JP6057224B2 - 部品実装構造体 - Google Patents
部品実装構造体 Download PDFInfo
- Publication number
- JP6057224B2 JP6057224B2 JP2014532733A JP2014532733A JP6057224B2 JP 6057224 B2 JP6057224 B2 JP 6057224B2 JP 2014532733 A JP2014532733 A JP 2014532733A JP 2014532733 A JP2014532733 A JP 2014532733A JP 6057224 B2 JP6057224 B2 JP 6057224B2
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- Prior art keywords
- metal
- solder
- component mounting
- electrode
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H—ELECTRICITY
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
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- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H—ELECTRICITY
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- H05K1/00—Printed circuits
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- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/921—Connecting a surface with connectors of different types
- H01L2224/9211—Parallel connecting processes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0218—Composite particles, i.e. first metal coated with second metal
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0221—Insulating particles having an electrically conductive coating
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0233—Deformable particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0425—Solder powder or solder coated metal powder
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0465—Shape of solder, e.g. differing from spherical shape, different shapes due to different solder pads
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
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Description
前記複数の第1電極の各々と対応する、第2電極を有する、電子部品としての第2対象物と、
前記第1電極と、対応する前記第2電極とを接合する接合部と、
前記接合部の少なくとも一部を覆う樹脂補強部と、
を含み、
前記接合部が、第1金属および樹脂粒子の少なくとも一方を含む第1コア、並びに、前記第1コアの表面を覆うとともに、前記第1金属と、前記第1金属よりも融点の低い第2金属との金属間化合物を含む第1金属間化合物層を有し、
前記樹脂補強部が、前記第1電極と前記第2電極との間の空間に存在する第1部分と、それ以外の第2部分とを有し、
前記第2部分は、前記第1金属および前記樹脂粒子の少なくとも一方を含む第2コアと、前記第1金属と前記第2金属との金属間化合物を含む第2金属間化合物層と、を含む粒状物、を含み、
前記第2部分における前記粒状物の含有量が0.1〜10体積%であるとともに、
前記第1金属間化合物および前記第2金属間化合物の融点が、前記第2金属よりも高く、
前記第1電極と前記第2電極とが、前記第1電極と前記第2電極との間に延在する前記第1金属間化合物層により導通している。
図1に、本発明の一実施形態に係る部品実装構造体を製造するための、電子部品実装システムの一例である実装ラインをブロック図により示す。図2に、本発明の一実施形態に係る部品実装構造体を断面図により示す。
先ず、図5に示すように、基板供給ユニット1により供給された基板14に対し、混合物供給ユニット2により、半田−樹脂混合物26を、基板14の電子部品12が搭載される領域である搭載領域AR1に供給する。搭載領域AR1には、電子部品12の部品電極16と接合されるランド電極18が全て形成されている。
(実施形態2)
図11Aに、本実施形態に係る部品実装構造体を一部断面図により示す。図11Bに、本実施形態に係る部品実装構造体を製造するのに使用される粒状物前駆体を断面図により示す。
(実施形態3)
図12に、本実施形態の部品実装構造体の要部を拡大して示す。実施形態3の部品実装体においては、樹脂補強部29がシリカ(SiO2)、およびアルミナ等の無機フィラーを含んでいる。本実施形態の部品実装構造体は、上記のような無機フィラーを含ませた半田−樹脂混合物を使用して製造することができる。それ以外は、実施形態1および実施形態2の部品実装方法および部品実装システムと同様の方法およびシステムにより、本実施形態の部品実装構造体を製造することができる。
図14に、本発明の部品実装構造体を製造するための部品実装システムの他の一例である実装ラインをブロック図により示す。図示例のライン10Aは、実施形態1のライン10と同様に、フレキシブル基板に半導体チップ等を搭載したモジュールである電子部品12を、電子機器の回路基板であるリジッドまたはフレキシブルな基板14に実装するための実装ラインである。ライン10Aは、基板14をラインに供給する基板供給ユニット1、半田−樹脂混合物を基板14の電極であるランド電極18に供給するための混合物供給ユニット2、および構造体回収ユニット4を含む点で、実施形態1のライン10と同様である。
Claims (12)
- 複数の第1電極を有する第1対象物と、
前記複数の第1電極の各々と対応する、第2電極を有する、電子部品としての第2対象物と、
前記第1電極と、対応する前記第2電極とを接合する接合部と、
前記接合部の少なくとも一部を覆う樹脂補強部と、
を含み、
前記接合部が、第1金属および樹脂粒子の少なくとも一方を含む第1コア、並びに、前記第1コアの表面を覆うとともに、前記第1金属と、前記第1金属よりも融点の低い第2金属との金属間化合物を含む第1金属間化合物層を有し、
前記樹脂補強部が、前記第1電極と前記第2電極との間の空間に存在する第1部分と、それ以外の第2部分とを有し、
前記第2部分は、前記第1金属および前記樹脂粒子の少なくとも一方を含む第2コアと、前記第1金属と前記第2金属との金属間化合物を含む第2金属間化合物層と、を含む粒状物、を含み、
前記第2部分における前記粒状物の含有量が0.1〜10体積%であるとともに、
前記第1金属間化合物および前記第2金属間化合物の融点が、前記第2金属よりも高く、
前記第1電極と前記第2電極とが、前記第1電極と前記第2電極との間に延在する前記第1金属間化合物層により導通している、部品実装構造体。 - 前記接合部が、前記第1金属間化合物層の表面を覆う、前記第2金属を含む第1半田層を有する、請求項1記載の部品実装構造体。
- 前記粒状物が、前記第2金属間化合物層の表面を覆う、前記第2金属を含む第2半田層を有する、請求項1または2記載の部品実装構造体。
- 前記第1金属が、前記樹脂粒子と前記第1半田層との間に介在している、請求項2記載の部品実装構造体。
- 前記第1金属が、前記樹脂粒子と前記第2半田層との間に介在している、請求項3記載の部品実装構造体。
- 前記第1金属が、Cuを含む、請求項1〜5のいずれか1項に記載の部品実装構造体。
- 前記第2金属が、Sn,Pb,Ag,Zn,Bi,In,CuおよびSbよりなる群から選択される少なくとも1種を含む合金である、請求項1〜6のいずれか1項に記載の部品実装構造体。
- 前記樹脂補強部が、さらに、前記粒状物よりも平均粒子径の小さい無機フィラーを含む、請求項1〜7のいずれか1項に記載の部品実装構造体。
- 前記第1対象物および前記第2対象物が、いずれもフレキシブル基板を含む、請求項1〜8のいずれか1項に記載の部品実装構造体。
- 前記第2対象物が、フレキシブル基板を含み、前記第1対象物が、リジッド基板を含む、請求項1〜8のいずれか1項に記載の部品実装構造体。
- 前記第2対象物が、半導体チップを含み、前記第1対象物が、フレキシブル基板またはリジッド基板を含む、請求項1〜8のいずれか1項に記載の部品実装構造体。
- 前記第1対象物および前記第2対象物が、いずれも半導体チップを含む、請求項1〜8のいずれか1項に記載の部品実装構造体。
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US10177265B2 (en) | 2016-01-04 | 2019-01-08 | The Boeing Company | Bonding using conductive particles in conducting adhesives |
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US10224301B2 (en) * | 2017-07-05 | 2019-03-05 | Advanced Semiconductor Engineering, Inc. | Semiconductor package device and method of manufacturing the same |
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US6562217B1 (en) * | 1997-04-17 | 2003-05-13 | Sekisui Chemical Co., Ltd. | Method and device for manufacturing conductive particles |
JPH11219982A (ja) * | 1998-02-04 | 1999-08-10 | Sony Chem Corp | 導電粒子及びそれを用いた異方性導電接着剤 |
US6337445B1 (en) * | 1998-03-16 | 2002-01-08 | Texas Instruments Incorporated | Composite connection structure and method of manufacturing |
TWI230104B (en) | 2000-06-12 | 2005-04-01 | Hitachi Ltd | Electronic device |
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JP3924552B2 (ja) * | 2003-06-16 | 2007-06-06 | シャープ株式会社 | 導電性ボールおよびそれを用いた電子部品の外部電極形成方法 |
KR100732017B1 (ko) | 2003-06-25 | 2007-06-25 | 히다치 가세고교 가부시끼가이샤 | 회로접속재료, 이것을 이용한 필름상 회로접속재료,회로부재의 접속구조 및 그 제조방법 |
JP2006108523A (ja) | 2004-10-08 | 2006-04-20 | Hitachi Chem Co Ltd | 異方性導電フィルムを用いた電気部品の接続方法 |
JP4830744B2 (ja) | 2006-09-15 | 2011-12-07 | パナソニック株式会社 | 電子部品実装用接着剤及び電子部品実装構造体 |
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JP5272368B2 (ja) * | 2007-03-05 | 2013-08-28 | 日立化成株式会社 | 被覆導電性粒子、被覆導電性粒子の製造方法、異方性導電接着剤及び導電性接着剤 |
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