TWI393170B - - Google Patents

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Publication number
TWI393170B
TWI393170B TW94140383A TW94140383A TWI393170B TW I393170 B TWI393170 B TW I393170B TW 94140383 A TW94140383 A TW 94140383A TW 94140383 A TW94140383 A TW 94140383A TW I393170 B TWI393170 B TW I393170B
Authority
TW
Taiwan
Prior art keywords
position
plate
moving body
measurement unit
measurement
Prior art date
Application number
TW94140383A
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English (en)
Other versions
TW200633009A (en
Inventor
安田雅彥
杉原太郎
Original Assignee
尼康股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2004335050 priority Critical
Application filed by 尼康股份有限公司 filed Critical 尼康股份有限公司
Publication of TW200633009A publication Critical patent/TW200633009A/zh
Application granted granted Critical
Publication of TWI393170B publication Critical patent/TWI393170B/zh

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Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70216Systems for imaging mask onto workpiece
    • G03F7/70341Immersion
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70691Handling of masks or wafers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70691Handling of masks or wafers
    • G03F7/707Chucks, e.g. chucking or un-chucking operations
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70691Handling of masks or wafers
    • G03F7/70716Stages
    • G03F7/70725Stages control
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70691Handling of masks or wafers
    • G03F7/70775Position control
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/708Construction of apparatus, e.g. environment, hygiene aspects or materials
    • G03F7/70975Assembly, maintenance, transport and storage of apparatus
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007Alignment other than original with workpiece
    • G03F9/7011Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
TW94140383A 2004-11-18 2005-11-17 TWI393170B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004335050 2004-11-18

Publications (2)

Publication Number Publication Date
TW200633009A TW200633009A (en) 2006-09-16
TWI393170B true TWI393170B (zh) 2013-04-11

Family

ID=36407218

Family Applications (8)

Application Number Title Priority Date Filing Date
TW105113026A TWI588872B (zh) 2004-11-18 2005-11-17
TW106115617A TWI654661B (zh) 2004-11-18 2005-11-17
TW102100681A TWI536429B (zh) 2004-11-18 2005-11-17
TW102108435A TWI553703B (zh) 2004-11-18 2005-11-17
TW106143378A TWI649790B (zh) 2004-11-18 2005-11-17
TW107122135A TW201837984A (zh) 2004-11-18 2005-11-17 曝光裝置、曝光方法、及元件製造方法
TW94140383A TWI393170B (zh) 2004-11-18 2005-11-17
TW102105974A TWI538013B (zh) 2004-11-18 2005-11-17

Family Applications Before (6)

Application Number Title Priority Date Filing Date
TW105113026A TWI588872B (zh) 2004-11-18 2005-11-17
TW106115617A TWI654661B (zh) 2004-11-18 2005-11-17
TW102100681A TWI536429B (zh) 2004-11-18 2005-11-17
TW102108435A TWI553703B (zh) 2004-11-18 2005-11-17
TW106143378A TWI649790B (zh) 2004-11-18 2005-11-17
TW107122135A TW201837984A (zh) 2004-11-18 2005-11-17 曝光裝置、曝光方法、及元件製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW102105974A TWI538013B (zh) 2004-11-18 2005-11-17

Country Status (10)

Country Link
US (12) US8059260B2 (zh)
EP (4) EP2772804A1 (zh)
JP (14) JP4877653B2 (zh)
KR (10) KR101578629B1 (zh)
CN (5) CN103186057B (zh)
HK (6) HK1198211A1 (zh)
IL (3) IL183280D0 (zh)
SG (4) SG157404A1 (zh)
TW (8) TWI588872B (zh)
WO (1) WO2006054682A1 (zh)

Families Citing this family (121)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1551760A (zh) * 2001-03-29 2004-12-01 药物协和公司 用于治疗组织炎症和癌变的鸟苷酸环化酶受体拮抗剂
US7623734B2 (en) * 2004-09-30 2009-11-24 Microsoft Corporation Method and system for automatically inscribing noisy objects in scanned image data within a minimum area rectangle
TWI588872B (zh) 2004-11-18 2017-06-21 尼康股份有限公司
US7352440B2 (en) 2004-12-10 2008-04-01 Asml Netherlands B.V. Substrate placement in immersion lithography
US7649611B2 (en) 2005-12-30 2010-01-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR101565277B1 (ko) * 2006-08-31 2015-11-02 가부시키가이샤 니콘 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 그리고 디바이스 제조 방법
EP3312676B1 (en) * 2006-08-31 2019-05-15 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
KR101442449B1 (ko) * 2006-09-01 2014-09-22 가부시키가이샤 니콘 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 그리고 디바이스 제조 방법
US8986456B2 (en) 2006-10-10 2015-03-24 Asm America, Inc. Precursor delivery system
JP5058836B2 (ja) * 2007-05-08 2012-10-24 東京エレクトロン株式会社 処理装置、処理方法、被処理体の認識方法および記憶媒体
US8969514B2 (en) * 2007-06-04 2015-03-03 Synergy Pharmaceuticals, Inc. Agonists of guanylate cyclase useful for the treatment of hypercholesterolemia, atherosclerosis, coronary heart disease, gallstone, obesity and other cardiovascular diseases
ES2559319T3 (es) 2007-06-04 2016-02-11 Synergy Pharmaceuticals Inc. Agonistas de guanilato cliclasa útiles para el tratamiento de trastornos gastrointestinales, inflamación, cáncer y otros trastornos
EP3246755B1 (en) * 2007-07-18 2018-12-12 Nikon Corporation Exposure apparatus, exposure method and device manufacturing method
JP5262070B2 (ja) * 2007-11-05 2013-08-14 大同特殊鋼株式会社 被検査物の真円度測定方法
KR101525342B1 (ko) * 2007-12-28 2015-06-10 가부시키가이샤 니콘 노광 장치, 이동체 구동 시스템, 패턴 형성 장치 및 노광 방법, 그리고 디바이스 제조 방법
JP5241245B2 (ja) * 2008-01-11 2013-07-17 株式会社日立ハイテクノロジーズ 検査装置及び検査方法
ES2627848T3 (es) 2008-06-04 2017-07-31 Synergy Pharmaceuticals Inc. Agonistas de la guanilato ciclasa útiles para el tratamiento de trastornos gastrointestinales, inflamación, cáncer y otros trastornos
WO2009149278A1 (en) 2008-06-04 2009-12-10 Synergy Pharmaceuticals Inc. Agonists of guanylate cyclase useful for the treatment of gastrointestinal disorders, inflammation, cancer and other disorders
CA2730603A1 (en) 2008-07-16 2010-01-21 Synergy Pharmaceuticals Inc. Agonists of guanylate cyclase useful for the treatment of gastrointestinal disorders, inflammation, cancer and other disorders
US7810698B2 (en) * 2008-11-20 2010-10-12 Asm Assembly Automation Ltd. Vision system for positioning a bonding tool
EP2373296B1 (en) 2008-12-03 2016-08-03 Synergy Pharmaceuticals Inc. Formulations of guanylate cyclase c agonists and methods of use
EP2196857A3 (en) * 2008-12-09 2010-07-21 ASML Netherlands BV Lithographic apparatus and device manufacturing method
US9394608B2 (en) * 2009-04-06 2016-07-19 Asm America, Inc. Semiconductor processing reactor and components thereof
US8883270B2 (en) 2009-08-14 2014-11-11 Asm America, Inc. Systems and methods for thin-film deposition of metal oxides using excited nitrogen—oxygen species
US8877655B2 (en) 2010-05-07 2014-11-04 Asm America, Inc. Systems and methods for thin-film deposition of metal oxides using excited nitrogen-oxygen species
US9616097B2 (en) 2010-09-15 2017-04-11 Synergy Pharmaceuticals, Inc. Formulations of guanylate cyclase C agonists and methods of use
EP2621509A4 (en) 2010-09-15 2016-08-03 Synergy Pharmaceuticals Inc Formulations of guanylate cyclase c agonists and methods of use
US9793148B2 (en) 2011-06-22 2017-10-17 Asm Japan K.K. Method for positioning wafers in multiple wafer transport
US9341296B2 (en) 2011-10-27 2016-05-17 Asm America, Inc. Heater jacket for a fluid line
US9096931B2 (en) 2011-10-27 2015-08-04 Asm America, Inc Deposition valve assembly and method of heating the same
US9017481B1 (en) 2011-10-28 2015-04-28 Asm America, Inc. Process feed management for semiconductor substrate processing
US9167625B2 (en) 2011-11-23 2015-10-20 Asm Ip Holding B.V. Radiation shielding for a substrate holder
US9005539B2 (en) 2011-11-23 2015-04-14 Asm Ip Holding B.V. Chamber sealing member
CN102540896B (zh) * 2012-02-29 2013-07-17 清华大学 化学机械抛光传输机器人的非线性模糊结合递归控制系统
US9202727B2 (en) 2012-03-02 2015-12-01 ASM IP Holding Susceptor heater shim
US8605294B2 (en) * 2012-03-09 2013-12-10 Chung-Shan Institute of Science and Technology, Armaments, Bureau, Ministry of National Defense Actuating apparatus, actuating system and method for actuating a working stage to move relative to a platform with high-precision positioning capability
US8946830B2 (en) 2012-04-04 2015-02-03 Asm Ip Holdings B.V. Metal oxide protective layer for a semiconductor device
US9029253B2 (en) 2012-05-02 2015-05-12 Asm Ip Holding B.V. Phase-stabilized thin films, structures and devices including the thin films, and methods of forming same
US8728832B2 (en) 2012-05-07 2014-05-20 Asm Ip Holdings B.V. Semiconductor device dielectric interface layer
RU2502952C1 (ru) * 2012-06-15 2013-12-27 федеральное государственное бюджетное научное учреждение "Научно-исследовательский радиофизический институт" Устройство для линейных перемещений с нанометровой точностью в большом диапазоне возможных перемещений
US8933375B2 (en) 2012-06-27 2015-01-13 Asm Ip Holding B.V. Susceptor heater and method of heating a substrate
US9558931B2 (en) 2012-07-27 2017-01-31 Asm Ip Holding B.V. System and method for gas-phase sulfur passivation of a semiconductor surface
US9117866B2 (en) * 2012-07-31 2015-08-25 Asm Ip Holding B.V. Apparatus and method for calculating a wafer position in a processing chamber under process conditions
US9169975B2 (en) 2012-08-28 2015-10-27 Asm Ip Holding B.V. Systems and methods for mass flow controller verification
US9659799B2 (en) 2012-08-28 2017-05-23 Asm Ip Holding B.V. Systems and methods for dynamic semiconductor process scheduling
US9021985B2 (en) 2012-09-12 2015-05-05 Asm Ip Holdings B.V. Process gas management for an inductively-coupled plasma deposition reactor
US9324811B2 (en) 2012-09-26 2016-04-26 Asm Ip Holding B.V. Structures and devices including a tensile-stressed silicon arsenic layer and methods of forming same
US20140136313A1 (en) * 2012-11-14 2014-05-15 Satyam Shaw Categorizing content selections
US9640416B2 (en) 2012-12-26 2017-05-02 Asm Ip Holding B.V. Single-and dual-chamber module-attachable wafer-handling chamber
JP5657039B2 (ja) * 2013-01-28 2015-01-21 株式会社日立ハイテクノロジーズ 試料搭載装置
US8894870B2 (en) 2013-02-01 2014-11-25 Asm Ip Holding B.V. Multi-step method and apparatus for etching compounds containing a metal
US9589770B2 (en) 2013-03-08 2017-03-07 Asm Ip Holding B.V. Method and systems for in-situ formation of intermediate reactive species
US9484191B2 (en) 2013-03-08 2016-11-01 Asm Ip Holding B.V. Pulsed remote plasma method and system
AU2014235215A1 (en) 2013-03-15 2015-10-01 Synergy Pharmaceuticals Inc. Agonists of guanylate cyclase and their uses
US8993054B2 (en) 2013-07-12 2015-03-31 Asm Ip Holding B.V. Method and system to reduce outgassing in a reaction chamber
US9018111B2 (en) 2013-07-22 2015-04-28 Asm Ip Holding B.V. Semiconductor reaction chamber with plasma capabilities
US9396934B2 (en) 2013-08-14 2016-07-19 Asm Ip Holding B.V. Methods of forming films including germanium tin and structures and devices including the films
US9793115B2 (en) 2013-08-14 2017-10-17 Asm Ip Holding B.V. Structures and devices including germanium-tin films and methods of forming same
JPWO2015034005A1 (ja) 2013-09-04 2017-03-02 Ckd株式会社 電磁アクチュエータ用電機子コイル、電磁アクチュエータ、露光装置、及びデバイス製造方法
US9240412B2 (en) 2013-09-27 2016-01-19 Asm Ip Holding B.V. Semiconductor structure and device and methods of forming same using selective epitaxial process
US9556516B2 (en) 2013-10-09 2017-01-31 ASM IP Holding B.V Method for forming Ti-containing film by PEALD using TDMAT or TDEAT
US9605343B2 (en) 2013-11-13 2017-03-28 Asm Ip Holding B.V. Method for forming conformal carbon films, structures conformal carbon film, and system of forming same
US10179947B2 (en) 2013-11-26 2019-01-15 Asm Ip Holding B.V. Method for forming conformal nitrided, oxidized, or carbonized dielectric film by atomic layer deposition
JP6351992B2 (ja) * 2014-02-17 2018-07-04 株式会社Screenホールディングス 変位検出装置、基板処理装置、変位検出方法および基板処理方法
US9447498B2 (en) 2014-03-18 2016-09-20 Asm Ip Holding B.V. Method for performing uniform processing in gas system-sharing multiple reaction chambers
US10167557B2 (en) 2014-03-18 2019-01-01 Asm Ip Holding B.V. Gas distribution system, reactor including the system, and methods of using the same
US9404587B2 (en) 2014-04-24 2016-08-02 ASM IP Holding B.V Lockout tagout for semiconductor vacuum valve
US9543180B2 (en) 2014-08-01 2017-01-10 Asm Ip Holding B.V. Apparatus and method for transporting wafers between wafer carrier and process tool under vacuum
US9890456B2 (en) 2014-08-21 2018-02-13 Asm Ip Holding B.V. Method and system for in situ formation of gas-phase compounds
US9657845B2 (en) 2014-10-07 2017-05-23 Asm Ip Holding B.V. Variable conductance gas distribution apparatus and method
KR20160059810A (ko) 2014-11-19 2016-05-27 에이에스엠 아이피 홀딩 비.브이. 박막 증착 방법
KR20160076208A (ko) 2014-12-22 2016-06-30 에이에스엠 아이피 홀딩 비.브이. 반도체 소자 및 그 제조 방법
US9478415B2 (en) 2015-02-13 2016-10-25 Asm Ip Holding B.V. Method for forming film having low resistance and shallow junction depth
JPWO2016136691A1 (ja) * 2015-02-23 2017-11-30 株式会社ニコン 基板処理システム及び基板処理方法、並びにデバイス製造方法
US10276355B2 (en) 2015-03-12 2019-04-30 Asm Ip Holding B.V. Multi-zone reactor, system including the reactor, and method of using the same
DE102015207275B4 (de) * 2015-04-22 2018-06-07 Robert Bosch Gmbh Maßverkörperung mit signalkompensierenden Markierungen
SG10201603103UA (en) * 2015-04-30 2016-11-29 Canon Kk Imprint device, substrate conveying device, imprinting method, and method for manufacturing article
CN104897102B (zh) * 2015-05-15 2017-11-07 浙江工业大学 一种球笼保持架自动检测系统
US9899291B2 (en) 2015-07-13 2018-02-20 Asm Ip Holding B.V. Method for protecting layer by forming hydrocarbon-based extremely thin film
US10043661B2 (en) 2015-07-13 2018-08-07 Asm Ip Holding B.V. Method for protecting layer by forming hydrocarbon-based extremely thin film
US10083836B2 (en) 2015-07-24 2018-09-25 Asm Ip Holding B.V. Formation of boron-doped titanium metal films with high work function
US10087525B2 (en) 2015-08-04 2018-10-02 Asm Ip Holding B.V. Variable gap hard stop design
US9647114B2 (en) 2015-08-14 2017-05-09 Asm Ip Holding B.V. Methods of forming highly p-type doped germanium tin films and structures and devices including the films
US9711345B2 (en) 2015-08-25 2017-07-18 Asm Ip Holding B.V. Method for forming aluminum nitride-based film by PEALD
US9960072B2 (en) 2015-09-29 2018-05-01 Asm Ip Holding B.V. Variable adjustment for precise matching of multiple chamber cavity housings
US9909214B2 (en) 2015-10-15 2018-03-06 Asm Ip Holding B.V. Method for depositing dielectric film in trenches by PEALD
US10211308B2 (en) 2015-10-21 2019-02-19 Asm Ip Holding B.V. NbMC layers
JP6506153B2 (ja) * 2015-10-27 2019-04-24 株式会社Screenホールディングス 変位検出装置および変位検出方法ならびに基板処理装置
US10322384B2 (en) 2015-11-09 2019-06-18 Asm Ip Holding B.V. Counter flow mixer for process chamber
US9455138B1 (en) 2015-11-10 2016-09-27 Asm Ip Holding B.V. Method for forming dielectric film in trenches by PEALD using H-containing gas
US9905420B2 (en) 2015-12-01 2018-02-27 Asm Ip Holding B.V. Methods of forming silicon germanium tin films and structures and devices including the films
US9607837B1 (en) 2015-12-21 2017-03-28 Asm Ip Holding B.V. Method for forming silicon oxide cap layer for solid state diffusion process
US9735024B2 (en) 2015-12-28 2017-08-15 Asm Ip Holding B.V. Method of atomic layer etching using functional group-containing fluorocarbon
US9627221B1 (en) 2015-12-28 2017-04-18 Asm Ip Holding B.V. Continuous process incorporating atomic layer etching
US9754779B1 (en) 2016-02-19 2017-09-05 Asm Ip Holding B.V. Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches
US10343920B2 (en) 2016-03-18 2019-07-09 Asm Ip Holding B.V. Aligned carbon nanotubes
US9892913B2 (en) 2016-03-24 2018-02-13 Asm Ip Holding B.V. Radial and thickness control via biased multi-port injection settings
US10190213B2 (en) 2016-04-21 2019-01-29 Asm Ip Holding B.V. Deposition of metal borides
US10087522B2 (en) 2016-04-21 2018-10-02 Asm Ip Holding B.V. Deposition of metal borides
US10032628B2 (en) 2016-05-02 2018-07-24 Asm Ip Holding B.V. Source/drain performance through conformal solid state doping
KR20170129475A (ko) 2016-05-17 2017-11-27 에이에스엠 아이피 홀딩 비.브이. 금속 배선 형성 방법 및 이를 이용한 반도체 장치의 제조 방법
US9859151B1 (en) 2016-07-08 2018-01-02 Asm Ip Holding B.V. Selective film deposition method to form air gaps
US9793135B1 (en) 2016-07-14 2017-10-17 ASM IP Holding B.V Method of cyclic dry etching using etchant film
US9887082B1 (en) 2016-07-28 2018-02-06 Asm Ip Holding B.V. Method and apparatus for filling a gap
US10177025B2 (en) 2016-07-28 2019-01-08 Asm Ip Holding B.V. Method and apparatus for filling a gap
US9812320B1 (en) 2016-07-28 2017-11-07 Asm Ip Holding B.V. Method and apparatus for filling a gap
US10090316B2 (en) 2016-09-01 2018-10-02 Asm Ip Holding B.V. 3D stacked multilayer semiconductor memory using doped select transistor channel
JP2018054500A (ja) * 2016-09-29 2018-04-05 東京エレクトロン株式会社 位置検出システム及び処理装置
US10229833B2 (en) 2016-11-01 2019-03-12 Asm Ip Holding B.V. Methods for forming a transition metal nitride film on a substrate by atomic layer deposition and related semiconductor device structures
US10134757B2 (en) 2016-11-07 2018-11-20 Asm Ip Holding B.V. Method of processing a substrate and a device manufactured by using the method
US10340135B2 (en) 2016-11-28 2019-07-02 Asm Ip Holding B.V. Method of topologically restricted plasma-enhanced cyclic deposition of silicon or metal nitride
US9916980B1 (en) 2016-12-15 2018-03-13 Asm Ip Holding B.V. Method of forming a structure on a substrate
US10269558B2 (en) 2016-12-22 2019-04-23 Asm Ip Holding B.V. Method of forming a structure on a substrate
US10283353B2 (en) 2017-03-29 2019-05-07 Asm Ip Holding B.V. Method of reforming insulating film deposited on substrate with recess pattern
US10103040B1 (en) 2017-03-31 2018-10-16 Asm Ip Holding B.V. Apparatus and method for manufacturing a semiconductor device
USD830981S1 (en) 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
US10312055B2 (en) 2017-07-26 2019-06-04 Asm Ip Holding B.V. Method of depositing film by PEALD using negative bias
US10249524B2 (en) 2017-08-09 2019-04-02 Asm Ip Holding B.V. Cassette holder assembly for a substrate cassette and holding member for use in such assembly
US10236177B1 (en) 2017-08-22 2019-03-19 ASM IP Holding B.V.. Methods for depositing a doped germanium tin semiconductor and related semiconductor device structures
US10319588B2 (en) 2017-10-10 2019-06-11 Asm Ip Holding B.V. Method for depositing a metal chalcogenide on a substrate by cyclical deposition
US10290508B1 (en) 2017-12-05 2019-05-14 Asm Ip Holding B.V. Method for forming vertical spacers for spacer-defined patterning

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5610683A (en) * 1992-11-27 1997-03-11 Canon Kabushiki Kaisha Immersion type projection exposure apparatus
US5786897A (en) * 1995-08-28 1998-07-28 Nikon Corporation Method and device for measuring pattern coordinates of a pattern formed on a pattern surface of a substrate
US5825043A (en) * 1996-10-07 1998-10-20 Nikon Precision Inc. Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus
US6342705B1 (en) * 1999-09-10 2002-01-29 Chapman Instruments System for locating and measuring an index mark on an edge of a wafer
US6400445B2 (en) * 1994-02-22 2002-06-04 Nikon Corporation Method and apparatus for positioning substrate

Family Cites Families (115)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2471038A (en) * 1946-10-29 1949-05-24 Jack & Heintz Prec Ind Inc Work centering attachment for metal turning machines
US3059260A (en) 1959-11-16 1962-10-23 Lester R Peilet Spring actuated self-cleaning retractable brush or the like
US4346164A (en) * 1980-10-06 1982-08-24 Werner Tabarelli Photolithographic method for the manufacture of integrated circuits
JPH0139207B2 (zh) 1981-01-14 1989-08-18 Nikon Kk
JPS6349893B2 (zh) * 1981-03-18 1988-10-06 Hitachi Ltd
US4457664B1 (zh) * 1982-03-22 1993-08-24 Ade Corp
JPS58202448A (en) * 1982-05-21 1983-11-25 Hitachi Ltd Exposing device
JPS5919912A (en) 1982-07-26 1984-02-01 Hitachi Ltd Immersion distance holding device
DD221563A1 (de) * 1983-09-14 1985-04-24 Mikroelektronik Zt Forsch Tech Immersionsobjektiv fuer die schrittweise projektionsabbildung einer maskenstruktur
DD224448A1 (de) * 1984-03-01 1985-07-03 Zeiss Jena Veb Carl Einrichtung zur fotolithografischen strukturuebertragung
JPS6265326A (en) 1985-09-18 1987-03-24 Hitachi Ltd Exposure device
US4700595A (en) * 1986-05-16 1987-10-20 Silicon Valley Group, Inc. Balance mechanism for movable jaw chuck of a spin station
JPS63157419A (en) * 1986-12-22 1988-06-30 Toshiba Corp Fine pattern transfer apparatus
US4880348A (en) * 1987-05-15 1989-11-14 Roboptek, Inc. Wafer centration device
US5102280A (en) * 1989-03-07 1992-04-07 Ade Corporation Robot prealigner
JP2642216B2 (ja) * 1989-05-23 1997-08-20 サイベック システムズ 半導体物品の予備位置決め方法及び装置
US5238354A (en) * 1989-05-23 1993-08-24 Cybeq Systems, Inc. Semiconductor object pre-aligning apparatus
US5194743A (en) * 1990-04-06 1993-03-16 Nikon Corporation Device for positioning circular semiconductor wafers
JPH04305917A (en) * 1991-04-02 1992-10-28 Nikon Corp Adhesion type exposure device
JPH04305915A (en) * 1991-04-02 1992-10-28 Nikon Corp Adhesion type exposure device
JPH04306915A (en) 1991-04-04 1992-10-29 Nec Corp Level conversion circuit
US5243195A (en) 1991-04-25 1993-09-07 Nikon Corporation Projection exposure apparatus having an off-axis alignment system and method of alignment therefor
US5513948A (en) * 1991-05-17 1996-05-07 Kensington Laboratories, Inc. Universal specimen prealigner
JP3200874B2 (ja) 1991-07-10 2001-08-20 株式会社ニコン 投影露光装置
JPH0562877A (ja) 1991-09-02 1993-03-12 Yasuko Shinohara 光によるlsi製造縮小投影露光装置の光学系
JPH06124873A (ja) * 1992-10-09 1994-05-06 Canon Inc 液浸式投影露光装置
US5448332A (en) 1992-12-25 1995-09-05 Nikon Corporation Exposure method and apparatus
JP3412704B2 (ja) 1993-02-26 2003-06-03 株式会社ニコン 投影露光方法及び装置、並びに露光装置
JP3316833B2 (ja) 1993-03-26 2002-08-19 株式会社ニコン 走査露光方法、面位置設定装置、走査型露光装置、及び前記方法を使用するデバイス製造方法
US5452078A (en) * 1993-06-17 1995-09-19 Ann F. Koo Method and apparatus for finding wafer index marks and centers
JPH07220990A (ja) * 1994-01-28 1995-08-18 Hitachi Ltd パターン形成方法及びその露光装置
JPH07270122A (ja) 1994-03-30 1995-10-20 Canon Inc 変位検出装置、該変位検出装置を備えた露光装置およびデバイスの製造方法
US5546179A (en) * 1994-10-07 1996-08-13 Cheng; David Method and apparatus for mapping the edge and other characteristics of a workpiece
JP3387075B2 (ja) 1994-12-12 2003-03-17 株式会社ニコン 走査露光方法、露光装置、及び走査型露光装置
US5783833A (en) 1994-12-12 1998-07-21 Nikon Corporation Method and apparatus for alignment with a substrate, using coma imparting optics
JPH08213306A (ja) 1995-02-08 1996-08-20 Nikon Corp 位置検出装置及び該装置を備えた投影露光装置
US5648854A (en) * 1995-04-19 1997-07-15 Nikon Corporation Alignment system with large area search for wafer edge and global marks
JPH08316124A (ja) * 1995-05-19 1996-11-29 Hitachi Ltd 投影露光方法及び露光装置
JPH08316125A (ja) * 1995-05-19 1996-11-29 Hitachi Ltd 投影露光方法及び露光装置
JP3651630B2 (ja) 1996-08-05 2005-05-25 株式会社ニコン 投影露光方法及び投影露光装置
JPH10199804A (ja) * 1996-11-14 1998-07-31 Nikon Corp 投影露光装置及び投影露光方法並びにデバイス製造方法
JPH10247681A (ja) * 1997-03-04 1998-09-14 Nikon Corp 位置ずれ検出方法及び装置、位置決め装置並びに露光装置
JP3747566B2 (ja) * 1997-04-23 2006-02-22 株式会社ニコン 液浸型露光装置
JP3817836B2 (ja) * 1997-06-10 2006-09-06 株式会社ニコン 露光装置及びその製造方法並びに露光方法及びデバイス製造方法
JPH1116816A (ja) 1997-06-25 1999-01-22 Nikon Corp 投影露光装置、該装置を用いた露光方法、及び該装置を用いた回路デバイスの製造方法
JP4210871B2 (ja) * 1997-10-31 2009-01-21 株式会社ニコン 露光装置
US6164894A (en) * 1997-11-04 2000-12-26 Cheng; David Method and apparatus for integrated wafer handling and testing
WO1999028220A1 (fr) * 1997-12-03 1999-06-10 Nikon Corporation Dispositif et procede de transfert de substrats
JPH11176727A (ja) * 1997-12-11 1999-07-02 Nikon Corp 投影露光装置
AU2747999A (en) * 1998-03-26 1999-10-18 Nikon Corporation Projection exposure method and system
US6374149B1 (en) * 1998-05-18 2002-04-16 Texas Instruments Incorporated System and method for determining the center of a wafer on a wafer table
AU3849199A (en) 1998-05-19 1999-12-06 Nikon Corporation Aberration measuring instrument and measuring method, projection exposure apparatus provided with the instrument and device-manufacturing method using the measuring method, and exposure method
JP2000058436A (ja) 1998-08-11 2000-02-25 Nikon Corp 投影露光装置及び露光方法
JP2000077314A (ja) * 1998-09-03 2000-03-14 Nikon Corp リソグラフィシステム及び露光装置
JP4264676B2 (ja) * 1998-11-30 2009-05-20 株式会社ニコン 露光装置及び露光方法
US6275742B1 (en) * 1999-04-16 2001-08-14 Berkeley Process Control, Inc. Wafer aligner system
WO2001035168A1 (en) 1999-11-10 2001-05-17 Massachusetts Institute Of Technology Interference lithography utilizing phase-locked scanning beams
JP3099826B2 (ja) * 1999-12-09 2000-10-16 株式会社ニコン 露光装置、露光方法、及び素子製造方法
TWI240849B (en) 2000-02-10 2005-10-01 Asml Netherlands Bv Object positioning method for a lithographic projection apparatus
SG124257A1 (en) 2000-02-25 2006-08-30 Nikon Corp Exposure apparatus and exposure method capable of controlling illumination distribution
JP2001313250A (ja) 2000-02-25 2001-11-09 Nikon Corp 露光装置、その調整方法、及び前記露光装置を用いるデバイス製造方法
JP2001332490A (ja) * 2000-03-14 2001-11-30 Nikon Corp 位置合わせ方法、露光方法、露光装置、及びデバイス製造方法
JP2001257157A (ja) 2000-03-14 2001-09-21 Nikon Corp アライメント装置、アライメント方法、露光装置、及び露光方法
JP2002014005A (ja) 2000-04-25 2002-01-18 Nikon Corp 空間像計測方法、結像特性計測方法、空間像計測装置及び露光装置
US20020041377A1 (en) 2000-04-25 2002-04-11 Nikon Corporation Aerial image measurement method and unit, optical properties measurement method and unit, adjustment method of projection optical system, exposure method and apparatus, making method of exposure apparatus, and device manufacturing method
US6788385B2 (en) * 2001-06-21 2004-09-07 Nikon Corporation Stage device, exposure apparatus and method
TW529172B (en) 2001-07-24 2003-04-21 Asml Netherlands Bv Imaging apparatus
US6728596B1 (en) * 2001-11-28 2004-04-27 Therma-Wave, Inc. Wafer prealigner with phase sensitive detection
EP1480258A4 (en) 2002-01-29 2005-11-09 Nikon Corp Exposure device and exposure method
JP2004072076A (ja) * 2002-06-10 2004-03-04 Nikon Corp 露光装置及びステージ装置、並びにデバイス製造方法
KR20050035890A (ko) * 2002-08-23 2005-04-19 가부시키가이샤 니콘 투영 광학계, 포토리소그래피 방법, 노광 장치 및 그 이용방법
SG121822A1 (en) * 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
CN100568101C (zh) * 2002-11-12 2009-12-09 Asml荷兰有限公司 光刻装置和器件制造方法
EP1420299B1 (en) * 2002-11-12 2011-01-05 ASML Netherlands B.V. Immersion lithographic apparatus and device manufacturing method
DE60335595D1 (de) * 2002-11-12 2011-02-17 Asml Netherlands Bv Lithographischer Apparat mit Immersion und Verfahren zur Herstellung einer Vorrichtung
US7213963B2 (en) * 2003-06-09 2007-05-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN101349876B (zh) * 2002-11-12 2010-12-01 Asml荷兰有限公司 光刻装置和器件制造方法
EP1420298B1 (en) 2002-11-12 2013-02-20 ASML Netherlands B.V. Lithographic apparatus
AU2003284672A1 (en) 2002-12-03 2004-06-23 Nikon Corporation Contaminant removing method and device, and exposure method and apparatus
US7242455B2 (en) 2002-12-10 2007-07-10 Nikon Corporation Exposure apparatus and method for producing device
JP4352874B2 (ja) * 2002-12-10 2009-10-28 株式会社ニコン 露光装置及びデバイス製造方法
AU2003289237A1 (en) * 2002-12-10 2004-06-30 Nikon Corporation Exposure apparatus and method for manufacturing device
WO2004053955A1 (ja) 2002-12-10 2004-06-24 Nikon Corporation 露光装置及びデバイス製造方法
JP4645027B2 (ja) * 2002-12-10 2011-03-09 株式会社ニコン 露光装置及び露光方法、デバイス製造方法
JP4595320B2 (ja) * 2002-12-10 2010-12-08 株式会社ニコン 露光装置、及びデバイス製造方法
SG158745A1 (en) 2002-12-10 2010-02-26 Nikon Corp Exposure apparatus and method for producing device
JPWO2004059710A1 (ja) * 2002-12-24 2006-05-11 株式会社ニコン 収差計測方法、露光方法及び露光装置
KR101096478B1 (ko) * 2003-01-23 2011-12-20 가부시키가이샤 니콘 노광 장치
US6903338B2 (en) * 2003-01-30 2005-06-07 Kla-Tencor Technologies Corporation Method and apparatus for reducing substrate edge effects in electron lenses
US7008295B2 (en) * 2003-02-04 2006-03-07 Applied Materials Inc. Substrate monitoring during chemical mechanical polishing
JP4228137B2 (ja) * 2003-02-14 2009-02-25 株式会社ニコン 露光装置及びデバイス製造方法
US7372250B2 (en) * 2003-02-20 2008-05-13 Applied Materials, Inc. Methods and apparatus for determining a position of a substrate relative to a support stage
JP4604452B2 (ja) 2003-02-26 2011-01-05 株式会社ニコン 露光装置、露光方法、及びデバイス製造方法
CN104678715B (zh) 2003-02-26 2017-05-17 株式会社尼康 曝光方法以及器件制造方法
JP2004260117A (ja) * 2003-02-27 2004-09-16 Nikon Corp ステージ装置、露光装置、及びデバイス製造方法
SG125108A1 (en) * 2003-03-11 2006-09-29 Asml Netherlands Bv Assembly comprising a sensor for determining at least one of tilt and height of a substrate, a method therefor and a lithographic projection apparatus
SG115631A1 (en) * 2003-03-11 2005-10-28 Asml Netherlands Bv Lithographic projection assembly, load lock and method for transferring objects
JP4362862B2 (ja) 2003-04-01 2009-11-11 株式会社ニコン ステージ装置及び露光装置
JP2004311897A (ja) * 2003-04-10 2004-11-04 Nikon Corp 露光方法及び装置、デバイス製造方法、並びにマスク
EP3232271A1 (en) * 2003-04-10 2017-10-18 Nikon Corporation Environmental system including vacuum scavenge for an immersion lithography apparatus
EP1616220B1 (en) 2003-04-11 2013-05-01 Nikon Corporation Apparatus and method for maintaining immersion fluid under a lithographic projection lens
JP4315420B2 (ja) * 2003-04-18 2009-08-19 キヤノン株式会社 露光装置及び露光方法
KR101015778B1 (ko) * 2003-06-03 2011-02-22 도쿄엘렉트론가부시키가이샤 기판 처리장치 및 기판 수수 위치의 조정 방법
JP3862678B2 (ja) 2003-06-27 2006-12-27 キヤノン株式会社 露光装置及びデバイス製造方法
EP2853943B1 (en) 2003-07-08 2016-11-16 Nikon Corporation Wafer table for immersion lithography
US6934661B2 (en) * 2003-12-16 2005-08-23 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer edge detector
US7589822B2 (en) * 2004-02-02 2009-09-15 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
US20050221736A1 (en) * 2004-03-30 2005-10-06 Nikon Corporation Wafer polishing control system for chemical mechanical planarization machines
US7161664B2 (en) * 2004-04-13 2007-01-09 Electronic Scripting Products, Inc. Apparatus and method for optical determination of intermediate distances
JP2006073915A (ja) * 2004-09-06 2006-03-16 Nikon Corp マーク、搬送装置、露光装置、位置検出方法及び搬送方法並びにデバイス製造方法
WO2006041083A1 (ja) * 2004-10-13 2006-04-20 Nikon Corporation 露光装置、露光方法及びデバイス製造方法
US7119876B2 (en) * 2004-10-18 2006-10-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7583357B2 (en) * 2004-11-12 2009-09-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
TWI588872B (zh) * 2004-11-18 2017-06-21 尼康股份有限公司
US7352440B2 (en) * 2004-12-10 2008-04-01 Asml Netherlands B.V. Substrate placement in immersion lithography

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5610683A (en) * 1992-11-27 1997-03-11 Canon Kabushiki Kaisha Immersion type projection exposure apparatus
US6400445B2 (en) * 1994-02-22 2002-06-04 Nikon Corporation Method and apparatus for positioning substrate
US5786897A (en) * 1995-08-28 1998-07-28 Nikon Corporation Method and device for measuring pattern coordinates of a pattern formed on a pattern surface of a substrate
US5825043A (en) * 1996-10-07 1998-10-20 Nikon Precision Inc. Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus
US6342705B1 (en) * 1999-09-10 2002-01-29 Chapman Instruments System for locating and measuring an index mark on an edge of a wafer

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EP1821336A4 (en) 2011-03-09
US9857692B2 (en) 2018-01-02
CN103186057A (zh) 2013-07-03
US20160161861A1 (en) 2016-06-09
TWI588872B (zh) 2017-06-21
US20130329208A1 (en) 2013-12-12
KR101861949B1 (ko) 2018-07-02
CN104360582B (zh) 2017-06-16
US9298108B2 (en) 2016-03-29
TW201630047A (en) 2016-08-16
US8059260B2 (en) 2011-11-15
JP5403296B2 (ja) 2014-01-29
KR20120065437A (ko) 2012-06-20
JP2012084927A (ja) 2012-04-26
JP5721064B2 (ja) 2015-05-20
US20130329200A1 (en) 2013-12-12
CN103149803B (zh) 2016-03-30
US20080151257A1 (en) 2008-06-26
US10222708B2 (en) 2019-03-05
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CN101057316A (zh) 2007-10-17
KR20140018367A (ko) 2014-02-12

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