1 (en) * 2006-02-21 2011-04-29 Nikon Corp Pattern forming apparatus and pattern forming method, movable body drive system and movable body drive method, exposure apparatus and exposure method, and device manufacturing method
US8045134B2 (en) 2006-03-13 2011-10-25 Asml Netherlands B.V. Lithographic apparatus, control system and device manufacturing method
JP4889331B2 (ja) * 2006-03-22 2012-03-07 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
KR20080108341A (ko) * 2006-04-03 2008-12-12 가부시키가이샤 니콘 액침 액체에 대해 소용매성인 입사면 및 광학 윈도우
US9477158B2 (en) 2006-04-14 2016-10-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
DE102006021797A1 (de) 2006-05-09 2007-11-15 Carl Zeiss Smt Ag Optische Abbildungseinrichtung mit thermischer Dämpfung
TWI439813B (zh) * 2006-05-10 2014-06-01 尼康股份有限公司 A method of manufacturing an exposure apparatus and an element
US8144305B2 (en) 2006-05-18 2012-03-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7656502B2 (en) * 2006-06-22 2010-02-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8045135B2 (en) 2006-11-22 2011-10-25 Asml Netherlands B.V. Lithographic apparatus with a fluid combining unit and related device manufacturing method
US8634053B2 (en) 2006-12-07 2014-01-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9632425B2 (en) 2006-12-07 2017-04-25 Asml Holding N.V. Lithographic apparatus, a dryer and a method of removing liquid from a surface
US7866637B2 (en) 2007-01-26 2011-01-11 Asml Netherlands B.V. Humidifying apparatus, lithographic apparatus and humidifying method
US8237911B2 (en) 2007-03-15 2012-08-07 Nikon Corporation Apparatus and methods for keeping immersion fluid adjacent to an optical assembly during wafer exchange in an immersion lithography machine
US8011377B2 (en) * 2007-05-04 2011-09-06 Asml Netherlands B.V. Cleaning device and a lithographic apparatus cleaning method
US7841352B2 (en) * 2007-05-04 2010-11-30 Asml Netherlands B.V. Cleaning device, a lithographic apparatus and a lithographic apparatus cleaning method
US7866330B2 (en) * 2007-05-04 2011-01-11 Asml Netherlands B.V. Cleaning device, a lithographic apparatus and a lithographic apparatus cleaning method
US8947629B2 (en) 2007-05-04 2015-02-03 Asml Netherlands B.V. Cleaning device, a lithographic apparatus and a lithographic apparatus cleaning method
US7576833B2 (en) 2007-06-28 2009-08-18 Nikon Corporation Gas curtain type immersion lithography tool using porous material for fluid removal
JP4533416B2 (ja) * 2007-09-25 2010-09-01 キヤノン株式会社 露光装置およびデバイス製造方法
NL1036009A1 (nl) * 2007-10-05 2009-04-07 Asml Netherlands Bv An Immersion Lithography Apparatus.
WO2009076598A1 (en) * 2007-12-12 2009-06-18 Children's Hospital & Research Center At Oakland Use of unsaturated sphingosine compounds as chemotherapeutic agents for the treatment of cancer
US9176393B2 (en) 2008-05-28 2015-11-03 Asml Netherlands B.V. Lithographic apparatus and a method of operating the apparatus
TWI457714B (zh) * 2008-09-17 2014-10-21 Asml Netherlands Bv 微影裝置及其操作方法
NL2003392A (en) 2008-09-17 2010-03-18 Asml Netherlands Bv Lithographic apparatus and a method of operating the apparatus.
US8047354B2 (en) 2008-09-26 2011-11-01 Corning Incorporated Liquid-ejecting bearings for transport of glass sheets
EP2172766A1 (en) * 2008-10-03 2010-04-07 ASML Netherlands B.V. Lithographic apparatus and humidity measurement system
US8511461B2 (en) * 2008-11-25 2013-08-20 Corning Incorporated Gas-ejecting bearings for transport of glass sheets
NL2003638A (en) 2008-12-03 2010-06-07 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
NL2004497A (en) 2009-05-01 2010-11-02 Asml Netherlands Bv Lithographic apparatus and a method of operating the apparatus.
JP5016705B2 (ja) * 2009-06-09 2012-09-05 エーエスエムエル ネザーランズ ビー．ブイ． 流体ハンドリング構造
NL2005207A (en) 2009-09-28 2011-03-29 Asml Netherlands Bv Heat pipe, lithographic apparatus and device manufacturing method.
US9120700B2 (en) * 2010-03-26 2015-09-01 Corning Incorporated Non-contact etching of moving glass sheets
EP2381310B1 (en) 2010-04-22 2015-05-06 ASML Netherlands BV Fluid handling structure and lithographic apparatus
NL2008199A (en) * 2011-02-28 2012-08-29 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
US8715518B2 (en) 2011-10-12 2014-05-06 Intermolecular, Inc. Gas barrier with vent ring for protecting a surface region from liquid
US8728334B2 (en) 2011-11-29 2014-05-20 Intermolecular, Inc. Dynamic gas flow control of touchless reactor cells
US8617409B2 (en) 2011-11-22 2013-12-31 Intermolecular, Inc. Magnetically levitated gas cell for touchless site-isolated wet processing
US9016289B2 (en) 2011-11-28 2015-04-28 Intermolecular, Inc. System and method for reducing particles and marks on wafer surface following reactor processing
US8690136B2 (en) 2011-11-29 2014-04-08 Intermolecular, Inc. Internal rinsing in touchless interstitial processing
US8883607B2 (en) 2011-12-27 2014-11-11 Intermolecular, Inc. Full wafer processing by multiple passes through a combinatorial reactor
US9268231B2 (en) * 2012-04-10 2016-02-23 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method for manufacturing device, program, and recording medium
JP6537194B2 (ja) * 2014-07-04 2019-07-03 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置及びリソグラフィ装置を用いてデバイスを製造する方法
US9405287B1 (en) * 2015-07-22 2016-08-02 Applied Materials, Inc. Apparatus and method for optical calibration of wafer placement by a robot
CN109143768A (zh) * 2018-09-13 2019-01-04 杭州行开科技有限公司 一种适于激光投影的裸眼3d显示系统
KR20220100596A (ko) * 2019-11-14 2022-07-15 에이에스엠엘 네델란즈 비.브이. 기판 지지부, 리소그래피 장치, 전하 분포를 조작하기 위한 방법 및 기판을 준비하기 위한 방법
KR20220011903A (ko) 2020-07-22 2022-02-03 삼성전자주식회사 식기 세척기
CN116802565A (zh) 2021-02-03 2023-09-22 应用材料公司 用于稳定投射设备的气动控制挠曲系统
US11543754B1 (en) * 2021-06-16 2023-01-03 Taiwan Semiconductor Manufacturing Company, Ltd. Extractor piping on outermost sidewall of immersion hood apparatus

Family Cites Families (228)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US273683A (en) * 1883-03-06 John f
US279795A (en) * 1883-06-19 Paper-weight
US181859A (en) * 1876-09-05 Improvement in warming floors
GB1242527A (en) 1967-10-20 1971-08-11 Kodak Ltd Optical instruments
DE2102922C3 (de) * 1971-01-22 1978-08-24 Ernst Leitz Wetzlar Gmbh, 6330 Wetzlar Anordnung zum selbsttätigen Fokussieren auf in optischen Geräten zu betrachtende Objekte
US4346164A (en) * 1980-10-06 1982-08-24 Werner Tabarelli Photolithographic method for the manufacture of integrated circuits
US4509852A (en) 1980-10-06 1985-04-09 Werner Tabarelli Apparatus for the photolithographic manufacture of integrated circuit elements
JPS57153433A (en) 1981-03-18 1982-09-22 Hitachi Ltd Manufacturing device for semiconductor
JPS5822299A (ja) * 1981-07-29 1983-02-09 日産自動車株式会社 フオ−クリフト
JPS58202448A (ja) 1982-05-21 1983-11-25 Hitachi Ltd 露光装置
JPS5919912A (ja) 1982-07-26 1984-02-01 Hitachi Ltd 液浸距離保持装置
US4441808A (en) * 1982-11-15 1984-04-10 Tre Semiconductor Equipment Corp. Focusing device for photo-exposure system
DD242880A1 (de) * 1983-01-31 1987-02-11 Kuch Karl Heinz Einrichtung zur fotolithografischen strukturuebertragung
DD221563A1 (de) * 1983-09-14 1985-04-24 Mikroelektronik Zt Forsch Tech Immersionsobjektiv fuer die schrittweise projektionsabbildung einer maskenstruktur
DD224448A1 (de) * 1984-03-01 1985-07-03 Zeiss Jena Veb Carl Einrichtung zur fotolithografischen strukturuebertragung
JPS6265326A (ja) 1985-09-18 1987-03-24 Hitachi Ltd 露光装置
JPS63157419A (ja) 1986-12-22 1988-06-30 Toshiba Corp 微細パタ−ン転写装置
US4837443A (en) 1987-10-15 1989-06-06 The Perkin-Elmer Corporation Guard ring for a differentially pumped seal apparatus
JPH04305917A (ja) 1991-04-02 1992-10-28 Nikon Corp 密着型露光装置
JPH04305915A (ja) 1991-04-02 1992-10-28 Nikon Corp 密着型露光装置
JPH0562877A (ja) 1991-09-02 1993-03-12 Yasuko Shinohara 光によるｌｓｉ製造縮小投影露光装置の光学系
JP3374413B2 (ja) * 1992-07-20 2003-02-04 株式会社ニコン 投影露光装置、投影露光方法、並びに集積回路製造方法
JP3246615B2 (ja) 1992-07-27 2002-01-15 株式会社ニコン 照明光学装置、露光装置、及び露光方法
JPH06188169A (ja) 1992-08-24 1994-07-08 Canon Inc 結像方法及び該方法を用いる露光装置及び該方法を用いるデバイス製造方法
JPH06124873A (ja) * 1992-10-09 1994-05-06 Canon Inc 液浸式投影露光装置
JP2753930B2 (ja) 1992-11-27 1998-05-20 キヤノン株式会社 液浸式投影露光装置
JP3747958B2 (ja) 1995-04-07 2006-02-22 株式会社ニコン 反射屈折光学系
JP3212199B2 (ja) 1993-10-04 2001-09-25 旭硝子株式会社 平板型陰極線管
JPH07220990A (ja) 1994-01-28 1995-08-18 Hitachi Ltd パターン形成方法及びその露光装置
US5528118A (en) 1994-04-01 1996-06-18 Nikon Precision, Inc. Guideless stage with isolated reaction stage
US5874820A (en) 1995-04-04 1999-02-23 Nikon Corporation Window frame-guided stage mechanism
US5623853A (en) 1994-10-19 1997-04-29 Nikon Precision Inc. Precision motion stage with single guide beam and follower stage
JPH08136475A (ja) 1994-11-14 1996-05-31 Kawasaki Steel Corp 板状材の表面観察装置
JPH08171054A (ja) 1994-12-16 1996-07-02 Nikon Corp 反射屈折光学系
JPH08316124A (ja) 1995-05-19 1996-11-29 Hitachi Ltd 投影露光方法及び露光装置
JPH08316125A (ja) 1995-05-19 1996-11-29 Hitachi Ltd 投影露光方法及び露光装置
JPH09148235A (ja) * 1995-11-22 1997-06-06 Nikon Corp 走査型投影露光装置
US5707535A (en) * 1996-01-11 1998-01-13 Harris; Ronald B. Vacuum loadable divided phase separator for liquid/solid separation
JPH103039A (ja) 1996-06-14 1998-01-06 Nikon Corp 反射屈折光学系
JPH1020195A (ja) 1996-06-28 1998-01-23 Nikon Corp 反射屈折光学系
JP3227595B2 (ja) 1996-08-20 2001-11-12 東京エレクトロン株式会社 現像処理方法及び現像処理装置
US6104687A (en) 1996-08-26 2000-08-15 Digital Papyrus Corporation Method and apparatus for coupling an optical lens to a disk through a coupling medium having a relatively high index of refraction
US5825043A (en) 1996-10-07 1998-10-20 Nikon Precision Inc. Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus
WO1998024115A1 (en) 1996-11-28 1998-06-04 Nikon Corporation Aligner and method for exposure
JP4029183B2 (ja) 1996-11-28 2008-01-09 株式会社ニコン 投影露光装置及び投影露光方法
JP4029182B2 (ja) 1996-11-28 2008-01-09 株式会社ニコン 露光方法
JP3728613B2 (ja) 1996-12-06 2005-12-21 株式会社ニコン 走査型露光装置の調整方法及び該方法を使用する走査型露光装置
EP1197801B1 (en) 1996-12-24 2005-12-28 ASML Netherlands B.V. Lithographic device with two object holders
USRE40043E1 (en) 1997-03-10 2008-02-05 Asml Netherlands B.V. Positioning device having two object holders
JPH10255319A (ja) 1997-03-12 1998-09-25 Hitachi Maxell Ltd 原盤露光装置及び方法
JP3747566B2 (ja) * 1997-04-23 2006-02-22 株式会社ニコン 液浸型露光装置
JP3817836B2 (ja) * 1997-06-10 2006-09-06 株式会社ニコン 露光装置及びその製造方法並びに露光方法及びデバイス製造方法
US20010003028A1 (en) 1997-09-19 2001-06-07 Nikon Corporation Scanning Exposure Method
JP4210871B2 (ja) 1997-10-31 2009-01-21 株式会社ニコン 露光装置
JPH11176727A (ja) * 1997-12-11 1999-07-02 Nikon Corp 投影露光装置
JPH11260791A (ja) 1998-03-10 1999-09-24 Toshiba Mach Co Ltd 半導体ウエハの乾燥方法および乾燥装置
WO1999049504A1 (fr) * 1998-03-26 1999-09-30 Nikon Corporation Procede et systeme d'exposition par projection
US5997963A (en) * 1998-05-05 1999-12-07 Ultratech Stepper, Inc. Microchamber
JP2000058436A (ja) * 1998-08-11 2000-02-25 Nikon Corp 投影露光装置及び露光方法
JP2000076707A (ja) * 1998-08-31 2000-03-14 Sony Corp 光学記録媒体作製用原盤記録装置
US6538719B1 (en) * 1998-09-03 2003-03-25 Nikon Corporation Exposure apparatus and exposure method, and device and method for producing the same
EP1052552A3 (en) 1999-04-19 2003-03-12 ASML Netherlands B.V. Gas bearings for use with vacuum chambers and their application in lithographic projection apparatus
JP3653198B2 (ja) 1999-07-16 2005-05-25 アルプス電気株式会社 乾燥用ノズルおよびこれを用いた乾燥装置ならびに洗浄装置
JP2001118773A (ja) 1999-10-18 2001-04-27 Nikon Corp ステージ装置及び露光装置
WO2001035168A1 (en) 1999-11-10 2001-05-17 Massachusetts Institute Of Technology Interference lithography utilizing phase-locked scanning beams
TWI264617B (en) 1999-12-21 2006-10-21 Asml Netherlands Bv Balanced positioning system for use in lithographic apparatus
US7187503B2 (en) 1999-12-29 2007-03-06 Carl Zeiss Smt Ag Refractive projection objective for immersion lithography
US6995930B2 (en) 1999-12-29 2006-02-07 Carl Zeiss Smt Ag Catadioptric projection objective with geometric beam splitting
TW579664B (en) 2000-01-11 2004-03-11 Matsushita Electric Industrial Co Ltd Apparatus and method for manufacturing printed circuit board
JP3630054B2 (ja) 2000-01-11 2005-03-16 松下電器産業株式会社 プリント配線板の製造装置およびそれを用いたプリント配線板の製造方法
US6488040B1 (en) * 2000-06-30 2002-12-03 Lam Research Corporation Capillary proximity heads for single wafer cleaning and drying
US7000622B2 (en) 2002-09-30 2006-02-21 Lam Research Corporation Methods and systems for processing a bevel edge of a substrate using a dynamic liquid meniscus
TW591653B (en) 2000-08-08 2004-06-11 Koninkl Philips Electronics Nv Method of manufacturing an optically scannable information carrier
JPWO2002025711A1 (ja) * 2000-09-21 2004-01-29 株式会社ニコン 結像特性の計測方法及び露光方法
JP2002134384A (ja) * 2000-10-20 2002-05-10 Nikon Corp 露光方法及び装置、並びにデバイス製造方法
KR100866818B1 (ko) 2000-12-11 2008-11-04 가부시키가이샤 니콘 투영광학계 및 이 투영광학계를 구비한 노광장치
US20020080339A1 (en) 2000-12-25 2002-06-27 Nikon Corporation Stage apparatus, vibration control method and exposure apparatus
US6731372B2 (en) 2001-03-27 2004-05-04 Nikon Corporation Multiple chamber fluid mount
US20020163629A1 (en) 2001-05-07 2002-11-07 Michael Switkes Methods and apparatus employing an index matching medium
TW529172B (en) 2001-07-24 2003-04-21 Asml Netherlands Bv Imaging apparatus
US7032658B2 (en) 2002-01-31 2006-04-25 Smart Drilling And Completion, Inc. High power umbilicals for electric flowline immersion heating of produced hydrocarbons
JP2003124180A (ja) 2001-10-16 2003-04-25 Ebara Corp 基板処理装置
US6811613B2 (en) 2001-11-26 2004-11-02 Tokyo Electron Limited Coating film forming apparatus
US6764386B2 (en) 2002-01-11 2004-07-20 Applied Materials, Inc. Air bearing-sealed micro-processing chamber
WO2003065427A1 (en) * 2002-01-29 2003-08-07 Nikon Corporation Exposure device and exposure method
EP1480765A4 (en) 2002-02-06 2009-10-21 Akrion Technologies Inc CAPILLARY DRYING OF SUBSTRATES
US7092069B2 (en) 2002-03-08 2006-08-15 Carl Zeiss Smt Ag Projection exposure method and projection exposure system
DE10229818A1 (de) 2002-06-28 2004-01-15 Carl Zeiss Smt Ag Verfahren zur Fokusdetektion und Abbildungssystem mit Fokusdetektionssystem
DE10210899A1 (de) 2002-03-08 2003-09-18 Zeiss Carl Smt Ag Refraktives Projektionsobjektiv für Immersions-Lithographie
JP2004029063A (ja) * 2002-06-21 2004-01-29 Adtec Engineeng Co Ltd 密着型露光装置
WO2004019128A2 (en) 2002-08-23 2004-03-04 Nikon Corporation Projection optical system and method for photolithography and exposure apparatus and method using same
US7367345B1 (en) 2002-09-30 2008-05-06 Lam Research Corporation Apparatus and method for providing a confined liquid for immersion lithography
US6988326B2 (en) 2002-09-30 2006-01-24 Lam Research Corporation Phobic barrier meniscus separation and containment
US7520285B2 (en) 2002-09-30 2009-04-21 Lam Research Corporation Apparatus and method for processing a substrate
US7093375B2 (en) 2002-09-30 2006-08-22 Lam Research Corporation Apparatus and method for utilizing a meniscus in substrate processing
US7383843B2 (en) 2002-09-30 2008-06-10 Lam Research Corporation Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer
US6954993B1 (en) 2002-09-30 2005-10-18 Lam Research Corporation Concentric proximity processing head
US6988327B2 (en) 2002-09-30 2006-01-24 Lam Research Corporation Methods and systems for processing a substrate using a dynamic liquid meniscus
US7240679B2 (en) 2002-09-30 2007-07-10 Lam Research Corporation System for substrate processing with meniscus, vacuum, IPA vapor, drying manifold
US6788477B2 (en) * 2002-10-22 2004-09-07 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus for method for immersion lithography
SG121822A1 (en) * 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
TWI232357B (en) 2002-11-12 2005-05-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
DE60335595D1 (de) 2002-11-12 2011-02-17 Asml Netherlands Bv Lithographischer Apparat mit Immersion und Verfahren zur Herstellung einer Vorrichtung
EP2495613B1 (en) * 2002-11-12 2013-07-31 ASML Netherlands B.V. Lithographic apparatus
CN101424881B (zh) 2002-11-12 2011-11-30 Asml荷兰有限公司 光刻投射装置
US7110081B2 (en) 2002-11-12 2006-09-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN100568101C (zh) 2002-11-12 2009-12-09 Asml荷兰有限公司 光刻装置和器件制造方法
EP1420300B1 (en) * 2002-11-12 2015-07-29 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1420299B1 (en) * 2002-11-12 2011-01-05 ASML Netherlands B.V. Immersion lithographic apparatus and device manufacturing method
SG131766A1 (en) 2002-11-18 2007-05-28 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
DE10253679A1 (de) 2002-11-18 2004-06-03 Infineon Technologies Ag Optische Einrichtung zur Verwendung bei einem Lithographie-Verfahren, insbesondere zur Herstellung eines Halbleiter-Bauelements, sowie optisches Lithographieverfahren
DE10258718A1 (de) 2002-12-09 2004-06-24 Carl Zeiss Smt Ag Projektionsobjektiv, insbesondere für die Mikrolithographie, sowie Verfahren zur Abstimmung eines Projektionsobjektives
KR20110086130A (ko) 2002-12-10 2011-07-27 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
EP1571698A4 (en) 2002-12-10 2006-06-21 Nikon Corp EXPOSURE APPARATUS, EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD
EP1429190B1 (en) 2002-12-10 2012-05-09 Canon Kabushiki Kaisha Exposure apparatus and method
EP1571695A4 (en) 2002-12-10 2008-10-15 Nikon Corp EXPOSURE APPARATUS AND METHOD FOR MANUFACTURING THE SAME
EP1573730B1 (en) 2002-12-13 2009-02-25 Koninklijke Philips Electronics N.V. Liquid removal in a method and device for irradiating spots on a layer
US7399978B2 (en) 2002-12-19 2008-07-15 Koninklijke Philips Electronics N.V. Method and device for irradiating spots on a layer
US7010958B2 (en) 2002-12-19 2006-03-14 Asml Holding N.V. High-resolution gas gauge proximity sensor
EP1579435B1 (en) 2002-12-19 2007-06-27 Koninklijke Philips Electronics N.V. Method and device for irradiating spots on a layer
US6781670B2 (en) * 2002-12-30 2004-08-24 Intel Corporation Immersion lithography
US7090964B2 (en) 2003-02-21 2006-08-15 Asml Holding N.V. Lithographic printing with polarized light
JP4352930B2 (ja) 2003-02-26 2009-10-28 株式会社ニコン 露光装置、露光方法及びデバイス製造方法
KR101381538B1 (ko) 2003-02-26 2014-04-04 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
US6943941B2 (en) 2003-02-27 2005-09-13 Asml Netherlands B.V. Stationary and dynamic radial transverse electric polarizer for high numerical aperture systems
US7206059B2 (en) 2003-02-27 2007-04-17 Asml Netherlands B.V. Stationary and dynamic radial transverse electric polarizer for high numerical aperture systems
US7029832B2 (en) 2003-03-11 2006-04-18 Samsung Electronics Co., Ltd. Immersion lithography methods using carbon dioxide
US20050164522A1 (en) 2003-03-24 2005-07-28 Kunz Roderick R. Optical fluids, and systems and methods of making and using the same
JP4353179B2 (ja) 2003-03-25 2009-10-28 株式会社ニコン 露光装置、露光方法、及びデバイス製造方法
ATE426914T1 (de) 2003-04-07 2009-04-15 Nikon Corp Belichtungsgerat und verfahren zur herstellung einer vorrichtung
JP4488004B2 (ja) * 2003-04-09 2010-06-23 株式会社ニコン 液浸リソグラフィ流体制御システム
JP4656057B2 (ja) 2003-04-10 2011-03-23 株式会社ニコン 液浸リソグラフィ装置用電気浸透素子
EP2667253B1 (en) * 2003-04-10 2015-06-10 Nikon Corporation Environmental system including vacuum scavenge for an immersion lithography apparatus
WO2004093160A2 (en) 2003-04-10 2004-10-28 Nikon Corporation Run-off path to collect liquid for an immersion lithography apparatus
KR101745223B1 (ko) 2003-04-10 2017-06-08 가부시키가이샤 니콘 액침 리소그래피 장치용 운반 영역을 포함하는 환경 시스템
JP4582089B2 (ja) 2003-04-11 2010-11-17 株式会社ニコン 液浸リソグラフィ用の液体噴射回収システム
SG10201603067VA (en) 2003-04-11 2016-05-30 Nikon Corp Apparatus having an immersion fluid system configured to maintain immersion fluid in a gap adjacent an optical assembly
SG189557A1 (en) 2003-04-11 2013-05-31 Nikon Corp Cleanup method for optics in immersion lithography
ATE542167T1 (de) 2003-04-17 2012-02-15 Nikon Corp Lithographisches immersionsgerät
JP2004321968A (ja) * 2003-04-25 2004-11-18 Nec Corp 廃棄物処理システムおよび廃棄物処理方法
JP4025683B2 (ja) 2003-05-09 2007-12-26 松下電器産業株式会社 パターン形成方法及び露光装置
JP4146755B2 (ja) 2003-05-09 2008-09-10 松下電器産業株式会社 パターン形成方法
EP2270599A1 (en) 2003-05-13 2011-01-05 ASML Netherlands BV Lithographic apparatus
TWI295414B (en) 2003-05-13 2008-04-01 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
TW201515064A (zh) 2003-05-23 2015-04-16 尼康股份有限公司 曝光方法及曝光裝置以及元件製造方法
JP2004349645A (ja) 2003-05-26 2004-12-09 Sony Corp 液浸差動排液静圧浮上パッド、原盤露光装置および液侵差動排液による露光方法
TWI442694B (zh) * 2003-05-30 2014-06-21 Asml Netherlands Bv 微影裝置及元件製造方法
DE10324477A1 (de) 2003-05-30 2004-12-30 Carl Zeiss Smt Ag Mikrolithographische Projektionsbelichtungsanlage
US7213963B2 (en) 2003-06-09 2007-05-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4054285B2 (ja) 2003-06-12 2008-02-27 松下電器産業株式会社 パターン形成方法
JP4084710B2 (ja) 2003-06-12 2008-04-30 松下電器産業株式会社 パターン形成方法
TWI433212B (zh) 2003-06-19 2014-04-01 尼康股份有限公司 An exposure apparatus, an exposure method, and an element manufacturing method
US6867844B2 (en) * 2003-06-19 2005-03-15 Asml Holding N.V. Immersion photolithography system and method using microchannel nozzles
JP4084712B2 (ja) 2003-06-23 2008-04-30 松下電器産業株式会社 パターン形成方法
JP4029064B2 (ja) 2003-06-23 2008-01-09 松下電器産業株式会社 パターン形成方法
JP3862678B2 (ja) 2003-06-27 2006-12-27 キヤノン株式会社 露光装置及びデバイス製造方法
EP1498778A1 (en) 2003-06-27 2005-01-19 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US6809794B1 (en) 2003-06-27 2004-10-26 Asml Holding N.V. Immersion photolithography system and method using inverted wafer-projection optics interface
WO2005006026A2 (en) 2003-07-01 2005-01-20 Nikon Corporation Using isotopically specified fluids as optical elements
US6919647B2 (en) * 2003-07-03 2005-07-19 American Semiconductor, Inc. SRAM cell
JP4835155B2 (ja) * 2003-07-09 2011-12-14 株式会社ニコン 露光装置及びデバイス製造方法
US7384149B2 (en) 2003-07-21 2008-06-10 Asml Netherlands B.V. Lithographic projection apparatus, gas purging method and device manufacturing method and purge gas supply system
US7006209B2 (en) 2003-07-25 2006-02-28 Advanced Micro Devices, Inc. Method and apparatus for monitoring and controlling imaging in immersion lithography systems
US7326522B2 (en) 2004-02-11 2008-02-05 Asml Netherlands B.V. Device manufacturing method and a substrate
US7175968B2 (en) 2003-07-28 2007-02-13 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and a substrate
US7700267B2 (en) 2003-08-11 2010-04-20 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion fluid for immersion lithography, and method of performing immersion lithography
US7579135B2 (en) 2003-08-11 2009-08-25 Taiwan Semiconductor Manufacturing Company, Ltd. Lithography apparatus for manufacture of integrated circuits
US7061578B2 (en) 2003-08-11 2006-06-13 Advanced Micro Devices, Inc. Method and apparatus for monitoring and controlling imaging in immersion lithography systems
US7085075B2 (en) 2003-08-12 2006-08-01 Carl Zeiss Smt Ag Projection objectives including a plurality of mirrors with lenses ahead of mirror M3
US6844206B1 (en) 2003-08-21 2005-01-18 Advanced Micro Devices, Llp Refractive index system monitor and control for immersion lithography
US7070915B2 (en) 2003-08-29 2006-07-04 Tokyo Electron Limited Method and system for drying a substrate
US6954256B2 (en) 2003-08-29 2005-10-11 Asml Netherlands B.V. Gradient immersion lithography
US7014966B2 (en) 2003-09-02 2006-03-21 Advanced Micro Devices, Inc. Method and apparatus for elimination of bubbles in immersion medium in immersion lithography systems
KR101371917B1 (ko) 2003-09-03 2014-03-07 가부시키가이샤 니콘 액침 리소그래피용 유체를 제공하기 위한 장치 및 방법
JP4378136B2 (ja) 2003-09-04 2009-12-02 キヤノン株式会社 露光装置及びデバイス製造方法
US20050069499A1 (en) * 2003-09-25 2005-03-31 Moshe Arkin Foamable compositions, processes of preparing same and uses thereof
US6961186B2 (en) 2003-09-26 2005-11-01 Takumi Technology Corp. Contact printing using a magnified mask image
EP1519230A1 (en) 2003-09-29 2005-03-30 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4515209B2 (ja) 2003-10-02 2010-07-28 株式会社ニコン 露光装置及び露光方法、並びにデバイス製造方法
JP4513299B2 (ja) 2003-10-02 2010-07-28 株式会社ニコン 露光装置、露光方法、及びデバイス製造方法
US7369217B2 (en) 2003-10-03 2008-05-06 Micronic Laser Systems Ab Method and device for immersion lithography
US7678527B2 (en) 2003-10-16 2010-03-16 Intel Corporation Methods and compositions for providing photoresist with improved properties for contacting liquids
JP2005159322A (ja) 2003-10-31 2005-06-16 Nikon Corp 定盤、ステージ装置及び露光装置並びに露光方法
US20070105050A1 (en) 2003-11-05 2007-05-10 Dsm Ip Assets B.V. Method and apparatus for producing microchips
US7924397B2 (en) 2003-11-06 2011-04-12 Taiwan Semiconductor Manufacturing Company, Ltd. Anti-corrosion layer on objective lens for liquid immersion lithography applications
US7545481B2 (en) 2003-11-24 2009-06-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8854602B2 (en) 2003-11-24 2014-10-07 Asml Netherlands B.V. Holding device for an optical element in an objective
US7125652B2 (en) 2003-12-03 2006-10-24 Advanced Micro Devices, Inc. Immersion lithographic process using a conforming immersion medium
KR101200654B1 (ko) 2003-12-15 2012-11-12 칼 짜이스 에스엠티 게엠베하 고 개구율 및 평평한 단부면을 가진 투사 대물렌즈
JP2007516613A (ja) 2003-12-15 2007-06-21 カール・ツアイス・エスエムテイ・アーゲー 少なくとも１つの液体レンズを備えるマイクロリソグラフィー投影対物レンズとしての対物レンズ
US20050185269A1 (en) 2003-12-19 2005-08-25 Carl Zeiss Smt Ag Catadioptric projection objective with geometric beam splitting
US7460206B2 (en) 2003-12-19 2008-12-02 Carl Zeiss Smt Ag Projection objective for immersion lithography
JP5102492B2 (ja) 2003-12-19 2012-12-19 カール・ツァイス・エスエムティー・ゲーエムベーハー 結晶素子を有するマイクロリソグラフィー投影用対物レンズ
JP2005183744A (ja) 2003-12-22 2005-07-07 Nikon Corp 露光装置及びデバイス製造方法
US7394521B2 (en) 2003-12-23 2008-07-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7589818B2 (en) 2003-12-23 2009-09-15 Asml Netherlands B.V. Lithographic apparatus, alignment apparatus, device manufacturing method, and a method of converting an apparatus
US7119884B2 (en) 2003-12-24 2006-10-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20050147920A1 (en) 2003-12-30 2005-07-07 Chia-Hui Lin Method and system for immersion lithography
US7088422B2 (en) 2003-12-31 2006-08-08 International Business Machines Corporation Moving lens for immersion optical lithography
JP4371822B2 (ja) 2004-01-06 2009-11-25 キヤノン株式会社 露光装置
JP4429023B2 (ja) 2004-01-07 2010-03-10 キヤノン株式会社 露光装置及びデバイス製造方法
US20050153424A1 (en) 2004-01-08 2005-07-14 Derek Coon Fluid barrier with transparent areas for immersion lithography
CN102207608B (zh) 2004-01-14 2013-01-02 卡尔蔡司Smt有限责任公司 反射折射投影物镜
EP1716457B9 (en) 2004-01-16 2012-04-04 Carl Zeiss SMT GmbH Projection system with a polarization-modulating element having a variable thickness profile
WO2005069078A1 (en) 2004-01-19 2005-07-28 Carl Zeiss Smt Ag Microlithographic projection exposure apparatus with immersion projection lens
WO2005071491A2 (en) 2004-01-20 2005-08-04 Carl Zeiss Smt Ag Exposure apparatus and measuring device for a projection lens
US7026259B2 (en) 2004-01-21 2006-04-11 International Business Machines Corporation Liquid-filled balloons for immersion lithography
US7391501B2 (en) 2004-01-22 2008-06-24 Intel Corporation Immersion liquids with siloxane polymer for immersion lithography
JP2007520893A (ja) 2004-02-03 2007-07-26 ロチェスター インスティテュート オブ テクノロジー 流体を使用したフォトリソグラフィ法及びそのシステム
US7050146B2 (en) 2004-02-09 2006-05-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1716454A1 (en) 2004-02-09 2006-11-02 Carl Zeiss SMT AG Projection objective for a microlithographic projection exposure apparatus
EP1714192A1 (en) 2004-02-13 2006-10-25 Carl Zeiss SMT AG Projection objective for a microlithographic projection exposure apparatus
EP1721201A1 (en) 2004-02-18 2006-11-15 Corning Incorporated Catadioptric imaging system for high numerical aperture imaging with deep ultraviolet light
US20050205108A1 (en) 2004-03-16 2005-09-22 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for immersion lithography lens cleaning
US7027125B2 (en) 2004-03-25 2006-04-11 International Business Machines Corporation System and apparatus for photolithography
US7084960B2 (en) 2004-03-29 2006-08-01 Intel Corporation Lithography using controlled polarization
US7034917B2 (en) 2004-04-01 2006-04-25 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby
US7227619B2 (en) 2004-04-01 2007-06-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7295283B2 (en) 2004-04-02 2007-11-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7091502B2 (en) 2004-05-12 2006-08-15 Taiwan Semiconductor Manufacturing, Co., Ltd. Apparatus and method for immersion lithography
US7486381B2 (en) 2004-05-21 2009-02-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7688421B2 (en) 2004-06-17 2010-03-30 Nikon Corporation Fluid pressure compensation for immersion lithography lens
US7057702B2 (en) * 2004-06-23 2006-06-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7426014B2 (en) 2004-07-01 2008-09-16 Nikon Corporation Dynamic fluid control system for immersion lithography
US7701550B2 (en) 2004-08-19 2010-04-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7355674B2 (en) 2004-09-28 2008-04-08 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and computer program product
US7161654B2 (en) 2004-12-02 2007-01-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7265813B2 (en) 2004-12-28 2007-09-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Similar Documents

Publication Publication Date Title
JP2007528115A5 (OSRAM)
TW200737298A (en) Substrate holding device, exposure device, exposure method, and device fabrication method
JP2012164996A5 (ja) 露光装置、デバイス製造方法、及びクリーニング方法
WO2007027311A3 (en) Systems and methods for controlling ambient pressure during processing of microfeature workpieces, including during immersion lithography
WO2005111722A3 (en) Apparatus and method for providing fluid for immersion lithography
JP2005503016A5 (OSRAM)
US20050117134A1 (en) Exposure method, exposure apparatus, and method for manufacturing device
DE602004027162D1 (de) Belichtungsvorrichtung, belichtungsverfahren und bauelementeherstellungsverfahren
MY137975A (en) Proximity meniscus manifold
TW200735197A (en) Laser machining device
JP7414102B2 (ja) 物体保持装置及び露光装置
JP2008288589A5 (ja) 露光装置、及びデバイス製造方法
KR20190128003A (ko) 노광 장치, 노광 방법, 디바이스 제조 방법, 프로그램, 및 기록 매체
CN107527853A (zh) 被加工物的保持机构和加工装置
JP6442377B2 (ja) ポンプ装置セット及び液供給システム
JP5449720B2 (ja) 基板処理装置
TW200730258A (en) Substrate processing apparatus
WO2007015753A3 (en) Systems and methods for retrieving residual liquid during immersion lens photolithography
TW200743913A (en) Apparatus and method for particle monitoring in immersion lithography
CN101518769B (zh) 涂敷装置
CN103029988A (zh) 机械手以及基板搬送装置
JP4572626B2 (ja) 光照射装置
JP2010093245A5 (ja) 露光装置、メンテナンス方法、及びデバイス製造方法
BR0005933B1 (pt) artigo para aparelho gerador de energia e mÉtodo de modificaÇço de uma superfÍcie de fluxo de fluido externa de um artigo de gerador de energia.
JP5300050B2 (ja) ひび割れ構造物の補修方法