WO2008065926A1 - Structure de montage de composant électronique et procédé de fabrication correspondant - Google Patents

Structure de montage de composant électronique et procédé de fabrication correspondant Download PDF

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Publication number
WO2008065926A1
WO2008065926A1 PCT/JP2007/072422 JP2007072422W WO2008065926A1 WO 2008065926 A1 WO2008065926 A1 WO 2008065926A1 JP 2007072422 W JP2007072422 W JP 2007072422W WO 2008065926 A1 WO2008065926 A1 WO 2008065926A1
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WO
WIPO (PCT)
Prior art keywords
electronic component
photosensitive resin
electrode
mounting structure
resin
Prior art date
Application number
PCT/JP2007/072422
Other languages
English (en)
Japanese (ja)
Inventor
Daisuke Sakurai
Yoshihiko Yagi
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006319838A external-priority patent/JP4848941B2/ja
Priority claimed from JP2006323380A external-priority patent/JP4702271B2/ja
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Priority to US12/515,425 priority Critical patent/US8120188B2/en
Priority to CN2007800440353A priority patent/CN101542705B/zh
Publication of WO2008065926A1 publication Critical patent/WO2008065926A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
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    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

La présente invention concerne une structure de montage de composant électronique (1) qui connecte un composant électronique (10) ayant une pluralité de terminaux d'électrode (10a) et un substrat de montage (12) ayant un terminal de connexion (12a) dans une position faisant face aux terminaux d'électrode (10a). La structure connecte les terminaux d'électrode (10a) et le terminal de connexion (12a) par le biais d'une électrode saillante (13) placée sur les terminaux d'électrode (10a) ou sur le terminal de connexion (12a). L'électrode saillante (13) comprend au moins un matériau de remplissage conducteur (13a) et une résine photosensible (13b) et les densités réticulées de la composition en résine de la résine photosensible (13b) varient dans le sens de la hauteur de l'électrode saillante (13).
PCT/JP2007/072422 2006-11-28 2007-11-20 Structure de montage de composant électronique et procédé de fabrication correspondant WO2008065926A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/515,425 US8120188B2 (en) 2006-11-28 2007-11-20 Electronic component mounting structure and method for manufacturing the same
CN2007800440353A CN101542705B (zh) 2006-11-28 2007-11-20 电子部件安装结构体及其制造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2006-319838 2006-11-28
JP2006319838A JP4848941B2 (ja) 2006-11-28 2006-11-28 電子部品実装構造体とその製造方法
JP2006323380A JP4702271B2 (ja) 2006-11-30 2006-11-30 導電性バンプの形成方法
JP2006-323380 2006-11-30

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WO2008065926A1 true WO2008065926A1 (fr) 2008-06-05

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PCT/JP2007/072422 WO2008065926A1 (fr) 2006-11-28 2007-11-20 Structure de montage de composant électronique et procédé de fabrication correspondant

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US (1) US8120188B2 (fr)
KR (1) KR101079946B1 (fr)
CN (1) CN101542705B (fr)
TW (1) TWI413196B (fr)
WO (1) WO2008065926A1 (fr)

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JP2011249546A (ja) * 2010-05-26 2011-12-08 Panasonic Electric Works Co Ltd 電子装置およびその製造方法
JP2016529693A (ja) * 2013-06-24 2016-09-23 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 平坦化によってはんだパッド形態差を低減する方法
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JP6523179B2 (ja) 2013-12-02 2019-05-29 東芝ホクト電子株式会社 発光ユニット、発光装置及び発光ユニットの製造方法
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Publication number Priority date Publication date Assignee Title
JP2010067703A (ja) * 2008-09-09 2010-03-25 Dainippon Printing Co Ltd 導電性バンプ付き基板シート製造方法
JP2011249546A (ja) * 2010-05-26 2011-12-08 Panasonic Electric Works Co Ltd 電子装置およびその製造方法
JP2016529693A (ja) * 2013-06-24 2016-09-23 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 平坦化によってはんだパッド形態差を低減する方法
JP2019153761A (ja) * 2018-03-06 2019-09-12 シャープ株式会社 接合装置
US11145618B2 (en) 2018-03-06 2021-10-12 Sharp Kabushiki Kaisha Bonding equipment
JP7129793B2 (ja) 2018-03-06 2022-09-02 シャープ株式会社 接合装置

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KR101079946B1 (ko) 2011-11-04
KR20090069337A (ko) 2009-06-30
US8120188B2 (en) 2012-02-21
TW200834770A (en) 2008-08-16
TWI413196B (zh) 2013-10-21

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