JP4736762B2 - Bga型半導体装置及びその製造方法 - Google Patents
Bga型半導体装置及びその製造方法 Download PDFInfo
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- JP4736762B2 JP4736762B2 JP2005351285A JP2005351285A JP4736762B2 JP 4736762 B2 JP4736762 B2 JP 4736762B2 JP 2005351285 A JP2005351285 A JP 2005351285A JP 2005351285 A JP2005351285 A JP 2005351285A JP 4736762 B2 JP4736762 B2 JP 4736762B2
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- Prior art keywords
- wiring board
- bga type
- electrode
- printed wiring
- elastic body
- Prior art date
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0133—Ternary Alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Description
2;弾性体
3;金属薄膜
4;フォトレジスト
5;フォトマスク
6;光
7;Cuめっき電極
10;BGAタイプの電子部品
11;プリント配線基板
12;はんだ
13;はんだボール
14;予備はんだ
15;電極
101;チップ
102;絶縁層
102A;非感光性ポリイミド
102B;感光性ポリイミド
103;金属配線
104;はんだボール
105;パッド
106;絶縁層の側面
107;非感光性ポリイミド膜
151;BGAパッケージ
152;電極
153;多層プリント配線基板
154;インターポーザ
154a;回路配線
155;封止樹脂
156、159;Agペースト
157;バンプ
157a;樹脂ボール
157b;スズメッキ
158;配線層
Claims (6)
- 表面に複数個の電極が1又は複数の列に沿って配置されたプリント配線基板と、このプリント配線基板に対向して配置され対向面上の前記電極に対応する位置にはんだボールが形成されたBGA型電子部品と、前記プリント配線基板の前記電極の列と前記BGA型電子部品との間に設けられ前記電極の列の方向に延びる角柱状をなす弾性体の周囲に前記電極の配置間隔で離隔するように複数の導電層が形成された接続部品と、を有し、前記プリント配線基板の各電極と前記BGA型電子部品のはんだボールとが前記接続部品の前記導電層により接続されており、前記接続部品の前記弾性体が変形することによって外部からの応力及び熱応力が吸収・緩和されることを特徴とするBGA型半導体装置。
- 前記導電層が、Cuめっき層であることを特徴とする請求項1に記載のBGA型半導体装置。
- 前記弾性体が、シリコーンゴム又はエポキシ樹脂であることを特徴とする請求項1又は2に記載のBGA型半導体装置。
- 前記接続部品は、前記プリント基板の各電極列に対応して個別に構成されていることを特徴とする請求項1乃至3のいずれか1項に記載のBGA型半導体装置。
- 表面に複数個の電極が1又は複数の列に沿って配置されたプリント配線基板と、このプリント配線基板に対向して配置され対向面上の前記電極に対応する位置にはんだボールが形成されたBGA型電子部品と、前記プリント配線基板の前記電極の列と前記BGA型電子部品との間に設けられ前記電極の列の方向に延びる角柱状をなす弾性体の周囲に前記電極の配置間隔で離隔するように複数の導電層が形成された接続部品と、を使用し、前記プリント配線基板の各電極と前記BGA型電子部品のはんだボールとを前記接続部品の前記導電層により接続する工程を有し、前記接続部品の前記弾性体が変形することによって外部からの応力及び熱応力が吸収・緩和されることを特徴とするBGA型半導体装置の製造方法。
- 前記接続部品を製造する工程が、弾性体を角柱状に成形する工程と、前記弾性体表面に下地電極となる金属薄膜を形成する工程と、前記金属薄膜上にフォトレジストを塗布する工程と、前記電極幅の隙間を持つスリット状のフォトマスクを利用し前記フォトレジストを露光処理する工程と、露光されたフォトレジスト部分を現像除去し前記金属薄膜の一部を露出させる工程と、露出した前記金属薄膜にめっき処理を施しめっき層を形成する工程と、前記フォトレジストをすべて除去し前記金属薄膜を露出させる工程と、前記金属薄膜をエッチング除去する工程と、からなることを特徴とする請求項5に記載のBGA型半導体装置の製造方法。
Priority Applications (2)
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JP2005351285A JP4736762B2 (ja) | 2005-12-05 | 2005-12-05 | Bga型半導体装置及びその製造方法 |
US11/566,885 US7671477B2 (en) | 2005-05-12 | 2006-12-05 | Technique for moderating stresses cause by a difference in thermal expansion coeffiecients between a substrate and an electronic component |
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JP2005351285A JP4736762B2 (ja) | 2005-12-05 | 2005-12-05 | Bga型半導体装置及びその製造方法 |
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JP4736762B2 true JP4736762B2 (ja) | 2011-07-27 |
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JP (1) | JP4736762B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10950586B2 (en) | 2016-02-01 | 2021-03-16 | Samsung Electronics Co., Ltd. | Semiconductor devices having upper and lower solder portions and methods of fabricating the same |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US7868446B2 (en) * | 2007-09-06 | 2011-01-11 | Infineon Technologies Ag | Semiconductor device and methods of manufacturing semiconductor devices |
US20120161312A1 (en) * | 2010-12-23 | 2012-06-28 | Hossain Md Altaf | Non-solder metal bumps to reduce package height |
JP2018064063A (ja) | 2016-10-14 | 2018-04-19 | イリソ電子工業株式会社 | 回路基板及び回路装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11509033A (ja) * | 1995-07-07 | 1999-08-03 | ミネソタ・マイニング・アンド・マニュファクチャリング・カンパニー | 導電性突出部の平面配列を有する分離可能な電気コネクタアセンブリ |
JP2001203237A (ja) * | 2000-01-21 | 2001-07-27 | Jsr Corp | 半導体装置 |
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Publication number | Priority date | Publication date | Assignee | Title |
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JPH10173006A (ja) | 1996-12-09 | 1998-06-26 | Hitachi Ltd | 半導体装置および半導体装置の製造方法 |
JPH11284029A (ja) | 1998-03-27 | 1999-10-15 | Denso Corp | 電子部品の実装構造 |
JP2978902B1 (ja) | 1998-08-13 | 1999-11-15 | 九州日本電気株式会社 | Bga型半導体装置とその製造方法 |
JP3147113B2 (ja) | 1999-03-29 | 2001-03-19 | 日本電気株式会社 | マザーボードプリント配線板およびその製造方法 |
US6507118B1 (en) * | 2000-07-14 | 2003-01-14 | 3M Innovative Properties Company | Multi-metal layer circuit |
US6894399B2 (en) * | 2001-04-30 | 2005-05-17 | Intel Corporation | Microelectronic device having signal distribution functionality on an interfacial layer thereof |
-
2005
- 2005-12-05 JP JP2005351285A patent/JP4736762B2/ja not_active Expired - Fee Related
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Publication number | Priority date | Publication date | Assignee | Title |
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JPH11509033A (ja) * | 1995-07-07 | 1999-08-03 | ミネソタ・マイニング・アンド・マニュファクチャリング・カンパニー | 導電性突出部の平面配列を有する分離可能な電気コネクタアセンブリ |
JP2001203237A (ja) * | 2000-01-21 | 2001-07-27 | Jsr Corp | 半導体装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10950586B2 (en) | 2016-02-01 | 2021-03-16 | Samsung Electronics Co., Ltd. | Semiconductor devices having upper and lower solder portions and methods of fabricating the same |
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JP2007158024A (ja) | 2007-06-21 |
US7671477B2 (en) | 2010-03-02 |
US20070090528A1 (en) | 2007-04-26 |
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