JP2005229113A - 電子機器および半導体装置および半導体モジュール - Google Patents
電子機器および半導体装置および半導体モジュール Download PDFInfo
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- JP2005229113A JP2005229113A JP2005028375A JP2005028375A JP2005229113A JP 2005229113 A JP2005229113 A JP 2005229113A JP 2005028375 A JP2005028375 A JP 2005028375A JP 2005028375 A JP2005028375 A JP 2005028375A JP 2005229113 A JP2005229113 A JP 2005229113A
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- solder
- metal
- semiconductor device
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
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- C22C11/06—Alloys based on lead with tin as the next major constituent
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Abstract
新規なはんだ接続による電子機器を提供することにある。特に温度階層接続における高温側のはんだ接続を実現することにある。
【課題手段】
半導体装置と基板の接続部が、Cu等の金属ボールおよび該金属ボールとSnの化合物からなり、該金属ボールは該化合物により連結されている。
【選択図】 図1
Description
1)max290℃以下での大気中リフロー接続が可能であること〔チップ部品 の耐熱保証温度;290℃〕。
2)2次リフロー(max260℃)で溶けないこと、もしくは溶けてもチップが 動かないこと(高周波特性に影響するため)。
3)2次リフロー時にモジュール内のはんだが再溶融しても、チップ部品 のはんだの体積膨張によるショートがないこと。
また、本発明は、電子部品と基板を接続するはんだとして、表面にSnめっきされたCuボールを有するはんだペーストを用いるものである。
2.Snボール
3.溶融Sn
4.フラックス
5.Snめっき
6.中継基板の端子
7.Au−20Snはんだ
8.ワイヤボンド
9.キャップ
10.接合部
11.外部接続端子
12.印刷パターン
13.素子
14.中継基板
15.抵抗加熱体
16.メタライズ
17.チップ部品
18.Cuパッド
19.基板
20.エッチング
21.溶融はんだ
22.Niめっき
23.Snめっき
24.Ni−Snめっき
25.Siチップ
26.シリコーンゲル
27.Cu−Sn複合はんだ
28.軟らかい樹脂
29.リード
30.Sn−Ag−Cu系Pbフリーはんだ
31.Alフィン
32.フィンとの接合部
33.リードとの接合部
34.バンプ
35.Si基板
36.複合はんだペースト
37.端子
38.端子(Cuパッド)
39.Cu
40.有機材
41.Cuスルーホール導体
42.Ag−Pd導体
43.Al2O3基板
44.厚膜スルーホール導体
45.W−Ni導体
46.Ag−Pt/Ni/Au電極
47.かしめ部
48.樹脂
49.ワイヤボンデイング端子
50.TQFP−LSI
51.リードフレーム
52.熱拡散板
53.タブ
54.導電ペースト
61.キャビテイ
62.スリット
63.半導体装置
64.多数個段取りAl2O3多層セラミック基板
65.スキージ
66.メタルマスク
67.樹脂塗布済み基板
68.高硬度樹脂
69.樹脂圧力
70.はんだ再溶融膨張圧
71.はんだ流れ出し
72.接続端子
73.一括封止部
74.Cu6Sn5
75.部品端子部
76.Pb系はんだ
80.金属ボール(Cuボール)
81.低熱膨張、低剛性樹脂
82.薄膜電極
83.電極端子
84.接触部(金属間化合物)
85.ボール固定用はんだ
86.ワイヤバンピング端子
87.Cu端子
88.Cuめっき
89.ホトレジ
90.ポリイミド絶縁膜
91.Cuバンプ
Claims (14)
- 半導体チップと、前記半導体チップと接続されたタブと、および
ボンディングワイヤおよびリードによって前記半導体チップの端子と電気的に接続された外部接続端子とを有する半導体装置において、
前記半導体チップと前記タブとは、
粒子状の第一の金属と、前記第一の金属の粒子間を接続する第一の温度によって生成された前記第一の金属の成分を含む金属間化合物を介して接続されており、
前記第一の金属と前記金属間化合物とは、前記第一の温度では溶融しないことを特徴とする半導体装置。 - 半導体チップと、
前記半導体チップと接続部を介して接続されたタブと、および
ボンディングワイヤおよびリードによって前記半導体チップの端子と電気的に接続された外部接続端子とを有する半導体装置において、
前記接続部は、粒子状の第一の金属と、前記第一の金属の粒子間を接続する第一の温度によって生成された前記第一の金属の成分を含む金属間化合物とを有し、
前記半導体チップと前記タブとは、前記第一の温度でも接続されていることを特徴とする半導体装置。 - 半導体チップと、
前記半導体チップと接続部を介して接続されたタブと、および
ボンディングワイヤおよびリードによって前記半導体チップの端子と電気的に接続された外部接続端子とを有する半導体装置において、
前記接続部は、粒子状の第一の金属と、前記第一の金属の粒子間を接続する第一の温度によって生成された前記第一の金属の成分を含む金属間化合物とを有し、前記第一の温度では溶融しないことを特徴とする半導体装置。 - 請求項1から3のいずれか1項に記載の半導体装置において、
前記金属間化合物は、前記第一の金属の成分とSn基はんだのSn成分との化合物であることを特徴とする半導体装置。 - 請求項1から4のいずれか1項に記載の半導体装置において、
前記第一の金属は、単体金属であることを特徴とする半導体装置。 - 請求項5記載の半導体装置において、
前記第一の金属は、Cuであることを特徴とする半導体装置。 - 請求項5記載の半導体装置において、
前記第一の金属は、Ag、Au、Al、またはNiのいずれかであることを特徴とする半導体装置。 - 請求項1から3のいずれか1項に記載の半導体装置において、
前記第一の金属は、単体金属、合金、化合物またはこれらの混合物のいずれかであることを特徴とする半導体装置。 - 請求項1から7のいずれか1項に記載の半導体装置において、
前記粒子状の第一の金属は、金属ボールであることを特徴とする半導体装置。 - 請求項9記載の半導体装置において、
前記金属ボールの径は、5μmから10μmであることを特徴とする半導体装置。 - 請求項9記載の半導体装置において、
前記金属ボールの径は、20μmから40μmであることを特徴とする半導体装置。 - 請求項4記載の半導体装置において、
前記金属間化合物は、Cu6Sn5であることを特徴とする半導体装置。 - 半導体チップと、
前記半導体チップと接続部を介して接続されたタブと、および
ボンディングワイヤおよびリードによって前記半導体チップの端子と電気的に接続された外部接続端子とを有する半導体装置において、
前記接続部は、少なくともCu成分を有する粒子状の第一の金属と、前記第一の金属の粒子間を接続する第一の温度によって生成された前記第一の金属の少なくともCu成分とはんだのSn成分とを含む金属間化合物とを有し、前記第一の温度では溶融しないことを特徴とする半導体装置。 - 半導体チップと該半導体チップが実装される実装基板を有する半導体装置であって、
前記半導体チップの電極と前記実装基板の電極は、Cu6Sn5を含むCuSn化合物と粒子状のCuを有する接続部により接続され、かつ粒子状のCu同士は前記CuSn化合物で連結されていることを特徴とする半導体装置。
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JP2005026702A (ja) * | 2000-06-12 | 2005-01-27 | Hitachi Ltd | 電子機器および半導体装置および半導体モジュール |
JP2007088468A (ja) * | 2005-09-19 | 2007-04-05 | Analog Integrations Corp | 局部接合構造 |
JP2007124862A (ja) * | 2005-10-31 | 2007-05-17 | Furukawa Electric Co Ltd:The | バスバー付き回路基板 |
JP2008109059A (ja) * | 2006-10-27 | 2008-05-08 | Shinko Electric Ind Co Ltd | 電子部品の基板への搭載方法及びはんだ面の形成方法 |
JP2014199852A (ja) * | 2013-03-29 | 2014-10-23 | 独立行政法人産業技術総合研究所 | 接合方法及び半導体モジュールの製造方法 |
JP6509469B1 (ja) * | 2018-11-08 | 2019-05-08 | 三菱電機株式会社 | 接合構造体、半導体装置及びその製造方法 |
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JP2005026702A (ja) * | 2000-06-12 | 2005-01-27 | Hitachi Ltd | 電子機器および半導体装置および半導体モジュール |
JP2007088468A (ja) * | 2005-09-19 | 2007-04-05 | Analog Integrations Corp | 局部接合構造 |
JP2007124862A (ja) * | 2005-10-31 | 2007-05-17 | Furukawa Electric Co Ltd:The | バスバー付き回路基板 |
JP4728776B2 (ja) * | 2005-10-31 | 2011-07-20 | 古河電気工業株式会社 | バスバー付き回路基板 |
JP2008109059A (ja) * | 2006-10-27 | 2008-05-08 | Shinko Electric Ind Co Ltd | 電子部品の基板への搭載方法及びはんだ面の形成方法 |
JP2014199852A (ja) * | 2013-03-29 | 2014-10-23 | 独立行政法人産業技術総合研究所 | 接合方法及び半導体モジュールの製造方法 |
JP6509469B1 (ja) * | 2018-11-08 | 2019-05-08 | 三菱電機株式会社 | 接合構造体、半導体装置及びその製造方法 |
WO2020095411A1 (ja) * | 2018-11-08 | 2020-05-14 | 三菱電機株式会社 | 接合構造体、半導体装置及びその製造方法 |
US20210343676A1 (en) * | 2018-11-08 | 2021-11-04 | Mitsubishi Electric Corporation | Joint structure, semiconductor device, and method of manufacturing same |
US11764183B2 (en) * | 2018-11-08 | 2023-09-19 | Mitsubishi Electric Corporation | Joint structure, semiconductor device, and method of manufacturing same |
JP2020176331A (ja) * | 2019-04-22 | 2020-10-29 | パナソニック株式会社 | 接合構造体および接合材料 |
WO2023248664A1 (ja) * | 2022-06-23 | 2023-12-28 | パナソニックIpマネジメント株式会社 | 接合材料および接合構造体 |
Also Published As
Publication number | Publication date |
---|---|
US20020171157A1 (en) | 2002-11-21 |
JP2002261105A (ja) | 2002-09-13 |
TWI248842B (en) | 2006-02-11 |
KR100724031B1 (ko) | 2007-06-04 |
US7075183B2 (en) | 2006-07-11 |
JP3414388B2 (ja) | 2003-06-09 |
KR100724030B1 (ko) | 2007-06-04 |
KR20010111635A (ko) | 2001-12-19 |
US20020114726A1 (en) | 2002-08-22 |
TWI230104B (en) | 2005-04-01 |
KR20030078854A (ko) | 2003-10-08 |
US20020100986A1 (en) | 2002-08-01 |
US8022551B2 (en) | 2011-09-20 |
JP4788119B2 (ja) | 2011-10-05 |
JP2005026702A (ja) | 2005-01-27 |
TWI248384B (en) | 2006-02-01 |
JP2002254194A (ja) | 2002-09-10 |
KR100428277B1 (ko) | 2004-04-27 |
JP2002280396A (ja) | 2002-09-27 |
JP3966332B2 (ja) | 2007-08-29 |
US20070031279A1 (en) | 2007-02-08 |
US7259465B2 (en) | 2007-08-21 |
KR20030078853A (ko) | 2003-10-08 |
JP3558063B2 (ja) | 2004-08-25 |
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