JPWO2008120564A1 - 電子部品の実装構造、及び電子部品の実装方法 - Google Patents
電子部品の実装構造、及び電子部品の実装方法 Download PDFInfo
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- JPWO2008120564A1 JPWO2008120564A1 JP2009507452A JP2009507452A JPWO2008120564A1 JP WO2008120564 A1 JPWO2008120564 A1 JP WO2008120564A1 JP 2009507452 A JP2009507452 A JP 2009507452A JP 2009507452 A JP2009507452 A JP 2009507452A JP WO2008120564 A1 JPWO2008120564 A1 JP WO2008120564A1
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Classifications
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- H—ELECTRICITY
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
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Abstract
Description
本発明の第1の実施形態について図面を参照して詳細に説明する。図2は、本実施形態の電子部品の実装構造を示す概略断面図である。この電子部品の実装構造は、基板1と、基板1上に配置された枠状の絶縁枠3と、絶縁枠3の枠内に配置された接続用樹脂層4と、接続用樹脂層4を介して基板1に実装された電子部品2とを備えている。
まず、絶縁枠用の樹脂として、厚さ0.1mmのフィルム状で枠状に加工された半硬化の絶縁樹脂を用意する。本実施形態では、絶縁枠用樹脂として、粒径が2ミクロンから10ミクロンのシリコンカーバイドフィラーを体積含有率50%で含んだエポキシ系樹脂を用いるものとする。フィルム状の絶縁樹脂を用いることにより、所要形状の絶縁枠を容易に得ることができる。
次に、接続用樹脂層形成用の樹脂(以下、接続用樹脂8とする)を、絶縁枠3の枠内に塗布する。そして、絶縁枠3の枠をマスクとして、スキージ9によりスキージ印刷する。このとき、印刷法を工夫したり、別途ディスペンス等の工程を追加するなどして、絶縁枠3の上面の少なくとも一部、特に電子部品2と接する位置にも、接続用樹脂8を配置するとよい。このようにすると、絶縁枠3上でも電子部品2を基板側に接着させる事ができ、接着強度をより高めることができる。
続いて、接続用樹脂8の中央部に、樹脂(以下、ポッティング剤とする)を、ニードル10によって供給する。このポッティング剤は、電子部品を載置する際に、エアーが巻き込まれてしまうことを防止する為のものである。ポッティング剤は、接続用樹脂8と同じ物を用いてもよいし、接続用樹脂8に対してフィラー含有量を変えたものや、接続用樹脂8の樹脂成分のみを用いてもよい。また、接続用樹脂8と親和性の高い他の樹脂などを用いてもよい。
次に、電子部品2をヘッド(図示せず)で支持し、電子部品2の電極端子5が基板1の電極端子6に対向するように位置合わせする。そして、電子部品2を基板1側へ、絶縁枠3の所定の部分(載置部)に突き当たるまで下降させる。これにより、電子部品の載置が完了する。
一方、図3Bに示される例では、絶縁枠3の一部に切り欠きが設けられており、エアーの抜け道が広げられている。従って、エアー巻き込みの観点からは特に好ましいと考えられる。但し、切り欠き部分にて絶縁枠3の枠幅が狭くなっており、絶縁枠3の加工難易度が高くなることもある。
また、図3Cに示される例では、電子部品2の外周縁全体が絶縁枠3の枠上に配置される。この場合、エアーの抜け道が生じ難いので、図3A〜Eの他の例と比較すると、エアーの巻き込みが発生し易くなる。但し、電子部品2が外周縁全体で絶縁枠3に支えられるので、電子部品2の位置ずれが最も起こりにくい。図3Dに示される例では、図3Aの例と同様にエアーの抜け道が設けられているが、対向する2角でのみ電子部品2が支持されている。従って、図3Aと比較すると位置ずれを起こし易い。
図3Eに示される例では、絶縁枠3の各辺の中央部に、電子部品2を載置するための張りだし部が設けられている。この例では、張りだし部以外の部分がエアーの抜け道となる。ただし、各辺の中央部で電子部品2が支持されることになり、図3Aと比較すると位置ずれが起こりやすい。
絶縁枠3の形状としては、エアー巻き込み抑制、位置ずれ防止、及び加工難易度の観点から、図3Aの形状が最もバランスが取れており、上述した例の中では特に好ましいと考えられる。
次に、加熱処理を行う。この加熱処理により、電極端子5、6間において、接続用樹脂8中のはんだ粒子が溶融し、凝集し、一体化し、はんだバンプ7が形成される。はんだバンプ7により、電極端子5と電極端子6との間が電気的に接続される。また、接続用樹脂8中の樹脂成分が硬化し、電子部品2と基板1との隙間を埋める接続用樹脂層4が形成される。これにより、図2に示されるような電子部品の実装構造が得られる。
はんだバンプ7を形成するための加熱は、電子部品2を支持する搭載機のヘッドを経由して行われる。このとき、ヘッドを150℃まで昇温させ、その状態で20秒保持した後、搭載機を電子部品2から取り外す。
次に、接続用樹脂8を硬化させるための加熱を行う。120℃に設定したベーク炉に30分程度、電子部品2を搭載した基板1を投入する。このような加熱プロファイルは、はんだ粒子(錫/ビスマス共晶合金)の融点が139℃であること、および接続用樹脂8の樹脂成分の熱硬化特性を考慮して設定される。接続用樹脂8の樹脂成分や、はんだ粒子の材質などが変更された場合には、変更された材料の特性を考慮して、加熱プロファイルを適宜設定する事が好ましい。
絶縁枠3によって熱応力や機械的応力の影響が抑制されるので、接続用樹脂層8の材料を、粘度の制約を受けることなく選定することができる。従って、接続用樹脂層8の樹脂成分として、はんだ粒子を凝集させ一体化させるのに適した材料を選定することができる。すなわち、比較的大きな応力が発生する外周部の信頼性と、はんだ粒子の凝集に適した樹脂の使用とを両立させることが可能となり、信頼性に優れた電子部品の実装構造を得る事ができる。
以下に、第2の実施形態について説明する。図6は、本実施形態の電子部品の実装構造を説明する概略断面図である。本実施形態では、第1の実施形態に対して、フィレット11が追加されている。フィレット11以外の点については、第1の実施形態と同様とする事ができるので、説明を省略する。
続いて、第3の実施形態について説明する。図8は、本実施形態の電子部品の実装構造を示す概略断面図である。図8に示されるように、本実施形態では、既述の実施形態に対して混在層12が追加されている。また、混在層12を得るための製造方法が工夫されている。これら以外の点については、第1の実施形態と同様とすることができるので、詳細な説明は省略する。
まず、基板1上に、厚さ0.1mmのフィルム状で所要の形状に加工した半硬化の絶縁枠用樹脂を搭載し、固定する。具体的には、まず、搭載装置のステージ上に基板1を固定する。そして、絶縁枠形成予定位置の少なくとも一部に、粘着力を有する樹脂や接着剤を塗布する。その後、絶縁枠用樹脂を、基板1上の絶縁枠形成領域に載置して、粘着樹脂等により仮固定する。
次に、接続用樹脂8を絶縁枠3の枠内にディスペンスにより供給する。接続用樹脂8の供給量は、絶縁枠3の枠内の容積を考慮して設定される。
次に、電子部品2を、供給された接続用樹脂8が押し広げられるようにしつつ、絶縁枠3に接触する高さまで下降させる。これにより、電子部品2と基板1の間隙がすべて接続用樹脂8で充填された状態となる。ここで、接続用樹脂8をディスペンスする際(S12)の塗布形状を工夫したり、絶縁枠3の枠形状を工夫したりすることで、電子部品2の載置プロセスをより安定化させて行う事ができる。
次に、加熱処理を行う。これにより、接続用樹脂8が低粘度化して、はんだ粒子が凝集し、一体化し、電極端子5と電極端子6との間を電気的に接続するはんだバンプ7が形成される。また、絶縁枠用樹脂も、加熱とともに粘度が一旦低下した後、硬化が進む。ここで、絶縁枠用樹脂と接続用樹脂との双方が低粘度化した状態において、両者が混ざり合い、混在層12が形成される。これにより、図10Dで示したような構造の電子部品の実装構造が得られる。
本発明の第4の実施形態に係る電子部品の実装構造の概略断面図を、図11に示す。本形態は、第2の実施形態と第3の実施形態とを組み合わせた形態である。すなわち、この電子部品の実装構造では、電子部品2の縁部にフィレット11が設けられている。また、絶縁枠3と接続用樹脂層4との間に混在層12が形成されている。
Claims (16)
- 電極端子を有する支持体上に配置された絶縁枠と、
前記絶縁枠の枠内に配置された、接続用樹脂層と、
前記接続用樹脂層を介して前記支持体上に配置された、電極端子を有する電子部品と
を具備し、
前記電子部品の少なくとも一部は、前記絶縁枠上に配置され、
前記接続用樹脂層は、前記電子部品の電極端子と前記支持体の電極端子とを電気的に接続する導電部を有している
電子部品の実装構造。 - 請求の範囲1に記載された電子部品の実装構造であって、
前記接続用樹脂層は、導電性粒子を含む絶縁性樹脂により形成され、
前記導電部は、前記導電性粒子が一体化した部分である
電子部品の実装構造。 - 請求の範囲1又は2に記載された電子部品の実装構造であって、
更に、
前記電子部品の縁部の少なくとも一部に沿って設けられた、絶縁性のフィレット
を具備する
電子部品の実装構造。 - 請求の範囲1乃至3のいずれかに記載された電子部品の実装構造であって、
前記絶縁枠と前記接続用樹脂層との間には混在層が設けられ、
前記混在層は、前記絶縁枠を構成する成分と前記接続用樹脂層を構成する成分とが混在してなる層である
電子部品の実装構造。 - 請求の範囲1乃至4のいずれかに記載された電子部品の実装構造であって、
前記支持体はプリント配線基板であり、
前記電子部品は、半導体チップである
電子部品の実装構造。 - 請求の範囲1乃至4のいずれかに記載された電子部品の実装構造であって、
前記支持体は、第1の半導体チップであり、
前記電子部品は、第2の半導体チップである
電子部品の実装構造。 - 請求の範囲1乃至6のいずれかに記載された電子部品の実装構造であって、
前記絶縁枠は、前記接続用樹脂層よりも高粘度である
電子部品の実装構造。 - 請求の範囲1乃至7のいずれかに記載された電子部品の実装構造であって、
前記絶縁枠は、フィラーと、絶縁性の樹脂とを含んでおり、
前記絶縁枠のフィラー含有率は、前記接続用樹脂層のフィラー含有率よりも大きい
電子部品の実装構造。 - 電極端子を有する支持体上に、絶縁枠を配置する工程と、
前記絶縁枠の枠内に、未硬化の接続用樹脂を供給する工程と、
電極端子を有する電子部品を、前記支持体の電極端子と前記電子部品の電極端子とが対向するように位置あわせし、前記絶縁枠の上に載置する工程と、
供給された前記接続用樹脂を加熱する加熱工程と、
を具備し、
前記接続用樹脂は、導電性粒子と絶縁性の樹脂とを含み、
前記加熱する工程は、前記接続用樹脂を硬化させて、前記電子部品を前記支持体に接着させるとともに、前記導電性粒子を凝集させて前記電子部品の電極端子と前記支持体の電極端子とを電気的に接続させる工程を含んでいる
電子部品の実装方法。 - 請求の範囲9に記載された電子部品の実装方法であって、
更に、
前記載置する工程の後に、前記電子部品の縁部の少なくとも一部に沿って、フィレット形成用の絶縁性樹脂を供給する工程と、
前記フィレット形成用の絶縁性樹脂を硬化させる工程と、
を具備する
電子部品の実装方法。 - 請求の範囲9に記載された電子部品の実装方法であって、
更に、
前記載置する工程よりも前に、前記絶縁枠内に、前記載置する工程で前記接続用樹脂が前記電子部品の縁部からはみ出すような量の樹脂を供給する工程を含む
電子部品の実装方法。 - 請求の範囲9乃至11のいずれかに記載された電子部品の実装方法であって、
前記接続用樹脂を供給する工程は、前記絶縁枠の配置された前記支持体上に前記接続用樹脂を塗布する工程と、前記絶縁枠をマスクとして塗布された前記接続用樹脂をスキージ印刷する工程と、を有する
電子部品の実装方法。 - 請求の範囲9乃至12のいずれかに記載された電子部品の実装方法であって、
前記接続用樹脂を供給する工程は、更に、前記載置する工程におけるエアー巻き込みを防止するための樹脂を前記接続用樹脂上に配置する工程を有する
電子部品の実装方法。 - 請求の範囲9乃至12のいずれかに記載された電子部品の実装方法であって、
更に、
前記載置する工程の前に実施され、前記載置工程におけるエアー巻き込みを防止するための樹脂を前記電子部品の載置面に配置する工程、
を具備する
電子部品の実装方法。 - 請求の範囲9乃至14のいずれかに記載された電子部品の実装方法であって、
前記絶縁枠を配置する工程は、フィルム状の絶縁枠を前記支持体上に配置する工程と、配置された前記絶縁枠を、加圧及び/又は加熱により前記支持体上に接合させる工程と、を有する
電子部品の実装方法。 - 請求の範囲9乃至14のいずれかに記載された電子部品の実装方法であって、
前記絶縁枠を配置する工程は、硬化前の前記絶縁枠を仮配置する工程を有し、
前記加熱する工程は、前記接続用樹脂に加え前記絶縁枠も加熱して硬化させる工程を有する
電子部品の実装方法。
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JP5381784B2 (ja) * | 2010-02-15 | 2014-01-08 | 住友ベークライト株式会社 | 導電接続シート、端子間の接続方法、接続端子の形成方法、半導体装置および電子機器 |
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EP3355666B1 (en) * | 2017-01-26 | 2023-07-26 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Semifinished product and method of manufacturing a component carrier |
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JPH10199936A (ja) * | 1997-01-14 | 1998-07-31 | Olympus Optical Co Ltd | フレキシブル配線板へのフリップチップ実装構造 |
JP2000260935A (ja) * | 1999-03-09 | 2000-09-22 | Rohm Co Ltd | 半導体集積装置 |
JP2000340614A (ja) * | 1999-05-28 | 2000-12-08 | Sony Chem Corp | 半導体素子の実装方法 |
JP2004006935A (ja) * | 2003-07-22 | 2004-01-08 | Oki Electric Ind Co Ltd | 封止部材の製造方法、およびその封止部材を用いた半導体装置の製造方法 |
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JPH0270436U (ja) * | 1988-11-18 | 1990-05-29 | ||
JPH10199936A (ja) * | 1997-01-14 | 1998-07-31 | Olympus Optical Co Ltd | フレキシブル配線板へのフリップチップ実装構造 |
JP2000260935A (ja) * | 1999-03-09 | 2000-09-22 | Rohm Co Ltd | 半導体集積装置 |
JP2000340614A (ja) * | 1999-05-28 | 2000-12-08 | Sony Chem Corp | 半導体素子の実装方法 |
JP2004006935A (ja) * | 2003-07-22 | 2004-01-08 | Oki Electric Ind Co Ltd | 封止部材の製造方法、およびその封止部材を用いた半導体装置の製造方法 |
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