JP4729963B2 - 電子部品接続用突起電極とそれを用いた電子部品実装体およびそれらの製造方法 - Google Patents
電子部品接続用突起電極とそれを用いた電子部品実装体およびそれらの製造方法 Download PDFInfo
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- JP4729963B2 JP4729963B2 JP2005117891A JP2005117891A JP4729963B2 JP 4729963 B2 JP4729963 B2 JP 4729963B2 JP 2005117891 A JP2005117891 A JP 2005117891A JP 2005117891 A JP2005117891 A JP 2005117891A JP 4729963 B2 JP4729963 B2 JP 4729963B2
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- H01L24/10—Bump connectors ; Manufacturing methods related thereto
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- H01L24/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
- H01L2224/11003—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for holding or transferring the bump preform
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- H01L2224/111—Manufacture and pre-treatment of the bump connector preform
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
- H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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- H01L2924/351—Thermal stress
Description
図1(a)は、本発明の実施の形態1に係る突起電極を有する電子部品の平面図であり、図1(b)は、図1(a)のA−A線断面図である。
図3(a)は、本発明の実施の形態2に係る突起電極を有する基板の平面図であり、図3(b)は、図3(a)のA−A線断面図である。
図4は、本発明の実施の形態3に係る電子部品実装体の断面図である。
実施例1においては、第1の導電体に、銀粒子の導電フィラーを主体とするエポキシ樹脂系の導電性樹脂を用い、第2の導電体に、Sn42Bi58のはんだを用いたものである。
実施例2においては、第1の導電体に、銀粒子の導電フィラーを主体とするエポキシ樹脂系の導電性樹脂を用い、第2の導電体に、Sn−20In−2.8Agのはんだを用いたものである。
実施例3においては、第1の導電体に、銀粒子の導電フィラーを主体とする耐熱性エポキシ樹脂系の導電性樹脂を用い、第2の導電体に、2段硬化型の銀粒子の導電フィラーを主体とするポリイミド系の導電性樹脂を用いたものである。ここで、第2の導電体は、180℃近傍に、いわゆるBステージと呼ばれる半硬化状態になる第1の硬化温度と、290℃近傍に、いわゆるCステージと呼ばれる完全に硬化する第2の硬化温度の2段階の硬化温度を有するものである。
110 端子電極
120 突起電極
130 第1の導電体
140 第2の導電体
150 転写型
160 凹部
170 スキージ
180 凹部表面
190 空間
200 基板
210 配線パターン
220 配線電極
230 鼓形状
Claims (2)
- 所定の突起電極の形状の凹部を備える熱硬化性シリコーン樹脂からなる転写型の前記凹部に、第2の導電体を少なくとも前記転写型の前記凹部表面までには到達しないように充填する工程と、
第1の導電体を前記第2の導電体の上で前記転写型の前記凹部表面まで充填する工程と、電子部品の端子電極または基板の配線電極に対向して前記転写型の前記凹部を位置合わせして載置し、加熱する工程と、
前記転写型を剥離する工程とを含むことを特徴とする電子部品接続用突起電極の製造方法。 - 所定の突起電極の形状の凹部を備える熱硬化性シリコーン樹脂からなる転写型の前記凹部に、第2の導電体を少なくとも前記転写型の前記凹部表面までには到達しないように充填する工程と、
第1の導電体を前記第2の導電体の上で前記転写型の前記凹部表面まで充填する工程と、電子部品の端子電極または基板の配線電極に対向して前記転写型の前記凹部を位置合わせして載置し、加熱する工程と、
前記転写型を剥離し、前記電子部品の前記端子電極または前記基板の前記配線電極上に前記突起電極を形成する工程と、
前記基板の前記配線電極または前記電子部品の前記端子電極と前記電子部品の前記端子電極または前記基板の前記配線電極上に形成された前記突起電極とを接続する工程とを含むことを特徴とする電子部品実装体の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005117891A JP4729963B2 (ja) | 2005-04-15 | 2005-04-15 | 電子部品接続用突起電極とそれを用いた電子部品実装体およびそれらの製造方法 |
US11/883,801 US8033016B2 (en) | 2005-04-15 | 2006-04-14 | Method for manufacturing an electrode and electrode component mounted body |
CN2006800117409A CN101156238B (zh) | 2005-04-15 | 2006-04-14 | 电子零件连接用突起电极与电子零件安装体的制造方法 |
PCT/JP2006/307916 WO2006112384A1 (ja) | 2005-04-15 | 2006-04-14 | 電子部品接続用突起電極とそれを用いた電子部品実装体およびそれらの製造方法 |
Applications Claiming Priority (1)
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JP2005117891A JP4729963B2 (ja) | 2005-04-15 | 2005-04-15 | 電子部品接続用突起電極とそれを用いた電子部品実装体およびそれらの製造方法 |
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JP2006302929A JP2006302929A (ja) | 2006-11-02 |
JP4729963B2 true JP4729963B2 (ja) | 2011-07-20 |
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JP2005117891A Expired - Fee Related JP4729963B2 (ja) | 2005-04-15 | 2005-04-15 | 電子部品接続用突起電極とそれを用いた電子部品実装体およびそれらの製造方法 |
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JP (1) | JP4729963B2 (ja) |
CN (1) | CN101156238B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015052780A1 (ja) * | 2013-10-08 | 2015-04-16 | リンテック株式会社 | 電子部品実装体の製造方法 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4848941B2 (ja) * | 2006-11-28 | 2011-12-28 | パナソニック株式会社 | 電子部品実装構造体とその製造方法 |
KR101079946B1 (ko) | 2006-11-28 | 2011-11-04 | 파나소닉 주식회사 | 전자 부품 실장 구조체와 그 제조 방법 |
JP2008227359A (ja) * | 2007-03-15 | 2008-09-25 | Fujitsu Ltd | 半導体装置および半導体装置の製造方法 |
CN101965632B (zh) * | 2008-10-27 | 2012-09-26 | 松下电器产业株式会社 | 半导体的安装结构体及其制造方法 |
JP5549190B2 (ja) * | 2009-02-27 | 2014-07-16 | 豊田合成株式会社 | 半導体発光素子の実装体の製造方法、発光装置の製造方法及び半導体発光素子 |
JP5353608B2 (ja) * | 2009-09-29 | 2013-11-27 | 凸版印刷株式会社 | 燃料電池用セパレータの製造方法 |
JP5838692B2 (ja) * | 2011-09-27 | 2016-01-06 | 凸版印刷株式会社 | Cmos半導体装置の製造方法 |
US20180018051A1 (en) * | 2015-02-27 | 2018-01-18 | Fujikura Ltd. | Wiring body, wiring board, and touch sensor |
TWI666659B (zh) * | 2015-10-19 | 2019-07-21 | 日商藤倉股份有限公司 | 配線體、配線基板、接觸感應器及配線體的製造方法 |
CN107689278A (zh) * | 2017-08-25 | 2018-02-13 | 华南理工大学 | 一种La‑Fe‑Si基磁制冷复合材料及其制备方法 |
JP7148780B2 (ja) * | 2017-09-29 | 2022-10-06 | 日亜化学工業株式会社 | 半導体装置の製造方法 |
JP7314515B2 (ja) * | 2019-01-28 | 2023-07-26 | 株式会社レゾナック | 電子部品装置を製造する方法 |
JP2020123635A (ja) * | 2019-01-29 | 2020-08-13 | Dic株式会社 | 半導体装置 |
CN110312414B (zh) * | 2019-07-28 | 2021-01-29 | 南京视莱尔汽车电子有限公司 | 一种电子产品装配夹具 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS62117346A (ja) * | 1985-11-18 | 1987-05-28 | Fujitsu Ltd | 半導体装置 |
JPH01145826A (ja) * | 1987-12-01 | 1989-06-07 | Matsushita Electric Ind Co Ltd | 電気的接続接点 |
JP2811741B2 (ja) * | 1989-04-25 | 1998-10-15 | 日本電気株式会社 | 半導体装置の製造方法 |
JPH10163368A (ja) * | 1996-12-02 | 1998-06-19 | Fujitsu Ltd | 半導体装置の製造方法及び半導体装置 |
JPH11214450A (ja) * | 1997-11-18 | 1999-08-06 | Matsushita Electric Ind Co Ltd | 電子部品実装体とそれを用いた電子機器と電子部品実装体の製造方法 |
JP2002093842A (ja) * | 2000-09-12 | 2002-03-29 | Hitachi Ltd | 半導体デバイスおよびその製造方法 |
JP2003258017A (ja) * | 2002-03-06 | 2003-09-12 | Nec Electronics Corp | バンプ電極形成方法 |
JP2004228375A (ja) * | 2003-01-23 | 2004-08-12 | Seiko Epson Corp | バンプの形成方法、デバイス、及び電子機器 |
-
2005
- 2005-04-15 JP JP2005117891A patent/JP4729963B2/ja not_active Expired - Fee Related
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2006
- 2006-04-14 CN CN2006800117409A patent/CN101156238B/zh not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015052780A1 (ja) * | 2013-10-08 | 2015-04-16 | リンテック株式会社 | 電子部品実装体の製造方法 |
JPWO2015052780A1 (ja) * | 2013-10-08 | 2017-03-09 | リンテック株式会社 | 電子部品実装体の製造方法 |
Also Published As
Publication number | Publication date |
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CN101156238B (zh) | 2011-11-30 |
JP2006302929A (ja) | 2006-11-02 |
CN101156238A (zh) | 2008-04-02 |
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