JP4848941B2 - 電子部品実装構造体とその製造方法 - Google Patents
電子部品実装構造体とその製造方法 Download PDFInfo
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- JP4848941B2 JP4848941B2 JP2006319838A JP2006319838A JP4848941B2 JP 4848941 B2 JP4848941 B2 JP 4848941B2 JP 2006319838 A JP2006319838 A JP 2006319838A JP 2006319838 A JP2006319838 A JP 2006319838A JP 4848941 B2 JP4848941 B2 JP 4848941B2
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- electronic component
- photosensitive resin
- electrode
- resin
- protruding electrode
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- H01L2924/19043—Component type being a resistor
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30105—Capacitance
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Description
図1は、本発明の第1の実施の形態における電子部品実装構造体の構成を示す断面概念図である。
図3は、本発明の第2の実施の形態における電子部品実装構造体の構成を示す断面概念図である。なお、図1と同じ構成要素には、同じ符号を付与し説明する。
図7は、本発明の第3の実施の形態における電子部品実装構造体の製造方法を示す断面概念図である。第2の実施の形態と同じ構成要素には、同じ符号を付与し説明する。
図8は、本発明の第4の実施の形態における電子部品実装構造体の構成とその製造方法を示す断面概念図である。なお、図1と同じ構成要素には、同じ符号を付与し説明する。
図9は、本発明の第5の実施の形態における電子部品実装構造体の製造方法を示す断面概念図である。なお、図7と同じ構成要素には、同じ符号を付与し説明する。
図10は、本発明の第6の実施の形態における電子部品実装構造体の製造方法を示す断面概念図である。図7と同じ構成要素には、同じ符号を付与し説明する。
10 電子部品
10a,101a,102,103 電極端子
10b 絶縁保護膜
12,112 実装基板
12a,112a 接続端子
12b 絶縁性樹脂層
13,43,63,83,93,113 突起電極
13a 導電性フィラー
13b,43b,63b,83b,113b 感光性樹脂
30 突起電極前駆体
30a,931a,1031a 重合度の高い感光性樹脂部
30b,931b,1031b 重合度の低い感光性樹脂部
31,51,61,71 容器
31a,51a,61a 底面
33 感光性樹脂液
33c 未露光部
34,54,64,74 フォトマスク
34a,94a,104a 開口部
34b,640b 液晶層
34c,640c 透明基板
54a,64a,74a 第1開口部
54b,64b,74b 第2開口部
104 ダミーバンプ
131a,831a,1131a 樹脂成分架橋密度の高い部分
131b,831b,1131b 樹脂成分架橋密度の低い部分
331a,336a 重合度の高い第1層
332b,337b 重合度の低い第2層
431a,631a 第1層
432b,632b 第2層
830 突起電極部
Claims (15)
- 複数の電極端子を設けた電子部品と、
前記電極端子と対向する位置に接続端子を設けた実装基板と、
前記電極端子上に設けた突起電極を介して前記電極端子と前記接続端子とを接続する電子部品実装構造体であって、
前記突起電極は、少なくとも導電性フィラーと感光性樹脂とを含み、前記感光性樹脂の樹脂成分架橋密度が、前記電極端子側から前記接続端子側へ、前記突起電極の高さ方向で連続的に減少していることを特徴とする電子部品実装構造体。 - 前記樹脂成分架橋密度の減少として、架橋重合度が70%から30%へ変化することを特徴とする請求項1記載の電子部品実装構造体。
- 前記樹脂成分架橋密度の低い部分では前記導電性フィラーが融着し、前記樹脂成分架橋密度の高い部分では前記導電性フィラーを接触させて、前記電極端子と前記接続端子とを接続していることを特徴とする請求項1または2に記載の電子部品実装構造体。
- 電子部品の電極端子上または実装基板の接続端子上に突起電極を形成する突起電極形成工程と、前記電極端子と前記接続端子とを前記突起電極を介して接続する接続工程とを含む電子部品実装構造体の製造方法であって、
前記突起電極形成工程は、
導電性フィラーを含む感光性樹脂を前記電子部品または前記実装基板の表面に供給する工程と、
前記電極端子または前記接続端子に対応する位置の前記感光性樹脂を露光し、前記感光性樹脂の重合度を前記突起電極の高さ方向に異なって形成する工程と、
前記感光性樹脂の未露光部を除去する工程と、
前記感光性樹脂の少なくとも前記重合度の低い部分をポーラス化する工程と、を含み、
前記接続工程は、
前記突起電極を形成した前記電子部品または前記実装基板を、前記突起電極を介して前記電極端子と前記接続端子とを位置合わせする工程と、
前記電子部品および前記実装基板の少なくとも一方を圧接加熱して、前記電極端子と前記接続端子とを接続する工程と、
を含むことを特徴とする電子部品実装構造体の製造方法。 - 前記突起電極形成工程は、前記感光性樹脂の前記重合度を前記突起電極の高さ方向に連続的に異なって形成する工程を含むことを特徴とする請求項4に記載の電子部品実装構造体の製造方法。
- 前記突起電極形成工程は、前記感光性樹脂の前記重合度の異なる複数の層を形成する工程を含むことを特徴とする請求項4に記載の電子部品実装構造体の製造方法。
- 前記接続工程は、前記突起電極の前記ポーラス化した樹脂成分架橋密度の低い部分の前記導電性フィラー同士を融着するとともに、前記樹脂成分架橋密度の高い部分の前記導電性フィラー同士を接触させる工程を含むことを特徴とする請求項4から請求項6のいずれか1項に記載の電子部品実装構造体の製造方法。
- 前記突起電極形成工程は、
少なくとも底面が光を透過する容器に前記導電性フィラーを含む前記感光性樹脂を供給し、前記電極端子が形成された前記電子部品を、前記電極端子が前記底面と対向し、所定の間隔を設けて前記感光性樹脂中に浸漬する工程と、
前記容器の底面からフォトマスクの第1開口部を介して露光し、前記感光性樹脂の重合度が大きい第1層を前記電極端子上に形成する工程と、
前記電子部品を前記底面から所定距離だけ引き上げる工程と、
前記フォトマスクの第2開口部を介して露光し、前記第1層上に前記感光性樹脂の重合度が小さい第2層を形成する工程と、を含むことを特徴とする請求項4に記載の電子部品実装構造体の製造方法。 - 前記突起電極形成工程が、
容器に前記導電性フィラーを含む前記感光性樹脂を供給し、前記電極端子が形成された前記電子部品を、前記電極端子が前記感光性樹脂の表面と対向し、所定の間隔を設けて前記感光性樹脂中に浸漬する工程と、
前記感光性樹脂の表面からフォトマスクの第1開口部を介して露光し、前記感光性樹脂の重合度が大きい第1層を前記電極端子上に形成する工程と、
前記電子部品を所定の距離だけ前記感光性樹脂中に沈降させる工程と、
前記フォトマスクの第2開口部を介して露光し、前記第1層上に前記感光性樹脂の重合度が小さい第2層を形成する工程と、を含むことを特徴とする請求項4に記載の電子部品実装構造体の製造方法。 - 前記突起電極形成工程が、前記電極端子が形成された前記電子部品上に、前記突起電極の高さと同じ厚みに前記導電性フィラーを含む前記感光性樹脂を供給する工程と、
前記感光性樹脂に、フォトマスクの開口部を介して所定の焦点深度に集光する光を照射し、前記電極端子上に前記感光性樹脂の重合度が高さ方向に異なる前記突起電極を形成する工程と、を含むことを特徴とする請求項4に記載の電子部品実装構造体の製造方法。 - 透明基材表面上に形成された透明導電性薄膜からなる接続端子を含む実装基板と、前記接続端子と対応する位置に電極端子を設けた電子部品とを所定の間隔で配置し、前記電子部品と前記実装基板との間に導電性フィラーを含む感光性樹脂を供給する工程と、
前記実装基板の前記電子部品に対向する面とは反対側の面からフォトマスクの開口部を介して光強度を連続的に変化させながら光を照射して、前記接続端子と前記電極端子間の前記感光性樹脂の重合度が高さ方向に異なる突起電極を形成する工程と、
前記感光性樹脂の未露光部を除去する工程と、
前記感光性樹脂の少なくとも前記重合度の低い部分をポーラス化する工程と、
前記電子部品および前記実装基板の少なくとも一方を圧接加熱して、前記電極端子と前記接続端子とを接続する接続工程と、
を含むことを特徴とする電子部品実装構造体の製造方法。 - 前記接続工程の後に、前記電子部品と前記実装基板との間に絶縁性樹脂を充填し硬化させる工程を、さらに含むことを特徴とする請求項4から請求項11のいずれか1項に記載の電子部品実装構造体の製造方法。
- 前記位置合わせ工程の前に、さらに前記電極端子が形成された前記電子部品の面上または前記接続端子が形成された前記実装基板の面上に絶縁性樹脂または異方導電性樹脂を形成する工程と、
前記接続工程の後に、さらに前記絶縁性樹脂または前記異方導電性樹脂を硬化させ、前記電子部品と前記実装基板とを接着固定する工程と、を含むことを特徴とする請求項4から請求項10のいずれか1項に記載の電子部品実装構造体の製造方法。 - 前記フォトマスクとして液晶セルが2次元的に配置された透過式の液晶パネルを用い、前記開口部の大きさおよび前記開口部の位置を前記液晶パネルに印加する駆動信号電圧により電気的に制御することを特徴とする請求項8から請求項11のいずれか1項に記載の電子部品実装構造体の製造方法。
- 前記フォトマスクとして液晶パネルを用い、前記液晶パネルを透過した光像を縮小投影して前記感光性樹脂に照射することを特徴とする請求項10に記載の電子部品実装構造体の製造方法。
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