JP4660259B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JP4660259B2 JP4660259B2 JP2005117857A JP2005117857A JP4660259B2 JP 4660259 B2 JP4660259 B2 JP 4660259B2 JP 2005117857 A JP2005117857 A JP 2005117857A JP 2005117857 A JP2005117857 A JP 2005117857A JP 4660259 B2 JP4660259 B2 JP 4660259B2
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- pad electrode
- semiconductor device
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- semiconductor substrate
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Description
Claims (5)
- ダイシングラインにより区分され、かつ第1のパッド電極が形成された半導体基板を準備し、
前記半導体基板の前記第1のパッド電極が形成された面に支持体を接着する工程と、
前記半導体基板上に前記支持体を接着した後に、前記支持体を選択的に除去することにより、前記支持体を貫通して当該第1のパッド電極を露出する第1の開口部を形成する工程と、
前記ダイシングラインに沿ったダイシングにより前記半導体基板を個々の半導体チップに分割する工程と、を有することを特徴とする半導体装置の製造方法。 - ダイシングラインにより区分された半導体基板を準備し、
前記半導体基板上に、第1のパッド電極と、前記ダイシングラインの近傍に沿って、所定の間隔で離間する第2のパッド電極を形成する工程と、
前記半導体基板上に、前記第1のパッド電極と前記第2のパッド電極とを接続するようにパターニングされた配線層を形成する工程と、
前記半導体基板の前記第1及び第2のパッド電極及び前記配線層が形成された面に支持体を接着する工程と、
前記半導体基板上に前記支持体を接着した後に、前記支持体を選択的に除去することにより、前記支持体を貫通して前記第1のパッド電極を露出する第1の開口部と、前記支持体を貫通して前記第2のパッド電極を露出する第2の開口部を形成する工程と、
前記第2の開口部で露出する前記第2のパッド電極上に、導電端子を形成する工程と、
前記ダイシングラインに沿ったダイシングにより前記半導体基板を個々の半導体チップに分割する工程と、を有することを特徴とする半導体装置の製造方法。 - 前記支持体は、ガラス基板、アクリル等のプラスチック基板、もしくは赤外線を透過するシリコン基板のうちいずれか1つにより形成されることを特徴とする請求項1又は請求項2に記載の半導体装置の製造方法。
- 前記半導体基板を個々の半導体チップに分割する工程の前に、
前記第1の開口部で露出する前記第1のパッド電極上に、導電端子を形成する工程を有することを特徴とする請求項1乃至請求項3のうちいずれかに記載の半導体装置の製造方法。 - 凹部が形成された回路基板を準備し、前記ダイシングにより前記半導体基板を前記半導体チップに分割する工程の後に、前記凹部に前記半導体チップが埋め込まれるようにして載置されることを特徴とする請求項1乃至請求項4のうちいずれかに記載の半導体装置の製造方法。
Priority Applications (5)
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JP2005117857A JP4660259B2 (ja) | 2004-06-10 | 2005-04-15 | 半導体装置の製造方法 |
TW094117769A TWI294165B (en) | 2004-06-10 | 2005-05-31 | Semiconductor device and manufacturing method thereof |
US11/145,176 US7397134B2 (en) | 2004-06-10 | 2005-06-06 | Semiconductor device mounted on and electrically connected to circuit board |
KR1020050049134A KR100712159B1 (ko) | 2004-06-10 | 2005-06-09 | 반도체 장치 및 그 제조 방법 |
EP05012443A EP1605519A3 (en) | 2004-06-10 | 2005-06-09 | Semiconductor device and manufacturing method of the same |
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JP2005117857A JP4660259B2 (ja) | 2004-06-10 | 2005-04-15 | 半導体装置の製造方法 |
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JP4660259B2 true JP4660259B2 (ja) | 2011-03-30 |
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US (1) | US7397134B2 (ja) |
EP (1) | EP1605519A3 (ja) |
JP (1) | JP4660259B2 (ja) |
KR (1) | KR100712159B1 (ja) |
TW (1) | TWI294165B (ja) |
Families Citing this family (13)
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EP1447844A3 (en) * | 2003-02-11 | 2004-10-06 | Axalto S.A. | Reinforced semiconductor wafer |
TW200737506A (en) * | 2006-03-07 | 2007-10-01 | Sanyo Electric Co | Semiconductor device and manufacturing method of the same |
JP4840770B2 (ja) * | 2006-07-04 | 2011-12-21 | セイコーインスツル株式会社 | 半導体パッケージの製造方法 |
US8102039B2 (en) * | 2006-08-11 | 2012-01-24 | Sanyo Semiconductor Co., Ltd. | Semiconductor device and manufacturing method thereof |
JP5010247B2 (ja) * | 2006-11-20 | 2012-08-29 | オンセミコンダクター・トレーディング・リミテッド | 半導体装置及びその製造方法 |
DE102008052244A1 (de) * | 2008-10-18 | 2010-04-22 | Carl Freudenberg Kg | Flexible Leiterplatte |
JP2010103300A (ja) * | 2008-10-23 | 2010-05-06 | Sanyo Electric Co Ltd | 半導体装置及びその製造方法 |
JP5887901B2 (ja) * | 2011-12-14 | 2016-03-16 | 富士電機株式会社 | 半導体装置及び半導体装置の製造方法 |
KR102037866B1 (ko) * | 2013-02-05 | 2019-10-29 | 삼성전자주식회사 | 전자장치 |
US9997554B2 (en) * | 2014-12-24 | 2018-06-12 | Stmicroelectronics Pte Ltd | Chip scale package camera module with glass interposer having lateral conductive traces between a first and second glass layer and method for making the same |
DE112015007196T5 (de) * | 2015-12-18 | 2018-08-23 | Intel IP Corporation | Interposer mit an den seitenwänden freigelegtem leitfähigem routing |
US20190058081A1 (en) * | 2017-08-18 | 2019-02-21 | Khaled Ahmed | Micro light-emitting diode (led) display and assembly apparatus |
WO2021200094A1 (ja) * | 2020-03-31 | 2021-10-07 | ソニーセミコンダクタソリューションズ株式会社 | 半導体装置 |
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- 2005-05-31 TW TW094117769A patent/TWI294165B/zh not_active IP Right Cessation
- 2005-06-06 US US11/145,176 patent/US7397134B2/en active Active
- 2005-06-09 EP EP05012443A patent/EP1605519A3/en not_active Withdrawn
- 2005-06-09 KR KR1020050049134A patent/KR100712159B1/ko not_active IP Right Cessation
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KR20060048288A (ko) | 2006-05-18 |
EP1605519A2 (en) | 2005-12-14 |
KR100712159B1 (ko) | 2007-04-30 |
US7397134B2 (en) | 2008-07-08 |
TW200605279A (en) | 2006-02-01 |
EP1605519A3 (en) | 2009-01-14 |
TWI294165B (en) | 2008-03-01 |
JP2006024891A (ja) | 2006-01-26 |
US20050275093A1 (en) | 2005-12-15 |
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