CN1464953A - Led照明装置和卡型led照明光源 - Google Patents
Led照明装置和卡型led照明光源 Download PDFInfo
- Publication number
- CN1464953A CN1464953A CN02802577A CN02802577A CN1464953A CN 1464953 A CN1464953 A CN 1464953A CN 02802577 A CN02802577 A CN 02802577A CN 02802577 A CN02802577 A CN 02802577A CN 1464953 A CN1464953 A CN 1464953A
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- Prior art keywords
- led lighting
- substrate
- card type
- led
- lighting source
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Abstract
一种LED照明装置,包括:至少与在基板的一面上安装了LED的可装卸的卡型LED照明光源相连接的一个连接器和经过该连接器与卡型LED照明光源电连接的点亮电路。卡型LED照明光源最好具有金属基板和安装在金属基板的一面上的多个LED,金属基板中的未安装LED的基板背面与照明装置的一部分热接触。与连接器电连接的供电端子设在金属基板中安装了LED的基板一面上。
Description
技术领域
本发明涉及LED照明装置和卡型LED照明光源。更详细地说,涉及使用安装了多个LED的卡型LED照明光源的LED照明装置和适合于用在该LED照明装置中的卡型LED照明光源。
背景技术
作为照明器具和广告牌的光源,在现有技术中使用白炽灯、荧光灯、高压放电灯等。作为替代这些光源的新的照明光源,LED照明光源的研究得到进展。该LED照明光源存在比上述光源的寿命长的优点,作为下一代的照明光源的希望越来越大。但是,在一个LED器件中,由于光通量较小,为了得到与白炽灯、荧光灯相同程度的光通量,需要配置多个LED器件来构成LED照明光源。
下面,参照附图来说明现有的LED照明光源。
图1(a)和图1(b)表示现有的LED照明光源的构成,图2(a)和图2(b)表示表示该LED照明光源中的LED的剖面构成。
该LED照明光源,如图1(a)和图1(b)所示的那样,设有基板21,在该基板21上安装多个LED裸芯片22。在本说明书中,所谓「LED裸芯片」是指:在安装前的阶段中,LED尚未通过树脂等被模铸的状态。而且,把在安装前的阶段中LED被模铸而发光部等没有露出的状态的LED称为「LED器件」,由此进行区别。在图1(a)所示的基板21上设置开有透过从LED裸芯片22射出的光的孔23a的板23。另一方面,在图1(b)所示的基板21上形成透过从LED裸芯片22射出的光的层状的树脂24,LED裸芯片22由树脂24覆盖。
在这些LED照明光源中,如图2(a)和图2(b)所示的那样,处于裸芯片状态下的LED裸芯片22被安装在基板21上。LED裸芯片22具有蓝宝石和SiC、GaAs、GaP等器件基板31和形成在器件基板31上的发光部,发光部由层叠GaN类等的n型半导体层32、有源层33和p型半导体层34而构成。n型半导体层32的电极32a和p型半导体层34的电极34a分别通过金的导线41和42而与基板21上的布线图形21a电连接。而且,上述发光部的构成仅是一例,LED也可以设有量子阱、凸形(plug)反射层、共振器构造等。
在图1(a)和图2(a)所示的构成中,由LED裸芯片22发生的光被相当于设在板23上的孔(开口部)23b的内周面的反射面23a所反射,向器件外射出。板23的孔23b中填充树脂24,以便于模铸LED裸芯片22与导线41和42。而且,在图1(b)和图2(b)所示的构成中,由LED裸芯片22发生的光经过模铸树脂24而向器件外射出。
当在LED裸芯片22中的n型半导体层32的电极32a与p型半导体层34的电极34a之间施加正向的偏置电压时,电子和空穴被注入半导体层内,进行再结合。通过该再结合,在有源层33上发生光,从有源层33射出光。在LED照明光源中,利用从安装在基板上的多个LED裸芯片22所射出的光作为照明光。
LED裸芯片22伴随着发光而发生大量的热。希望发生的热经过器件基板31而从基板21散射。但是,随着这样的LED照明装置的实用化,仍然还存在以下这样的需要解决的问题:
如上述那样,由于来自各个LED裸芯片22的光通量较小,为了得到所希望的亮度,必须在基板21上排列相当数量的LED裸芯片22。因此,必须谋求安装的LED裸芯片22的高密度化,才能设置大量的LED裸芯片22而不会使基板的尺寸大型化。
而且,为了使各个LED裸芯片22的光通量尽可能增加,需要在各个LED裸芯片22中流过比除照明之外的通常用途中的电流(例如,20mA左右;当假定为0.3mm见方的LED裸芯片时,单位面积的电流密度为约222.2[mA/mm2])大的电流(过电流:例如40mA左右;与上述相同,单位面积的电流密度为约444.4[mA/mm2])。当在各个LED裸芯片22中流过大电流的情况下,来自LED裸芯片22的发热量变大,因此,LED裸芯片22的温度(裸芯片温度)上升到高温。裸芯片温度对LED裸芯片的寿命具有较大的影响。具体地说,当裸芯片温度上升10℃时,装入了LED裸芯片22的LED装置的寿命减半。
因此,一般考虑延长LED的寿命,在把LED用于照明用途时,其常识不是通用的。而且,当随着发热量的增加,裸芯片温度变高时,存在LED裸芯片22的发光效率降低的问题。
根据以上原因,为了使以高密度安装大量的LED裸芯片22的LED照明装置实用化,必须实现比现有技术高的散热性,来把裸芯片温度抑制得较低。而且,为了尽可能不浪费地使用从LED裸芯片22发出的光来作为照明光,需要提高光的利用效率。
为了解决这样的课题,在现有技术中提出了各种集成LED裸芯片的LED照明光源的方案,但是,能够充分地解决这些所有的课题的LED照明光源的出现仍未见到。
下面参照图1(a)和图1(b)以及图2(a)和图2(b)来说明现有的LED照明光源的问题。首先,通过LED的连续点亮,集成了大量的LED基板的中央部变热,存在与LED基板的周边部的温差变大的问题。例如,在LED的点阵显示器中采用图1(a)和图2(a)所示的构成。在LED显示器中,板23具有提高各个LED的发光与不发光的部分的对比度的功能。在显示器的情况下,全部的LED不会始终在大输出下成为点亮状态,发热不是大的问题,但是,当作为照明装置而使用时,为了维持全部LED长时间点亮状态,发热的问题显著化。
在上述现有的构成例中,使用树脂作为基板21和板23的材料,使之一体化。因此,基板21和板23的各自的热膨胀率大致相等,通常的树脂材料的热传导率较低,热容易滞留,因此,不适合于以大输出一直点亮的照明装置。
而且,由于一体化的基板21和板23的基板中央部与周围部存在温差,则通过材料的热膨胀率差而在基板周围部发生较大的应力。当在照明装置中使用LED时,每当重复LED的点亮·熄灭时,因加热所产生的应力发生,从而会导致LED的电极32a和电极34a的断线。
而且,不单独地构成板23,而使用呈现与热传导率高的基板材料相同程度的热传导率的材料,在基板自身中形成相当于板23的厚度的部分,在该基板上设置安装LED裸芯片的凹部,在此情况下,对基板材料的热传导率要求散热和均热化的能力。
而且,在采用上述构成的情况下,需要增厚基板自身,并且,由于不能减薄LED裸芯片22所安装的基板,因此,即使热传导率变高,热仍蓄积在基板中。因此,当象照明装置那样在大电流下通电点亮状态长时间持续时,安装在基板中央的LED裸芯片的温度上升,在基板中央与周围之间发生较大的温差。这样,不充分利用具有高的热传导率的基板材料的特性,不能解决散热的问题。而且,若不增大在基板表面形成的凹部,就不能确保安装LED裸芯片22并且通过引线接合来对LED裸芯片22进行布线的空间,因而还会造成光学系统大型化的问题。而且,从各种接合的毛细管和夹头的尺寸的观点看,将LED裸芯片22安装在凹部内是困难的。为了能够在凹部内插入毛细管和夹头,必须加大凹部和光学系统(光出射区域)的尺寸。
另一方面,根据如图1(b)和图2(b)所示的构成,由于模铸树脂24覆盖基板21的一面,在模铸树脂24的固化时,在中央与周围产生固化反应的时间差,在树脂内部发生较大的残留应力。而且,从LED裸芯片22发出的光被其他的LED裸芯片22所吸收(由LED所产生的自吸收),来自LED全体的光取出效率变低。而且,由于模铸树脂24起到保温材料的作用,在基板中央部与周围部发生温差,由材料的热膨胀率差而引起,在基板周围部传播模铸树脂24的应力。
发明内容
鉴于上述问题,本发明的目的是提供能够同时解决这些所有的问题(高密度化、散热性、光利用率)的LED照明光源和LED照明装置。
本发明所涉及的LED照明装置,包括:至少一个连接器,连接到在基板的一面上安装了LED的可装卸的卡型LED照明光源上;点亮电路,经过上述连接器与上述卡型LED照明光源电连接。
在最佳实施例中,上述基板是在上述LED所安装的表面上设置绝缘层和导电性布线图形的金属基板。
在最佳实施例中,上述LED在裸芯片状态下安装到上述基板上。
在最佳实施例中,在上述基板中安装了上述LED的基板表面的一端侧形成供电电极,上述基板中安装了上述上述LED的光出射区域的中心位置从上述基板的中心位置偏移。
在最佳实施例中,设有热传导部件,与上述基板上未安装LED的基板表面热接触,从上述基板背面吸取热。
在最佳实施例中,上述基板背面与上述热传导部件之间的接触面积大于或等于上述基板上安装上述LED的光出射区域的面积。
在最佳实施例中,进一步具有用于从外部向上述点亮电路供给电能的供电插座。
在最佳实施例中,上述供电插座是电灯泡用灯口。
在最佳实施例中,设有在连接在上述连接器上的状态下透过从上述卡型LED照明光源发出的光的盖子。该盖子具有各种光学特性,以便于进行光的反射、折射、扩散。
在最佳实施例中,包括:能够实现上述卡型LED照明光源的固定和卸下的容纳部和防止上述卡型LED从上述容纳部脱落的防脱落装置,上述防脱落装置能够这样动作:通过人的手指从上述容纳部卸下上述卡型LED照明光源。
在最佳实施例中,上述基板中安装上述LED的基板表面的形状为大致长方形,上述容纳部具有进行引导的导轨,以便于使上述卡型LED照明光源滑动,在固定在上述容纳部中的上述卡型LED照明光源接受来自上述连接器的供电的同时,上述卡型LED照明光源的上述基板背面与上述容纳部热接触。
在最佳实施例中,设有动作机构,它具有把上述卡型LED照明光源固定在上述容纳部中的固定部,在固定在上述容纳部中的上述卡型LED照明光源接受来自上述连接器的供电的同时,上述卡型LED照明光源的上述基板背面与上述容纳部热接触。
在最佳实施例中,上述卡型LED照明光源的未安装LED的基板背面与上述LED之间的热阻为10℃/W以下。
在最佳实施例中,设有使来自上述基板中未安装上述LED的基板背面的热进行散热的装置。
本发明的卡型LED照明光源,包括:金属基板、安装在上述金属基板的一面上的多个LED裸芯片,其特征在于,可装卸地支承在具有连接器和点亮电路的照明装置上并且上述金属基板中未安装上述LED裸芯片的基板背面与上述照明装置的一部分热接触,在上述金属基板中安装了上述LED裸芯片的上述基板一面上设置供电端子。
在最佳实施例中,在上述金属基板中安装了上述LED裸芯片的基板表面上设置开有围绕各个LED裸芯片的孔的光学反射板,并且,各个LED裸芯片被密封。
在最佳实施例中,在上述光学反射板的上述孔中配置光学透镜。
在最佳实施例中,在上述金属基板与上述光学反射板之间配置应力缓和装置。
在最佳实施例中,上述金属基板的中心位置从上述金属基板中安装了上述LED裸芯片的光出射区域的中心位置偏移。
在最佳实施例中,上述金属基板中未安装上述LED裸芯片的基板背面与上述LED裸芯片之间的热阻为10℃/W以下。
在最佳实施例中,在上述金属基板中安装了上述LED裸芯片的基板表面上形成绝缘层和导电性布线图形,上述绝缘层由至少包含无机填料和树脂组合物的复合材料所形成。
在最佳实施例中,上述绝缘层是白色的。
在最佳实施例中,设有经过绝缘层而层叠的2层以上的布线层,具有在上述绝缘层的规定位置上相互连接上述两层以上的布线层的构造。
在最佳实施例中,上述多个LED裸芯片的至少一部分通过倒装接合而连接在上述金属基板的布线图形上。
在最佳实施例中,接受从上述LED裸芯片发出的光的至少一部分而发出可见光的荧光体设在上述金属基板上。
本发明的装置设有给上述任一个卡型LED照明光源供电的连接器。
本发明的另一种卡型LED照明光源,分别在器件基板上具有发光部的多个LED裸芯片设置在散热基板上,其特征在于,上述LED裸芯片设置在上述散热基板上,以使上述发光部与上述散热基板的距离小于上述器件基板与上述散热基板的距离,上述LED裸芯片的上述器件基板的光出射表面形成边缘部低于中央部的倾斜面形状。
在最佳实施例中,上述LED裸芯片直接倒装接合在上述散热基板上。
在最佳实施例中,上述散热基板是复合基板。
在最佳实施例中,在上述散热基板上设置配置成分别围绕上述LED裸芯片来控制来自上述LED裸芯片的光的方向的光学反射板。
附图说明
图1(a)是现有的LED照明光源的立体图,图1(b)是现有的另一个LED照明光源的立体图;
图2(a)是图1(a)的LED照明光源中的LED的部分剖面图,图2(b)是图1(b)的LED照明光源中的LED的部分剖面图;
图3(a)是表示本发明的平面型的LED照明装置的一部分的立体图,图3(b)是表示本发明的灯泡型的LED照明装置的一部分的立体图;
图4(a)是本发明的卡型LED照明光源的一个实施例中的分解立体图,图4(b)是该LED照明光源的立体图;
图5(a)和图5(b)分别是本发明的卡型LED照明光源的实施例中的LED的剖面图;
图6(a)和图6(b)是表示卡型LED照明光源中的多个LED的连接例子的等效电路图;
图7(a)和图7(b)表示从LED射出的光的前进路线的图;
图8(a)和图8(b)是表示对从LED射出的光的出射光通量的模拟结果的图;
图9(a)和图9(b)是表示LED中的器件基板的光射出侧表面的另一个形状例子的剖面图;
图10是表示LED的另一个构成例的剖面图;
图11(a)~图11(d)是表示图10所示的LED中的晶片接合的接合部的构成例的平面布局图;
图12是表示本发明的卡型LED照明光源的另一个实施例的分解立体图;
图13是表示能够用于本发明的LED照明光源的连接器的图;
图14(a)是图12的卡型LED照明光源中的LED所设置的区域的剖面图,图14(b)是设置供电电极的区域的剖面图;
图15是表示图12的卡型LED照明光源中的LED的连接构成的等效电路图;
图16是表示图12的卡型LED照明光源所安装的LED照明装置的点亮电路的构成的方框图;
图17是表示图12的卡型LED照明光源中的上层布线图形的平面布局图;
图18是表示图12的卡型LED照明光源中的下层布线图形的平面布局图;
图19(a)是表示进行倒装芯片(FC)安装的部分的布线图形的平面图,图19(b)是表示进行引线接合(WB)安装的部分的布线图形的平面图,图19(c)是进行FC安装的LED裸芯片的剖面图,图19(d)是进行WB安装的LED裸芯片的剖面图;
图20是表示本发明的LED照明光源的另一个实施例的图,表示灯泡型的LED照明装置;
图21是表示本发明的LED照明光源的另一个实施例的图,表示安装了多个卡型LED照明光源的灯泡型的LED照明装置;
图22是表示本发明的LED照明光源的另一个实施例的图,表示立式LED照明装置;
图23是表示本发明的LED照明光源的另一个实施例的图,表示两个卡型LED照明光源进行装卸的构成的立式LED照明装置;
图24是表示本发明的LED照明光源的另一个实施例的图,表示立式LED照明装置的另一个实施例;
图25是表示本发明的LED照明光源的另一个实施例的图,表示手电筒和钢笔型手电筒的LED照明装置;
图26表示置换为使用现有的直管荧光灯的照明装置的LED照明装置;
图27是表示本发明的LED照明光源的另一个实施例的图,表示置换为使用现有的环形荧光灯的照明装置的LED照明装置;
图28是表示本发明的LED照明光源的另一个实施例的图,表示向下照光型的LED照明装置;
图29是表示本发明的LED照明光源的另一个实施例的图,表示光轴可变型的LED照明装置;
图30是表示本发明的LED照明光源的另一个实施例的图,表示卡型LED照明装置;
图31是表示本发明的LED照明光源的另一个实施例的图,表示钥匙环型的LED照明装置。
具体实施方式
本发明的LED照明装置包括:与可装卸的卡型LED照明光源电连接的连接器、经过该连接器与卡型LED照明光源电连接的点亮电路,通过安装卡型LED照明光源,能够放射照明光。卡型LED照明光源,如后面详细说明的那样,具有多个LED安装在散热性良好的基板的表面上的构成。
如对现有的LED照明光源说明的那样,在基板上高密度地安装多个LED器件,并且,当在各个LED器件中流过大电流时,存在LED的发热量到达过大的水平上,而使LED的寿命缩短的问题,这妨碍了LED照明装置的实用化。
在本发明中,通过可装卸的卡状构造物来构成照明装置的光源部分,提高使各个LED发生的热顺利地散热的效果,同时,能够仅把寿命终结的光源更换为新的光源,由此,能够长期使用LED照明装置的光源之外的构造体。
从提高散热性的观点出发,LED最好作为裸芯片安装在基板的一个表面上。这是为了使由LED发生的热直接地传递到基板上,而发挥更高的散热性。
通过把LED和供电电极集中在作为基板的一个主要表面的一面上,能够使与该主要表面相对的另一面(里面)起到宽阔的散热用热传导面的作用。因此,能够使LED照明装置中与热传导部件相接触的面积大于或等于LED所安装的光出射区域的面积。为了促进热传导,最好由金属形成未安装LED的基板背面。
通过使卡型LED照明光源的尺寸和供电电极的位置标准化,能够实现多样的照明装置中的卡型LED照明光源的利用,能够通过卡型LED照明光源的大量生产而降低成本。
从电极间的绝缘性与其他设备的电极的匹配的观点出发,供电电极的间距被设定为例如0.3、0.5、0.8、1.25、1.27、1.5、2.45mm。在大量生产卡型LED照明光源的过程中,最好分割大的基板原料板来制作多个卡型LED照明光源的基板,但是,在切断中存在加工误差。对于装卸卡型LED照明光源的LED照明装置的连接器的尺寸,也会发生机械制造误差。因此,当电极间的间距过小时,在LED照明装置的连接器部中,存在供电电极相互短路的可能性。根据以上内容,电极间的间距最好设定为0.8mm以上的大小。
而且,由于LED在高温下的正向电压降低,从动作稳定性的观点出发,最好采用恒流驱动来代替恒压驱动。在进行恒流驱动时,在卡型LED照明光源中需要用于恒流驱动的与驱动路径数量对应的接地线。最好,在基板上形成电气独立的多个接地供电电极。这样,在与这样的卡型LED照明光源相对应的LED照明装置中,最好设置多个接地电极连接器。当在上述卡型LED光源上配置多个供电电极的情况下,电极间的间距最好设定为2mm以下,设定为1.25mm以下更好。
如后述的那样,使用本发明的卡型LED光源和LED照明装置,通过单独地驱动蓝、绿(蓝绿)、黄(橙)、红、白的LED来进行照明,在此情况下,最好对各色的LED设置两个电极(共计10个电极)。
本发明的卡型LED光源可以设计成适合于恒压驱动和恒流驱动,进行电气独立的多路径的驱动。在此情况下,卡型LED光源设有经过绝缘层而层叠的两层以上的布线层,最好具有相互连接上述两层以上的布线层的构造。
当采用通孔构造来作为相互连接两层以上的布线层的构造时,通孔的直径可以在例如100μm至350μm之间任意设定。当考虑通孔的开孔误差时,卡型LED光源的供电电极的宽度最好具有通孔的直径的2倍至3倍的大小,例如,具有200μm~1050μm的大小。
供电电极的长度最好设定为LED照明装置的连接器不与通孔直接接触。因此,供电电极的长度最好被设定为例如1mm以上。但是,为了使卡型LED光源小型化,最好把供电电极的长度抑制在5mm以下。
下面,参照附图来说明本发明的LED照明装置的实施例。
实施例1
图3(a)是表示本发明的LED照明装置的一部分的立体图,表示可装卸的多个卡型LED照明光源10所嵌入的散热片19。
卡型LED照明光源10通过设在散热片19的侧面的槽而插入到规定位置上。散热片19与所安装的卡型LED照明光源10的里面热接触,从卡型LED照明光源10的基板背面向外部散热。
插入散热片19中的卡型LED照明光源10与设在散热片19内的连接器(未图示)电连接。卡型LED照明光源10经过该连接器与未图示的点亮电路电连接。而且,在本说明书中,「连接器」的术语广泛地覆盖了这样的部件·零件:通过可装卸的机构,进行与卡型LED照明光源的电连接。作为连接器,存在具有各种存储卡等进行装卸的多种构成,但是,在本发明中,可以采用具有与这些现有的连接器大致相同的构成的连接器。
设有这样的散热片19和点亮电路的LED照明装置容易实现薄型化,适合于作为面光源使用。而且,当多个卡型LED照明光源10的任一个发生故障时,如果从散热片19上取下发生故障的卡型LED照明光源10,并装上新的(没有故障或变差)卡型LED照明光源10,就能继续作为照明装置来使用。
在本发明的优选实施例中,在卡型LED照明光源10的表面上设置供电电极,以便于不使用特别的工具·器具来简单地进行卡型LED照明光源10的装卸,能够通过仅把卡型LED照明光源10连接在连接器上来实现供电电极于连接器的电气接触和连接。作为这样的卡型LED照明光源10的构造的具体例子将在后面详细说明。
如上述那样,在图3(a)的例子中,散热片19于卡型LED照明光源10的基板背面(未安装LED侧)热接触。这样,该散热片19起到从卡型LED照明光源的基板背面吸取热的热传导部件的作用,但是,作为热传导部件也可以使用由硅润滑油和凝胶等形成的散热板,可以使用这些散热板与散热片的组合以及热管与风扇等的组合。而且,LED照明装置的壳体自身可以作为热传导部件使用。
下面参照图3(b)。
图3(b)所示的LED照明装置是能够置换为公知的白炽灯泡的照明装置,包括:可装卸地支持卡型LED照明光源的适配器20和覆盖安装状态的卡型LED照明光源的透光盖20a。在适配器20的内部设置未图示的点亮电路。在适配器20的下部设置用于从外部向内部点亮电路供给电能的供电插座(螺丝口插座)。该供电插座的形状和尺寸与设在通常的白炽灯泡上的供电插座的形状和尺寸相等。因此,图3(b)的LED照明装置可以原封不动地安装到装入白炽灯泡的现有的电气器具上来使用。而且,可以采用针型插座来取代螺丝口插座。
在图3(b)所示的LED照明装置的适配器20中设置用于插入卡型LED照明光源10的槽。在该槽的深处配置未图示的连接器,经过该连接器进行卡型LED照明光源10与点亮电路的电连接。而且,在所图示的例子中,在适配器20上设置槽,经过该槽来进行卡型LED照明光源10的装卸,但是,装卸的形式并不仅限于此。对于未设槽的类型的实施例在后面说明。
如上述那样,图3(b)的卡型LED照明光源10具有相对于连接器进行简单地插拔的机构,因此,能够在与照明器具之间容易地进行卸下更换。这样,由于卡型LED照明光源10的卸下容易进行,而具有以下的优点:
首先,第一,通过更换LED的安装密度不同的卡型LED照明光源10,能够容易地提供发光光量不同的照明器具。第二,即使卡型LED照明光源10在短期间内变差而作为光源的寿命变短,也能与通常的电灯泡、荧光灯的更换一样,仅通过更换卡型LED照明光源10,来仅对光源部进行更换。
第三,能够使安装在卡型LED照明光源10中的LED具有相关色温低的光色用或者相关色温高的光色用和蓝、红、绿、黄等单独的光色。如果从这样的卡型LED照明光源10中选择适当的,装到对应的LED照明装置上,就能切换并控制LED照明装置的发光光色。
而且,通过在卡型LED照明光源10中安装多发光色(2种以上的光色)的LED,能够通过一个卡型的卡型LED照明光源10来从相关色温低的光色到相关色温高的光色控制发光光色。在此情况下,当使用两种光色的2波长型时,虽然演色性低但能够实现高效率的光源,当相关色温低时,最好采用红和蓝绿(绿)的发光的组合,当相关色温高时,最好采用蓝和黄(橙)发光的组合。而且,在蓝和红的发光的LED的组合种。以蓝来激发,在其中间的波长上加入发光峰值的某种荧光体(例如,YAG荧光体等),在此情况下,能够实现高效率并且平均演色评价指数为80以上的光源。而且,在使用三种光色的三波长型的情况下,最好为蓝和蓝绿(绿)和红发光的组合,在使用四种光色的四波长型的情况下,最好为蓝和蓝绿(绿)和黄(橙)和红发光的组合,特别是,当四波长型时,能够实现平均演色评价指数超过90的高演色的光源。而且,在所安装的LED裸芯片放射单色或者紫外线时以及在通过在LED裸芯片中激发荧光体和磷光材料来发出白光的情况下,都能使用本发明。而且,可以在基板中含有荧光体和磷光材料。而且,能够把发蓝光的LED和由蓝光所激发的荧光体和磷光材料以及发红光的LED进行组合,而能够同时满足高效率·高演色。
上述卡型LED照明光源10具有正方形的卡型形状,但是,本发明并不仅限于此。供电用的电极(供电电极)最好在卡型LED照明光源10的基板上形成在LED所排列的区域的周边部。在更好的形态中,在基板周边的一端(一边)的附近排列多个供电电极。在供电电极的数量较多的情况下,可以采用延长基板的一边的长方形。在此情况下,由于LED的集中中心(LED所排列的光出射区域的中心)与基板的中心相偏移,弯曲应力没有施加到具有光学系统的光出射区域的中心上,因此,使弯曲应力变强。而且,通过把长方形形状的拐角整圆,在用人的手指取出卡型LED时,能够降低由基板拐角部划破LED照明器具的可能性。
而且,通过切下、标记基板的一部分或者设置凹凸,能够使卡型LED照明光源10的方向变得明确。这样,当把卡型LED照明光源10装到照明装置中时,能够正确并且容易地进行卡型LED照明光源10对照明装置的定位。
在上述例子中,采用在卡型LED照明光源上设置供电电极,来与连接器电极相连接的构成,但是,也可以采用以下这样的构成:
构成例1.在卡型LED照明光源的电极上安装面安装型的电缆连接器部件,而能够在卡型LED光源本身中插拔供电电缆。
构成例2.在卡型LED光源上直接接合供电电缆,在未与卡型LED光源相接合的一端上插拔电缆。
当采用以上的构成时,供电电缆最好是具有柔软性的带状电缆。
实施例2
下面说明本发明的卡型LED照明光源的实施例。
图4(a)和(b)表示本实施例中的卡型LED照明光源的构成。本实施例的卡型LED照明光源可以用于图3的照明装置中。
在本实施例的卡型LED照明光源中,如图4(a)所示的那样,在散热基板1的一面上安装多个LED裸芯片2。在图中的例子中,LED裸芯片2排列成由行和列组成的矩阵型,但是,本发明并不仅限于此,LED裸芯片2的排列形式是任意的。
在安装了LED裸芯片2的散热基板1上进一步组合图4(a)的光学反射板3,构成图4(b)所示的卡型LED照明光源。在光学反射板3上形成与在散热基板1上所排列的LED裸芯片2相对应的开口部(孔)3b。因此,经过光学反射板3的开口部3b,来自LED裸芯片2的光被取出到外部。而且,为了提高光取出效率,光学反射板的开口部(孔)在与散热基板相对侧的光出射部上的直径最好大于散热基板侧的。
在本实施例中,作为卡型LED照明光源的散热基板1,使用具有高热传导率(3.2W/(m·K)程度)的铝复合基板。铝复合基板制的散热基板1是包括成为基础的金属板(厚度例如为0.5~3.0μm)和设在金属板上的绝缘层的金属基板。金属板厚度从由热引起的翘曲和弯曲强度的观点出发,最好为0.7mm以上,从基板的切割观点出发,最好为2.0mm以下。从提高散热性的观点出发,最好把未安装LED照明光源的LED裸芯片的基板背面与LED裸芯片之间的热阻设定为10℃/W以下。
下面,参照图5(a)和(b)来详细说明卡型LED照明光源的剖面构成。图5(a)表示绝缘层为单层构成(绝缘层1c)的例子的部分剖面,图5(b)表示绝缘层1c为多层(绝缘层1c和1e的两层)构成的另一个例子的部分剖面。
如从图5(a)和(b)所示的那样,本实施例的散热基板1包括金属板1b和贴在金属板1b上的绝缘层1c(和绝缘层1e)。绝缘层1c、1e最好由包含无机填料和树脂复合物的复合材料所形成,绝缘层1c、1e的厚度被设定为例如合计100~400μm。图5(b)表示了绝缘层的2层化的一例,但是,也可以是多层化的。
作为无机填料,最好使用从Al2O3、MgO、BN、SiO2、SiC、Si3N4和AlN中选择的至少一种的填料。从提高填充率和热传导率的观点出发,最好无机填料的粒形是球状的。使无机填料被分散的树脂复合物包含从环氧树脂、酚醛树脂、氰酸脂树脂中选择的至少一种,而且,最好由上述无机填料70~95%重量和上述树脂复合物5~30重量%的混合所形成。
金属板1b保持散热基板1的机械强度,同时,赋予散热基板1的均热化。而且,金属板1b的表面是平坦的,因此,通过与未图示的散热片部件等热传导率优良的部件进行热接触,能够实现高的散热效果。
作为另一个实施例,取代对作为散热基板1的基板金属的金属板1b之上的绝缘层1e具有上述构成的方案,可以使用热传导率低于复合材料的低温烧结玻璃·陶瓷基板。而且,虽然更昂贵,但是,也可以使用热传导率高的陶瓷基板、空心基板、氮化铝基板、氧化铍基板等作为基材。但是,当考虑散热性和机械强度时,最好使用金属板作为散热基板1的基础金属。作为其绝缘层,可以选择上述陶瓷基板等的基板,粘贴到金属板上。在此情况下,粘贴在金属板上的绝缘性基板的厚度变薄,并且,具有可粘贴的强度,例如,被设定为80μm~1000μm的范围内。这样,能够在基础金属上层叠材料和组成不同的绝缘层。
在散热基板1上形成布线图形1a(和1d),该布线图形1a(和1d)通过由复合材料所形成的绝缘层1c(和1e)而与金属板1b电绝缘。
在图5(b)的例子中,经过形成在第一层的绝缘层1c上的通孔1f,形成在第二层的绝缘层1c上的布线图形1a和形成在第二层的绝缘层1e上的布线图形1d被电连接。
在图5(a)所示的散热基板1中,在为了进行多色(例如2~4色)发光而在同一基板上排列多个LED的情况下,对于每个发光色,采用图6(a)和(b)所示那样的单纯的串并联连接或梯形连接。通过采用这样的梯形连接,能够抑制LED的电流电压特性的偏差来进行点亮。而且,在一个LED断线的情况下,在图6(a)的电路中,与该断线的LED串联连接的全部LED变为不点亮,而在图6(b)的电路中,仅该断线的LED变为不点亮。与此相对,根据图5(b)这样的多层构成的散热基板1,能够实现图15所示那样的使不同电系统的LED相邻的配置,能够更难于在电路系统中感到不亮和亮度偏差。而且,在多色的LED的混合光上是有利的。能够实现梯形连接。
在本实施例中,在散热基板1上直接搭载裸芯片状态的LED(「LED裸芯片」)2。该LED裸芯片2,如图5(a)、(b)所示的那样,在由蓝宝石组成的器件基板11上设有发光部15。发光部15具有GaN类的n型半导体层12、有源层13和p型半导体层14被层叠的构造。
在本实施例中,与图1所示的现有例子不同,从器件基板11,向着发光部15接近于散热基板1侧来安装LED裸芯片2。即,通过倒装接合,p型半导体层14的电极14a直接连接在散热基板1的布线图形1a上。n型半导体层12的电极12a不经过导线而通过突起16而连接在散热基板1的布线图形1a上。而且,电极12a和电极14a都能够进行各种突起接合,与布线图形1a金属接合的LED裸芯片2的这些电极12a、14a的面积越大,对散热约有利。根据这点,本实施例这样的构成是有利的:从器件基板11侧取出光,在发光部15侧取得大的金属接触面积。
各个LED裸芯片2的尺寸,考虑到LED裸芯片的现状,纵和横为250~350μm左右,厚度为90~350μm左右是现实的,但是,本发明并不仅限于此。
如本实施例那样,通过倒装连接把LED裸芯片2与布线图形进行连接,使LED裸芯片2大于或等于纵和横1mm程度,在使从一个LED裸芯片2取出的光量增加时具有几个优点。
在LED裸芯片为500μm以上的大型化的情况下,与电极相接合并供电的p型半导体、n型半导体的电阻及其电流密度分布成为原因,在电极附近发出强光而在远离电极的位置上发光变弱。象本发明这样,通过把大型的LED裸芯片作为倒装片构成,使该LED裸芯片的电极成为器件面积的50%以上的大型化,而能够解决该问题。该解决由LED裸芯片的光取出面与供电面成为对置的这样本发明特有的构成来实现。而且,不是使LED裸芯片的电极成为p型、n型的一对,而成为多数,由此,能够抑制LED裸芯片内的电流密度不均。当以现有的线接合来实现该多数对的构成时,导线的绕回变长,而存在线接合的次数增加等问题。
而且,在本实施例中,器件基板11即LED裸芯片的基板表面(光出射侧表面)不是完全的平面,成为中央部高而向着周边部变低的形状(作为一例,为圆顶状)。
在围绕LED裸芯片2的位置上具有控制由LED裸芯片2发生的光的前进方向的反射面3a,在各个LED裸芯片2的设置位置上开出孔3b的金属(铝)制的光学反射板3被设在散热基板1上。而且,在该孔3b中填充树脂4(环氧、树脂、硅或者它们的组合),以便于模铸LED裸芯片2。该填充的树脂4起透镜作用。
通过这样的构成,当在电极12a、电极14a之间施加正向的偏置电压时,通过注入n型半导体层12中的电子和注入p型半导体层14中的空穴的再结合,从有源层13射出光,利用该出射光作为照明。而且,通过光学反射板3的反射面3a把出射到图5(a)、(b)的横向上的光向上方反射,来谋求光利用效率的提高。
在本实施例的情况下,伴随着LED裸芯片2的发光动作,发生大量的热,但是,该发生的热直接从发光部15散射到散热基板1上。同时,金属制的光学反射板3提供散热基板1的均热化,起到抑制向散热基板1中央部的热集中的效果。
本实施例的LED裸芯片2例如通过下列工序来制造:
首先,在直径2英寸的蓝宝石基板上,例如通过CVD法依次层叠形成GaN类的n型半导体层、有源层和p型半导体层,接着形成电极12a、14a,制造半导体晶片。接着,对制造的半导体晶片组合喷沙处理和切割处理,来制作各个LED裸芯片2。
在把蓝宝石基板作为上边的半导体晶片上吹附细的陶瓷粒和金属粒,在从蓝宝石基板侧形成每个器件的分离槽之后,进一步分割该分离槽,而切割成多个LED裸芯片2。通过这样处理,制造出器件基板11的光出射侧本发明成为圆顶状的多个LED裸芯片2。其中,通过控制吹附的陶瓷粒或金属粒的流量、流速,能够控制器件基板11的表面形状。此外,把切割用刀刃的不同形状进行组合,首先切削形成倾斜部,然后用具有其他刃型的切割用刀来完全地进行切分。
在本实施例中,与现有的在LED裸芯片的上下构成电极的情况不同,采用倒装片构成,同时,LED裸芯片的上表面小于下表面。因此,当进行上述加工时,不需要担心上表面电极的大小和损伤。而且,由于在LED裸芯片的上表面没有导线,能够避免由导线所产生的放射的影响(妨害),能够避免由导线引起的发光的畸变和光输出的降低。
在本实施例中,以蓝宝石基板为例,但是,也可以使用SiC基板和GaN基板等。重要的是:不限于可见光,也可以使用透过LED辐射的光的基板。而且,可以通过在现有的通孔器件(炮弹型器件等)和面安装器件(SMD(表面安装器件)和芯片型器件等)器件中装入LED裸芯片来使用。
把电极12a、14a连接到散热基板1的布线图形1a、1a上,而把这样制造的多个LED裸芯片2矩阵状地配置在散热基板1上。而且,在覆盖了光学反射板3之后,用树脂4模铸各个LED裸芯片2。而且,当在该光学反射板3的孔3b中封入树脂4时,进行由印刷法完成的树脂封装,在此情况下,能够一次实现大量的树脂透镜的形成,而提高批量效果。
在本发明的卡型LED照明光源中,把发光部15作为散热基板1侧而设置各个LED裸芯片2,因此,不需要设置图1所示的现有例子中见到的供电用导线,则线接合所需要的区域就不需要了,因此,能够缩窄相邻设置的LED裸芯片2、2的间隔,能够谋求LED裸芯片2的高集成化。而且,这点对使用发光色不同的多个LED裸芯片2(或者裸芯片)的混合光是有利的。
而且,由发光部15发生的热经过热传导率高的散热基板1而有效地散射到外部。此时,在各个散热基板1中,发生热的发光部15直接连接在散热基板1上,因此,不必象图1所示的现有例子那样经过器件基板来散热,由发光部15发生的热直接通过散热基板1而散射到外部,该散热性优良。这样,散热性优良,即使大量的热发生,也能使该发生的热容易地散射,来抑制LED裸芯片2的温度上升,因此,能够在各个LED裸芯片2中流过强电流,而得到大的光通量。
而且,由于LED裸芯片2的器件基板11(蓝宝石)的折射率和树脂4(环氧树脂或硅树脂)的折射率不同,因此,在器件基板11的光出射侧表面上,从发光部15发出的光的一部分通过折射率之差而发生全反射。该全反射的光进到LED裸芯片2侧,因此,不会提供给照明用。这样,为了有效利用发生的光,需要尽可能抑制该全反射。
在本实施例中,把各个LED裸芯片2的器件基板11的光出射侧表面的形状加工成相对于发光面不是水平而是圆顶状。由此,降低了由发光部15发出的光的全反射的比例。图7(a)是表示光出射侧表面成为圆顶状的本发明中的光的前进路径的图,图7(b)是表示光出射侧表面成为水平面的比较例中的光的前进路径的图。
在光出射侧表面成为水平面的情况下,在其周边部,入射角变大,到达临界角的光(图7(b)的B)的比例变多,容易引起全反射。与此相对,在光出射侧表面成为圆顶状的情况下,在其周边部,光的入射角到达临界角的比例变少,从发光部15发生的大部分的光(图7(a)的A)不会被全反射,而出射到外部。
在图8(a)、(b)中表示了把器件基板11的光出射侧表面的形状加工成型为圆顶状的LED裸芯片2(本发明例子)和器件基板11的光出射侧表面为水平形状的LED裸芯片2(比较例子)中的光的出射光通量的模拟结果。当比较图8(a)、(b)时,在本发明例子中,与比较例子相比,向能够作为照明光而提供的上方的光通量增大,有效地进行光的外部取出。根据本发明人的测定,在本发明中,与比较例子相比,能够把光取出效率提高到1.6倍。
这样,在本发明的卡型LED照明光源中,把器件基板11的光出射侧表面作为圆顶状,因此,能够使发生的光不浪费地取出到外部,能够把发生光中的照明光的利用效率提高到极高。
而且,在上述例子中,把器件基板11的光出射侧表面作为圆顶状,但是,如果是难于引起全反射的形状(中央部高而周边部变低的倾斜表面状),就能设定为任意的形状。例如,如图9(a)所示的那样,与上述例子相反,可以在发光部15侧使用倾斜面形成为凸状的形状、图9(b)所示的那样的倾斜角为一定的倾斜面(锥面)所形成的形状。
但是,在倾斜面不是曲面而是平面或者多面体的情况下,其效果较低。倾斜面最好是圆顶状,在此情况下,具有由LED裸芯片2本身形成透镜的效果。由于LED裸芯片2本身具有透镜效果,LED裸芯片2本身的配光集中到透镜前面,向LED裸芯片2侧方出射的光量较低。由此,装入了LED裸芯片2的光学系统的漫射光成分减少,其结果,提高了作为卡型LED照明光源全体的光利用效率。
在上述例子中,对使用以GaN类的n型半导体层/蓝宝石器件基板构成来发出蓝色光的LED裸芯片2的蓝色光的卡型LED照明光源进行了说明,但是,也可以是使用发出其他的红色光的LED裸芯片、发出绿色光的LED裸芯片或者发出黄色光的LED裸芯片的卡型LED照明光源,同样能够使用本发明。而且,在混合配置这4种LED器件,对它们的发色光进行配光控制来提供白色光和可变色光的白色卡型LED照明光源中,也能使用本发明。
作为另一个实施例,存在呈现蓝色发光、绿(蓝绿)发光的SiC基板、GaN基板等不同的器件基板上构成的GaN类LED,但是,由于在此情况下器件基板自身具有导电性,则除在夹着图5(a)、(b)中的有源层13的n型、p型半导体层12、14上形成电极之外,也可以为把一方的电极作为器件基板本身的构成。
此外,在呈现黄(橙)色、红色的发光的AlInGaP类的LED裸芯片(器件)的情况下,作为器件基板,使用相对于这些发光色的透过率高的GaP基板,而取同样的构成。
而且,通过在形成透明电极的蓝宝石基板、玻璃基板等透明基板上对AlInGaP类的LED裸芯片的发光部进行晶片接合,能够取同样的构成。
而且,如图10所示的那样,在形成具有光学开口部的金属电极18的蓝宝石基板、玻璃基板等透明的器件基板11上,对同样形成具有光学开口部的金属电极的AlInGaP类的LED裸芯片(器件)的发光部15进行金属接合(例如,使用超声波接合等的金属接合),由此,能够取同样的构成。在此情况下,晶片接合的接合部能够取各种形状,在图11(a)~(d)中表示了其一例。
AlInGaP类的LED裸芯片的情况下,在不除去成长基板的状态下,首先,可以把具有裸芯片的开口部的金属电极与在晶片接合的透明器件基板11上具有开口部的金属电极进行金属接合。在此情况下,在金属接合后,进行除去LED裸芯片的成长基板的工序。器件基板11的形状加工可以在晶片接合工序的前后的时刻进行,也可以在除去LED裸芯片的成长基板的工序前后的时刻进行。
而且,使用光学透明的粘接装置,能够实现透明基板与LED裸芯片的发光部的晶片接合。
在上述例子中,通过喷沙处理来形成器件基板11的表面形状,但是,也可以通过由喷水所进行的加工或者选择性化学腐蚀处理来形成其表面形状,可以使具有与器件基板11同等的折射率的光学透镜弯曲。而且,如对GaN类的LED裸芯片的加工描述的那样,通过使用分割刀的刃的切削,能够得到器件基板11的表面形状。而且,可以把进行了这些加工的倒装片用裸芯片装入现有的炮弹型和SMD等器件中来使用。
由于上述构成不使用导线接合,而提供了光学系统的小型化和高效率化。
在使用AlInGaP类的LED的情况下,通过增大位于安装LED裸芯片的基板(散热基板)附近的LED电极的面积,而使向着安装用基板的光被反射,提高光取出效率。
而且,散热基板1除了使用图5(a)、(b)所示那样的金属基板之外,也可以通过金属芯基板等来制造。但是,在采用金属基板的情况下,基板下表面是金属的,同时,能够在基板上配置金属制的光学反射板,因此,能够进行来自基板上表面和下表面的两面散热,进一步提高散热效果。
实施例3
下面说明本发明的卡型LED照明光源的另一个实施例。
首先,参照图12来说明本实施例的卡型LED照明光源。
本实施例的卡型LED照明光源,如图12所示的那样,包括:金属板50、多层布线板51、金属制的光学反射板52。金属板50和多层布线板51作为全体构成一个「卡型LED照明光源」。
金属板50是散热基板的基板金属。金属板50和光学反射板52可以由铝、铜、不锈钢、铁或者它们的合金来制造。金属板50和光学反射板52的处理可以不同。当排列从热传导率的观点出发的好的材料时,为铜、铝、铁、不锈钢的顺序。另一方面,当排列从热膨胀率的观点出发的好的材料时,为不锈钢、铁、铜、铝的顺序。从防锈处理等的方便出发,铝类处理较好,从避免由热膨胀引起的可靠性变差的观点出发,不锈钢类材料较好。
金属板50的内表面是平坦的,可以于热传导性好的部件(未图示)的平坦面相接触。
如果对于金属板50通过电解研磨、氧化铝膜处理、非电解电镀或者电镀进行绝缘处理,则即使金属板50直接接触到布线图形上,也不会发生电短路。
而且,在金属板50的表面上,至少对反射从LED裸芯片所散射的光的部分进行用于提高反射率的处理。在用于提高反射率的处理中包含多层层叠折射率不同的多个物质层的增反射处理和提高金属板50的表面上的镜面性的处理。
多层布线板51与实施例2相同,具有由无机填充物和树脂复合物的混合物组成的第一绝缘层和第二绝缘层的两层构造。在第一绝缘层与第二绝缘层之间形成下层布线,在第二绝缘层上形成上层布线。通过设在第二绝缘层上的通孔,上层布线与下层布线进行电连接。
在光学反射板52的孔中填充LED封装树脂,能够形成由树脂构成的凹透镜或凸透镜,而且,通过用树脂埋住孔部分,能够进行平坦化。但是,由于光学反射板52的面积小于多层布线板51的面积,能够用树脂来模铸光学反射板52的全体。如果用树脂完全覆盖光学反射板52,能够提高密封性。
设在照明装置侧的连接器,如图13所示的那样,包括:具有使卡型LED照明光源滑动并导向的导轨部55;与卡型LED照明光源电连接的多个连接器电极56;热传导性优良的金属板(底板)57;把连接器电极连接到电路(点亮电路等)上的布线软线58。
插入连接器中的卡型LED照明光源的供电电极54与对应的连接器电极56相接触,并导通。从散热性的观点出发,当在连接器中插入卡型LED照明光源时,金属板50的里面的全部或一部分最好与连接器的金属板57热接触。
在本实施例中,如图12所示的那样,由于供电电极54集中排列在多层布线板51的上表面的四个边中的一个边侧,则卡型LED照明光源在图中的箭头A的方向上被压,而插入到连接器中。
如从图12所看到的那样,多层布线板51的尺寸比光学反射板52的尺寸大了设置供电电极54的区域的宽度。因此,在本实施例中,LED裸芯片53安装成矩阵状的区域(光出射区域或者LED组区域)的中心位置(光学中心)与基板的中心位置不一致,卡型LED照明光源的弯曲的应力中心也与光学系统的中心不一致,则强度提高。而且,通过使供电电极54集中在基板的一端,与多层布线板51的上表面的其他三个边相对应的端部不一定完全嵌入连接器的内部,则形状等的设计自由度提高。
通过适当地设定多层布线板51(和金属板50)的长边方向尺寸(与箭头A相平行的边的尺寸),能够任意调节光学中心的位置。
光学反射板52基本上具有与图4(a)所示的光学反射板3相同的构成,具有与LED裸芯片53的排列相对应的多个开口部。最好在光学反射板52的开口部中形成树脂透镜,通过该树脂透镜来封装LED裸芯片53,因此,LED裸芯片53与多层布线板51的连接变得更坚固。这样,当LED裸芯片53与多层布线板51的连接变得坚固时,为了把卡型LED照明光源螺栓紧固到散热用部件上,在卡型LED照明光源的卡上设置螺栓紧固用的孔,或者,在卡的基板的边缘的一部分上设置螺栓紧固用的圆弧。
参照图14(a)和图14(b),更详细地说明本实施例的卡型LED照明光源的构成。图14(a)表示有源层在面向下的状态下倒装安装的LED裸芯片53。如后述的那样,在本实施例中,采用根据LED裸芯片53的种类而不同的安装方式。
LED裸芯片53与多层布线板51的布线图形59相连接,并且,安装成固定到多层布线板51上。金属制的光学反射板52在LED裸芯片53安装到多层布线板51上之后,被粘贴到多层布线板51上。
在多层布线板51上形成两层的布线图形59,不同层中的布线图形59通过通孔63相连接。最上层的布线图形59经过Au突起61与LED裸芯片53的电极相连接。布线图形59通过由例如以铜、镊、铝或它们的金属为主要成分的合金形成的布线图形而构成。
在这样的多层布线板51中,如上述那样,包含由具有绝缘性的树脂复合物和无机填充物的混合物构成的绝缘层,该混合物最好包含热固性树脂。通过适当地选择构成绝缘层的树脂复合物和无机填充物的种类·含量,能够调节绝缘层的热传导性、线膨胀系数、介电常数等。绝缘层的优选热传导率为1~10(W/m·K)。绝缘层最好为白色的。通过采用白色的绝缘层,能够提高绝缘层的露出部分所产生的可见光反射率,而进一步改善光的利用率。
作为无机填充物,最好使用从由热传导性优良的Al2O3、MgO、BN、SiO2、SiC、Si3N4和AlN组成的群中所选择至少一种的填充物。无机填充物的平均粒径最好设定为0.1~100μm的范围中。当平均粒径超出该范围时,填充物的填充性和基板的散热性降低。
作为热固性树脂,最好使用从环氧树脂、酚醛树脂、氰酸脂树脂组成的群中所选择的至少一种树脂。这些树脂固化后呈现的电绝缘性、机械强度、耐热性优于其他的树脂固化物。树脂复合物根据需要可以加入耦合剂、分散剂、着色剂、脱模剂等添加剂。
使用由二氧化铝填充物的复合材料组成的厚度为160μm的片,准备具有合计320μm的绝缘层的两层布线的多层布线基板,通过粘贴到铝金属基板上的方法,来制造卡型LED照明光源的试制品。在上述铝金属基板的二氧化硫复合2层基板上直接安装LED裸芯片,测定LED裸芯片与基板金属之间的热阻,得到约1[℃/W]的热阻。
在对于上述试制品在无风状态下进行由散热片产生的自然散热的情况下,当以40mA(额定的2倍电流,电流密度为约444[mA/mm2])来驱动约0.3mm的方的LED裸芯片(64个)时,为了把LED裸芯片的温度保持在约80℃,则要求约300[cm2]的散热片表面积。而且,在进行自然空冷的情况下,当想要以这样大的电流动作时,需要把LED裸芯片与基板金属之间的热阻设定为约10[℃/W]以下。
在进行自然冷却的情况下,当LED裸芯片的温度超过80~120℃时,LED裸芯片的封装树脂(环氧树脂和硅等树脂)的热劣化和光劣化变得剧烈,最好不这样。
如果热阻为约5[℃/W]以下时,不是具有理想大小的面积的散热片,即使在使用具有实际的有限面积的散热片的情况下,也能进行由自然空冷所产生的充分的散热。而且,如果热阻为约2~1[℃/W]以下,用小型的散热片也能进行充分的散热。
而且,能够减薄绝缘层厚度,或者,不使用具有约2~4[W/mK]的热传导率的二氧化硫复合材料的绝缘层而使用具有约3至5[W/mK]的热传导率硼类复合材料的绝缘层,能够实现具有1[℃/W]以下的热阻的系统,在此情况下,即使进一步把散热片面积小型化,也能得到同样的效果。
而且,在使用具有1~2.5[W/mK]的热传导率的二氧化硅复合材料的绝缘层的情况下,与使用热传导率更高的绝缘层的情况相比,通过减薄绝缘层,能够实现上述范围的热阻。
多层布线板51的布线图形59可以这样形成:例如,在有机薄膜等的脱模载体上形成布线图形,然后,从脱模载体把布线图形转印到上述绝缘层上。脱模载体的布线图形通过粘接剂而把铜箔等金属箔粘接到脱模载体上,或者,进一步在该金属箔上通过电解电镀或非电解电镀来把金属层堆积成金属层,然后,通过化学腐蚀等,对金属进行刻图来制造。但是,在从金属箔形成布线图形时,为了提高金属箔的粘接强度,最好时绝缘层的表面被粗糙化。
上述布线图形59可以用其他的方法制造。而且,布线图形59可以埋设再绝缘层中,也可以粘接到平坦的绝缘层表面上。而且,连接不同的层中的布线图形59的通孔63通过在绝缘层中形成的孔(通孔)的内部设置电镀和导电性树脂复合部来制造。
具有这样构成的多层布线板51的上表面的大半由光学反射板52覆盖,一部分露出。在多层布线板51上的露出区域形成多个供电电极54。该供电电极54经过卡型LED照明光源插入的连接器而与照明装置的点亮电路电连接。
在光学反射板52与多层布线板51之间设置未充满(应力缓和层)60。通过该未充满60,由金属制的光学反射板52与多层布线板51之间存在热膨胀差引起的应力被缓和,同时,光学反射板52与多层布线板51上的上层布线之间的电绝缘得以确保。
光学反射板3的全体最好由金属形成。通过用基板金属和金属反射板夹住绝缘层(基板绝缘层),能够实现来自基板两侧的散热,而且,能够得到使作为发热体的LED的安装侧的中央部的热相对于周边部而均热化的效果。而且,可以附加地期待从基板绝缘层的两侧压入相互的金属板的效果。
而且,如果用由树脂复合物和无机填充物组成的复合材料来形成基板绝缘层,通过这样的复合材料具有的弹性,能够谋求两方的金属的应力缓和。其结果,能够提高作为在高温高输出下被点亮的照明装置的可靠性。
而且,为了进一步缓和应力,进一步提高可靠性,最好在光学反射板与基板绝缘层之间设置由与这些材料不同的材料构成的应力缓和层。在绝缘层上的布线上形成突起,或者,除了布线之外设置突起用的凸区,由此,在绝缘层与光学反射板之间设置空隙,在该空隙内填充上述未充满和用于LED模铸的树脂(环氧树脂和硅树脂),来缓和应力。当设置这样的应力缓和装置时,即使在由闪烁试验的热冲击所产生的应力被施加的严酷条件下,也能抑制不点亮和可靠性降低。
在光学反射板52的开口部中,由模铸的树脂62形成透镜。从提高散热性的观点出发,光学反射板52最好由铝等的金属板所形成,但是,也可以使用由其他绝缘性材料所形成的板。在此情况下,在开口部的内周壁面的至少一部分(最好全部)设置由反射率比绝缘性板高的材料例如Ni、Al、Pt、Ag、Al等金属或者以这些金属为主要成分的合金形成的反射膜。由此,从LED向侧向射出的光通过反射膜进行适当反射,而能够提高光的利用率。
贴在里面的金属板50的材料并不仅限于铝,也可以是铜。金属板50的里面最好是平坦的,以便于与设在连接器等上的热传导性良好的部件相接触而提高散热性,但是,也可以在里面的一部分上设置用于散热的散热片和线状凹凸。在此情况下,在与金属板50的里面接触的部件的表面上最好设置与散热片和线状凹凸相对应的凹凸形状。在采用使卡型LED照明光源滑动而与连接器相连接的构成的情况下,设在金属板的里面的散热片和线状凹凸最好沿着滑动方向延伸,以免阻碍滑动。在此情况下,当散热片和线状凹凸起到导轨的作用时,得到接触面积增加的效果。
为了提高热传导部件与卡型LED照明光源的热接触,最好采用把热传导部件压紧到卡型LED照明光源上的机构。这样的压紧能够通过具有弹性的供电端子来进行。但是,为了得到充分的压紧力,需要充分加强供电端子的弹性。用于提供与供电端子的电接触而需要的机械压紧力在每个端子50~100g左右的情况下,最好追加提供比其更强的压紧力的压紧装置。作为这样的压紧装置,能够配置对卡型LED照明光源中的供电端子之外的部分进行200g以上的加压的弹性部件。可以设置多个这样的压紧装置。
如果设置上述压紧装置,就不需要使对供电端子的机械压紧过大,因此,能够通过人的手指来容易地进行卡型LED照明光源的装卸。用户在把卡型LED照明光源装到LED照明装置的连接器上之后,可以通过上述压紧装置把卡型LED照明光源的基板背面坚固地压到热传导部件上。通过该压接,卡型LED照明光源成为被锁定到LED照明装置上的状态,能够防止卡型LED照明光源从装置意外拔出的情况。
图14(b)表示处于与连接器相连接的状态下的卡型LED照明光源的端部剖面。在图中,连接器用虚线表示。为了说明方便,图14(b)的卡型LED照明光源记载得薄于图14(a)摄氏度卡型LED照明光源。
如从图14(b)所看到的那样,在多层布线板51的连接器侧的端部上形成供电电极54,供电电极54直接或者通过通孔于布线图形59电连接。多层布线板51中形成供电电极54的区域未被光学反射板52所覆盖,因此,连接器电极56能够容易地于供电电极54接触。
连接器电极56与供电电极54的电连接/非连接能够通过把卡型LED照明光源相对于连接器进行插拔来简单地实现。在卡型LED照明光源插入的连接器侧设置检测卡型LED照明光源的插拔的开关,如果防止卡型LED照明光源未被插入时的通电,就能提高安全性。在此情况下,开关可以设在卡的下表面、侧面以及上表面的任何位置上。
而且,在图13中,图示了从外部看连接器电极56的样子,但是,实际的连接器电极56为图14(b)所示的那样,被设计成不会使人的手指接触。
而且,在本实施例中,在一个基板上分别配置每种16个发出红色(R)、绿色(G)、蓝色(B)和黄色(Y)的光的4种LED裸芯片。基板尺寸为例如长边28.5mm×短边23.5mm×厚度1.3mm,排列了64个LED的矩形区域的尺寸为例如20mm×20mm×厚度1mm。在该例中,配置LED的区域(存在反射板的区域)具有约2cm见方的尺寸的原因是:在低功率的小型电灯泡中,通过提供与一般的小球电灯泡和小型氪灯的灯泡尺寸同等的发光面积,能够与这些现有的低功率电灯泡进行替换。而且,如果是小球电灯泡,用约5W至10W的功率而得到约20至50lm的全光通量,如果是小型氪灯,用约22W至38W的功率而得到约250至500lm的全光通量。
根据本发明人的实验,在使用白色LED的实施例中,在自然空冷下,在室温为25℃的情况下,得到约100~300lm的光通量,用与小型电灯泡同等的发光部尺寸得到同等的光量。而且,在把卡型LED照明光源装入相当于光通量电灯泡的壳体中,而容纳在光通量型的两色卤素灯泡的直径中的情况下,如果使设置反射板的光出射区域(发光区域)的中心于电灯泡的光轴中心相一致,从上述发光部中心到大致方形的卡的长边的端面(供电电极侧)的距离为以下这样:
在直径35mm的情况下:约13mm
在直径40mm的情况下:约15mm
在直径50mm的情况下:约23mm
而且,最好在基板周边部中确保与上述导轨部相接触的平坦部分。而且,为了树脂封装反射板的全体,最好在基板周边部配置不设置LED的区域。这样的区域设在约2cm方形尺寸的光出射区域的两侧,各自的区域的宽度被设定为1~3mm。在把该区域(空白部)设定得较大的情况下,需要缩小从发光部中心到上述端面的距离。
在插卡型的使用形式和设置卡来压紧的类型的使用形式下,在对应于照明器具和灯泡的两方的用途的情况下,把供电电极集中在卡型LED照明光源的一面上,但是,从适合于各种方式的插拔的观点出发,最好配置成反射镜板(光出射区域)从基板的几何中心偏离。
而且,为了有效地进行来自卡型LED照明光源的基板背面的散热,最好把供电电极集中设置在基板的光出射侧的表面上,但是,为了确保于基板背面的宽阔范围的表面上的热传导部件(散热装置)的热接触,不仅进行由供电端子所产生的压接,也进行由其他的压紧装置所产生的压接。在基板主要表面上设置用于进行这样的压紧的空间来作为空白部。
从上述发光部中心到不存在供电电极的基板端面的距离可以设定得短于存在供电电极的侧的距离。如果使该距离于光出射区域两侧的空白部的宽度相一致,例如,当紧密配置成每两边连接4个卡型LED照明光源时,能够用等距离并且尽可能短地设定反射镜板(光出射区域)的间隔。
从以上说明的观点出发,制作从卡型LED照明光源中的光出射区域的中心(发光部中心)到基板端面(供电电极侧的端面)的距离为约16.5mm,从上述发光部中心到基板端面(于供电电极相对的端面)的距离为约12mm的试验品。通过把于供电电极相对侧的空间(宽度)设定为足够大,在反射板(光出射区域)的外侧(基板的空白部)中,能够进行于下层布线层的通孔连接。在此情况下,通过使该部分为部分单层,不使用通孔而通过上下层的导线连接等来取得导通。反之,能够使供电电极侧成为部分单层。而且,仅在基板上的一部分中,进行部分多层化,能够提高布线的跳线的自由度。在此情况下,上述空白部成为有效的空间。
在本实施例中,供电电极,考虑对与连接器电极的接触的机械误差和通孔的制造误差,而设计成具有大致方形的形状,设定成宽0.8mm,长度2.5mm,供电电极间的中心与中心的距离为1.25mm。为了在卡型LED照明光源的基板上,形成尽可能多的独立的电路,最好供电电极的数量更多。在本实施例的构成例中,能够设置16个供电电极。
当为了恒电流驱动用而设置相同数量的正极电极和负极电极时,给蓝、绿(蓝绿)、黄(橙)、红和白分别分配供电电极,由此,设置6个(3路径)的预备端子。
在本实施例中,为了确保供电电极与金属基板之间的最小绝缘距离,把供电电极的边缘与基板端面的距离最小设定为2mm。为了进一步提高该绝缘性,使供电电极之间不是平面而是立体地,由绝缘层形成肋条。
在图15中表示了设在一个卡型LED照明光源中的64个LED裸芯片的相互连接状态的等效电路。在图15中,R(+)代表发出红色光的LED裸芯片的正极,R(-)代表发出红色光的LED裸芯片的负极。对于其他颜色(Y、G、B)也是同样的。
图16是表示LED点亮电路的构成例的方框图。在图示的构成例中,卡型LED照明光源的点亮电路70包括:整流/平滑电路71、降压电路72和恒流电路73。整流/平滑电路71连接在AC100V的电源上,是具有把交流进行直流化的功能的公知电路。而且,电源并不仅限于AC100V,也可以使用DC电源。在使用DC电源的情况下,可以使用电压变换电路(降压·升压电路)来取代组合平滑电路和降压电路的整流/平滑电路71。
降压电路72把直流化的电压降低到适合于LED的发光的电压(例如,18V)上。恒流电路73由用于蓝色、绿色、黄色和红色的LED控制器恒流电路所构成。LED控制器恒流电路具有把供给卡型LED照明光源75中的各色的LED群76的电流调节为恒定值的功能。恒流电路73与LED群76之间的电连接通过把卡型LED照明光源75插入照明装置的连接器中来达到。具体地说,在卡型LED照明光源75的基板上所形成的供电电极通过与连接器内相对应的供电电极相接触,来电气导通。
这样的点亮电路70包含电解电容器作为电路部件的一部分。由于电解电容器的温度在约100℃下寿命显著缩短,则需要把电解电容器附近的温度充分降低到100℃以下。根据本实施例,在卡型LED照明光源75中发生的热经过卡型LED照明光源75的金属板,通过照明装置内的散热部件,从散热装置进行散热,因此,点亮电路的电解电容器附近的温度维持在80℃以下,起到延长点亮电路的寿命的作用。
在本实施例中,为了给蓝色、绿(蓝绿)色、黄(橙)色和红色的各个LED群76进行恒流驱动,而分别提供接地电位。因此,本实施例中的卡LED照明光源75的供电电极数为8个。8个供电电极中的一半作为正极电极,另一半作为负极电极。
下面,参照图17和图18来说明本实施例中的卡型LED照明光源的多层布线图形。图17表示多层布线基板中的上层布线图形的布局,图18表示下层布线图形的布局。
在图17和图18中,在布线图形78上所示的小的圆形区域79表示连接上下布线图形的通孔的位置。而且,在图1 7和图18中,为了简化,在各图中,仅在一处分别表示了标号「78」、「79」,但是,实际上,形成多个布线图形和通孔。
在图17中,在由代表性地表示的虚线围绕的区域85a和85b中安装LED裸芯片。图19(a)和(b)放大表示区域85a和85b。在图19(a)所示的部分中,以倒装(FC)安装形式来安装LED裸芯片。另一方面,在图19(b)所示的部分中,以导线接合(WB)安装形式来安装LED裸芯片。图19(c)表示进行FC安装的LED裸芯片的剖面,图19(d)表示进行WB安装的LED裸芯片的剖面。
在本实施例中,对于发出蓝色或者绿(蓝绿)色的光的LED裸芯片,进行FC安装,对于发出黄(橙)色或者红色光的LED裸芯片,进行WB安装。
发出红色或者黄(橙)色的光(波长相对较长的光)的LED裸芯片(器件)通常形成在包含发光层的层叠构造为GaAs基板上。GaAs基板难于透过红色和黄色光,安装成位于发光层的下方。因此,这样的LED裸芯片不能在面向下的状态下进行安装。
在图19(c)所示的FC安装的情况下,在存在LED裸芯片的发光层的一侧形成n电极和p电极,这些电极与多层布线基板上的布线(上层布线)的连接经过金突起来进行。
而且,在本实施例中,基板上的布线图形在铜箔上进行镀镍,在其上进行镀金来制造。通过把上述铜箔的厚度设定为35μm以下,形成倒装安装所需要的横向尺寸为50μm以下的部分精细图形。通过形成部分精细图形,把基板整个表面的图形设计规则中的线下空间维持为较大的值,能够缩短进行倒装安装的位置上的电极间隔。因此,能够有效地制作布线图形,提高基板的制造成品率。
而且,由于布线图形在基板上离散地存在,在某些条件下,以非电解电镀来形成,在试验品中,镀镍的厚度设定为约6μm,其上形成的镀金的厚度设定为0.6μm。这样,通过把镀金的厚度设定得足够大,能够弥补在与LED裸芯片进行金属接合时产生的金的消耗所产生的接合强度不足。
而且,为了提高在未安装LED裸芯片的区域中的反射率,可以在布线图形和基板表面上配置由反射率高的材料组成的层或部件。
另一方面,在发出蓝色或者绿(蓝绿)色的光(波长相对较短的光)的LED裸芯片中,通常,在蓝宝石基板上形成包含发光层的层叠构造。由于蓝宝石基板透过蓝色和绿色的光,则可以在发光层的下方或上方以任意的配置进行安装。FC安装适合于高密度化,因此,在本实施例中,通过FC安装把蓝色LED裸芯片和绿色LED裸芯片搭载在基板上。在图19(d)所示的WB安装的情况下,在基板背面和LED裸芯片的发光层存在的一侧,分别形成n电极和p电极,p电极经过多层布线基板上的布线(上层布线)和接合导线进行连接。n电极经过导电性膏、突起、金属接合、各向异性导电性粘接剂等,与多层布线基板上的布线(上层布线)进行连接。而且,为了更坚固地连接它们,可以使用未充满材料。
而且,各色的LED的构造和安装形式并不仅限于本实施例中的方案。一个基板上的全部的LED可以以一种安装形式搭载,也可以以三种以上的安装形式搭载。根据采用的LED的构造,以最适当的安装形式搭载各个LED。而且,从提高与器件的接合可靠性的观点出发,至少基板的布线图形的表面由金属形成。为了使对金的金属接合变得确实,最好把金层的厚度设定为0.5μm以上,设定为1μm以上更好。
在同一基板上排列不同种类的LED,或者,以多种安装方法在同一基板上排列LED,在此情况下,发光层的位置随着LED而变化。因此,最好根据由LED的发光位置和发光颜色而产生的色差来优化设在每个LED上的透镜的几何学的形状(焦点位置和开口率)。
参照图17和图18来说明布线的布局。
图17所示的电极80a,80b,80c和80d分别是例如给红色、蓝色、绿色和黄色的各个LED群提供正电位的供电电极。另一方面,电极90a,90b,90c和90d分别是例如给红色、蓝色、绿色和黄色的各个LED群提供负电位(接地电位)的供电电极。
电极80a,80b,80c和80d分别经过通孔与图18所示的布线81a,81b,81c和81d相连接。另一方面,图17所示的电极90a,90b,90c和90d分别经过通孔与图18所示的布线92a,92b,92c和92d相连接。
通过图17和图18所示的多层布线构成,形成与图15的电路实质上相等的电路,但是,布线图形的布局可以是任意的,并不仅限于图17和图18所示的构成。
在本实施例中,在图17的下方所示的区域中把全部的供电电极(正电极和负电极)80a~80d,90a~90d排列成一条直线,由于供电电极集中在基板的一边附近,卡型LED照明光源与连接器的连接变得容易。这样,在每个发出不同颜色的LED群中,地线分离并且使供电电极集中在基板的一边的理由是为了采用上述这样的多层布线构造。
如上述那样,在本实施例中,在卡型LED照明光源的金属板的里面不存在供电电极,金属板里面是平坦的。因此,能够确保该金属板与导热性优良的部件(设在照明装置上)的较大的接触面积,促进从卡型LED照明光源向外部的散热。该接触面积最好具有LED所排列的区域(光出射区域或者LED群区域)的面积以上的大小。
在本实施例中,在一个基板上排列发出不同波长的光的4种LED裸芯片,但是,本发明并不仅限于此。发出的光的颜色(波长频带)可以为1~3种,也可以为5种以上。而且,可以分别使用发出多个光的LED裸芯片和通过添加荧光体而发出白色光的的LED裸芯片。而且,可以不使用发出白色光的LED裸芯片,一般来说,为了发出白光,需要在LED裸芯片的周围覆盖荧光体。在此情况下,如果把荧光体封入由基板和反射板所形成的空间内,能够实现由LED所产生的荧光体激发。取代其,可以把使荧光体分散的片撑在反射板的上表面上。而且,可以用透明的树脂材料与卡型LED照明光源一体地形成使上述荧光体分散的片本身。
实施例4
以下参照图20至图31来说明本发明的LED照明装置的各种实施例。
首先,参照图20。图20表示电灯泡型的LED照明装置。该LED照明装置基本上具有与图3所示的LED照明装置相同的构成,但是,把卡型LED照明光源装入照明装置中的方式不同。图20的LED照明装置是在照明装置本体96中组合透光性盖97来使用,但是,卡型LED照明光源95卸下是在从本体96暂时卸下透光性盖97的状态下来进行的。在本体96的上表面上设置嵌入卡型LED照明光源95的容纳部98,本体96设有从上表面压入容纳部98中所嵌入的卡型LED照明光源95的固定盖99。固定盖99把其一端附近作为转动轴进行支承,以便于进行开闭,具有与卡型LED照明光源95上的供电电极95a相接触的连接器电极99a。该连接器电极99a与本体96内的点亮电路(未图示)相连接。连接器电极99a和容纳部98通过其组合,起到一个「连接器」的作用。
固定盖99具有开放容纳在容纳部98中的卡型LED照明光源95的光出射区域并且压紧供电电极95a和其他的部分的构造。在关闭固定盖99的状态下,卡型LED照明光源95的基板背面与容纳部98热接触。容纳部98的底面由导热性优良的材料(例如,铝等金属材料)所形成。该导热性优良的材料起到散热片的作用,散射由卡型LED照明光源95产生的热,能够抑制过度的升温。
在优选的实施例中,透光性盖97的卸下和固定盖99的开闭构成为:不使用特别的工具,能够用人的手和手指来简单地进行。因此,卡型LED照明光源95的更换(装卸)能够容易地进行。而且,透光性盖97可以具有光扩散层。而且,可以使用有着色材料、荧光材料、磷光材料制作的其他盖板97a来取代透光性盖97。而且,可以采用双面凸透镜97b和光扩散盖板97c。或者,可以采用具有多个透镜和反射材料或者把上述各种光学部件相组合的功能的盖板。
在图20的照明装置中,一个卡型LED照明光源95进行装卸,但是,对一个照明装置进行装卸的卡型LED照明光源的个数可以为多个。图21表示多个卡型LED照明光源所安装的电灯泡型的LED照明装置。卡型LED照明光源通过可以开闭的一对固定盖来进行遮挡、固定。
在图20和图21中,表示了能够与电灯泡型电灯互换的LED照明装置,但是,使用本发明的卡型LED照明光源也可以实现能够与直管荧光灯和环形荧光灯互换的LED照明光源。如果制作具有与直管荧光灯和环形荧光灯相同的形态的LED照明光源,对于现有的装置,可以安装使用本发明的LED照明光源来取代直管或环形的荧光灯。
图22表示立式LED照明装置。在图22所示的照明装置本体96中设置用于容纳卡型LED照明光源95的容纳部98。该容纳部98具有导轨,进行引导以使卡型LED照明光源95滑动。如果把设有供电电极95a的部分作为顶端,把卡型LED照明光源95插入照明装置的容纳部98中,就能在卡型LED照明光源95安装的状态下,完成供电电极95a与连接器电极的连接。所安装的卡型LED照明光源95通过摩擦力进行固定,不会意外脱落。而且,由于卡型LED照明光源95的基板背面与容纳部98热接触,则该接触部分最好有导热性优良的材料形成。
在图22的立式照明装置中,一个卡型LED照明光源95进行装卸,但是,对一个照明装置进行装卸的卡型LED照明光源的个数可以有多个。图23表示两个卡型LED照明光源进行装卸的构成的立式LED照明装置。
图24表示立式LED照明装置的另一个实施例。在该LED照明装置中,采用图21所示类型的连接器。卡型LED照明光源通过固定盖而固定在照明装置上。该固定盖的开闭可以用人的手指简单地执行。
图25表示作为手电筒和钢笔型手电筒的便携式LED照明装置。在该照明装置中设有用于装卸卡型LED照明光源95的槽100。但是,卡型LED照明光源95的装卸可以采用不设置槽来完成的构成。图25的LED照明装置可以用干电池和充电电池来使卡型LED照明光源动作,具有能够手持移动的构成。
图26表示置换为使用现有的直管荧光灯的照明装置的LED照明装置。在该LED照明装置的本体101中设置能够装卸多个卡型LED照明光源95的连接器,经过本体101的槽100来进行卡型LED照明光源95的装卸。
图26的照明光源不是能够与直管荧光灯互换的LED光源,而是能够与使用直管荧光灯的立式照明装置互换的LED照明光源。
图27表示置换为使用现有的环形荧光灯的照明装置的LED照明装置。在LED照明装置的本体102中,设置能够装卸多个卡型LED照明光源95的连接器,经过本体102的槽100来进行卡型LED照明光源95的装卸。
图28表示向下照光型的LED照明装置。本发明的LED照明装置容易薄型化,因此,容易作为向下照光而配置在房间和车辆的顶棚上。
图29表示光轴可变型的LED照明装置。通过把安装卡型LED照明光源的部分以特定轴为中心旋转任意角度,能够容易地把光出射方向设定到所希望的方位上。
图30表示卡型LED照明装置。采用纽扣电池等薄型电池作为电源,而把照明装置本身薄型化。这样的LED照明装置通过薄型·轻量化,容易携带。
图31表示钥匙环型的LED照明装置。该LED照明装置用纽扣电池等薄型电池来工作,能够小型轻量化,因此,便于手持移动。
以上参照图20至图31来说明了本发明的LED照明装置的各种实施例,但是,本发明的实施例并不仅限于此,能够采用多种形态。
如上述实施例的说明所看到的那样,对于一个照明装置使用一个或者多个卡型LED照明光源来设计各种照明装置,在此情况下,标准化的预定卡型LED照明光源容易普及。例如,在图21的照明装置的情况下,与使用一个大面积的卡型LED照明光源相比,对于图20的照明装置,可以原样使用多个可以装卸的卡型LED照明光源来构成。这样,通过卡型LED照明光源的批量生产效果,能够得到容易降低单件的价格的重要的效果。而且,当随着照明装置的种类和生产商的不同而使可以使用的卡型LED照明光源不同时,互换性变差,用户的不满强烈,因此,对于卡型LED照明光源的主要部分,最好具有标准化的功能和尺寸。
而且,在上述实施例中的卡型LED照明光源中,都使用了安装LED裸芯片的方案,但是,也可以采用形成有机EL膜的卡型LED照明光源。本说明书中的「在基板的一面上安装LED的可装卸的卡型LED照明光源」广泛地包含在散热基板上设置有机EL的卡型LED照明光源。
如上述那样,本发明的LED照明装置通过使用卡型LED照明光源作为能够简单地装卸的部件,能够延长作为照明装置的寿命,与现有的照明装置互换。在这样的LED照明装置中最好使用图12所示的构成的卡型LED照明光源,但是,用于本发明的LED照明装置的卡型LED照明光源并不仅限于上述实施例。
这样,作为在本发明的LED照明装置中装卸的卡型LED照明光源,能够采用具有各种构成的方案,并不仅限于参照附图而说明的卡型LED照明光源的实施例。
而且,本发明的卡型LED照明光源可以用于照明装置之外的装置中。例如,可以使用与照明装置同样需要亮度高的光的出射的设备和其他装置的光源部分的本发明这样的可装卸的卡型LED照明光源。
而且,可以在基板上接合LED裸芯片被模铸状态下的LED器件(最好是面安装型的),来取代在基板上直接安装LED裸芯片。在此情况下,在LED被模铸的状态下分别被制作,因此,与直接安装LED裸芯片的情况相比,基板与LED裸芯片之间的热阻变高。但是,如果采用上述基板构成,即使在把LED器件设置在基板上的情况下,也能实现优于现有技术的散热性,能够提高LED器件集成时的散热性。
产业上的利用可能性
本发明的LED照明装置和卡型LED光源具有与可装卸的卡型LED光源相连接的连接器和与其对应的供电电极。而且,LED照明装置设有点亮电路,卡型LED光源设有金属基板和多个LED,基板背面的金属基板表面与照明装置的一部分热接触。
此时,在金属基板上设置兼用做封装树脂透镜、光学反射板和散热器的带孔金属板,每个上述反射板在基板上封住LED。
而且,LED裸芯片直接安装在基板上,基板的布线层具有多层,并且,在一面的一边上具有多个供电端子。而且,在优选的实施例中,供电端子具有多个接地电极。
根据本发明的LED照明装置,通过由可装卸的卡状构造物来构成光源部分,而提高了使光源中的各个LED器件产生的热被平滑地散热的效果,同时,可以仅把寿命终结的光源更换为新的光源,由此,能够长期使用照明装置的光源之外的构造体。
根据本发明的卡型LED照明光源,能够同时实现LED器件的高密度化、良好的散热性和发生的光的利用效率的提高,能够实现卡型LED照明光源的实用化。
Claims (30)
1.一种LED照明装置,包括:
连接到在基板的一面上安装了LED的可装卸的卡型LED照明光源上的至少一个连接器;和
经过所述连接器与所述卡型LED照明光源电连接的点亮电路。
2.根据权利要求1所述的LED照明装置,其特征在于,所述基板是在所述LED所安装的表面上设置绝缘层和导电性布线图形的金属基板。
3.根据权利要求2所述的LED照明装置,其特征在于,所述LED在裸芯片状态下安装到所述基板上。
4.根据权利要求3所述的LED照明装置,其特征在于,
在所述基板中安装了所述LED的基板表面的一端侧形成供电电极,
所述基板中安装有所述LED的光出射区域的中心位置偏离所述基板的中心位置。
5.根据权利要求4所述的LED照明装置,其特征在于,设有与所述基板上未安装所述LED的基板背面热接触,并从所述基板背面吸取热的热传导部件。
6.根据权利要求5所述的LED照明装置,其特征在于,所述基板背面与所述热传导部件之间的接触面积大于或等于所述基板上安装所述LED的光出射区域的面积。
7.根据权利要求1至6中任一项所述的LED照明装置,其特征在于,进一步具有用于从外部向所述点亮电路供给电能的供电插座。
8.根据权利要求7所述的LED照明装置,其特征在于,所述供电插座是电灯泡用灯口。
9.根据权利要求8所述的LED照明装置,其特征在于,设有透过从与所述连接器连接的状态的所述卡型LED照明光源所发出的光的盖子。
10.根据权利要求1至6中任一项所述的LED照明装置,其特征在于,包括:
能够实现所述卡型LED照明光源的固定和卸下的容纳部;和
防止所述卡型LED从所述容纳部脱落的防脱落装置,
所述防脱落装置能够这样动作:通过人的手指从所述容纳部卸下所述卡型LED照明光源。
11.根据权利要求10所述的LED照明装置,其特征在于,
所述基板中安装有所述LED的基板面的形状为长方形,
所述容纳部具有进行引导的导轨,以便于使所述卡型LED照明光源滑动,
固定在所述容纳部中的所述卡型LED照明光源接受来自所述连接器的供电的同时,所述卡型LED照明光源的所述基板背面与所述容纳部热接触。
12.根据权利要求10所述的LED照明装置,其特征在于,
设有具有把所述卡型LED照明光源固定在所述容纳部中的固定部的动作机构,
固定在所述容纳部中的所述卡型LED照明光源接受来自所述连接器的供电的同时,所述卡型LED照明光源的所述基板背面与所述容纳部热接触。
13.根据权利要求1至7中任一项所述的LED照明装置,其特征在于,所述卡型LED照明光源的未安装LED的基板背面与所述LED之间的热阻为10℃/W以下。
14.根据权利要求1至6中任一项所述的LED照明装置,其特征在于,设有使来自所述基板中未安装所述LED的基板背面的热进行散热的装置。
15.一种卡型LED照明光源,包括:金属基板、安装在所述金属基板的一面上的多个LED裸芯片,其特征在于,
可装卸地受到具有连接器和点亮电路的照明装置的支承并且所述金属基板中未安装所述LED裸芯片的基板背面与所述照明装置的一部分热接触,
在所述金属基板中安装了所述LED裸芯片的所述基板一面上设置供电端子。
16.根据权利要求15所述的卡型LED照明光源,其特征在于,在所述金属基板中安装了所述LED裸芯片的基板面上,设置有开设有包围各个LED裸芯片的孔的光学反射板,并且,各个LED裸芯片被密封。
17.根据权利要求16所述的卡型LED照明光源,其特征在于,在所述光学反射板的所述孔中配置有光学透镜。
18.根据权利要求16所述的卡型LED照明光源,其特征在于,在所述金属基板与所述光学反射板之间配置有应力缓和装置。
19.根据权利要求16所述的卡型LED照明光源,其特征在于,所述金属基板的中心位置从所述金属基板中安装有所述LED裸芯片的光出射区域的中心位置偏离。
20.根据权利要求16所述的卡型LED照明光源,其特征在于,所述金属基板中未安装所述LED裸芯片的基板背面与所述LED裸芯片之间的热阻为10℃/W以下。
21.根据权利要求14至20中任一项所述的卡型LED照明光源,其特征在于,
在所述金属基板中安装有所述LED裸芯片的基板面上形成有绝缘层和导电性布线图形,
所述绝缘层由至少包含无机填料和树脂组合物的复合材料所形成。
22.根据权利要求21所述的卡型LED照明光源,其特征在于,所述绝缘层是白色的。
23.根据权利要求21所述的卡型LED照明光源,其特征在于,设有经过绝缘层而层叠的2层以上的布线层,具有在所述绝缘层的规定位置上相互连接所述两层以上的布线层的构造。
24.根据权利要求15至20中任一项所述的卡型LED照明光源,其特征在于,所述多个LED裸芯片的至少一部分,通过倒装接合而连接在所述金属基板的布线图形上。
25.根据权利要求15至20中任一项所述的卡型LED照明光源,其特征在于,在所述金属基板上设有接受从所述LED裸芯片发出的光的至少一部分而发出可见光的荧光体。
26.一种装置,其特征在于,具有给权利要求15至20中任一项所述的卡型LED照明光源供电的连接器。
27.一种卡型LED照明光源,在散热基板上设置有分别在器件基板上具有发光部的多个LED裸芯片,其特征在于,
所述LED裸芯片设置在所述散热基板上,并使所述发光部与所述散热基板之间的距离小于所述器件基板与所述散热基板之间的距离,
所述LED裸芯片的所述器件基板的光出射表面,形成为边缘部低于中央部的倾斜面形状。
28.根据权利要求27所述的卡型LED照明光源,其特征在于,所述LED裸芯片直接倒装接合在所述散热基板上。
29.根据权利要求27或28所述的卡型LED照明光源,其特征在于,所述散热基板是复合基板。
30.根据权利要求28所述的卡型LED照明光源,其特征在于,在所述散热基板上设置有配置成分别包围所述LED裸芯片从而控制来自所述LED裸芯片的光的方向的光学反射板。
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US6407411B1 (en) * | 2000-04-13 | 2002-06-18 | General Electric Company | Led lead frame assembly |
JP2001338505A (ja) * | 2000-05-26 | 2001-12-07 | Matsushita Electric Works Ltd | 照明装置 |
US6891200B2 (en) * | 2001-01-25 | 2005-05-10 | Matsushita Electric Industrial Co., Ltd. | Light-emitting unit, light-emitting unit assembly, and lighting apparatus produced using a plurality of light-emitting units |
US6791119B2 (en) * | 2001-02-01 | 2004-09-14 | Cree, Inc. | Light emitting diodes including modifications for light extraction |
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JP3968226B2 (ja) * | 2001-09-20 | 2007-08-29 | 松下電器産業株式会社 | 発光ユニット用ジョイント基板 |
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2002
- 2002-08-08 EP EP16169274.4A patent/EP3078899B1/en not_active Expired - Lifetime
- 2002-08-08 CN CN02802577A patent/CN1464953A/zh active Pending
- 2002-08-08 WO PCT/JP2002/008151 patent/WO2003016782A1/ja active Application Filing
- 2002-08-08 EP EP02755890.7A patent/EP1416219B1/en not_active Expired - Lifetime
- 2002-08-08 CN CNB2006101320163A patent/CN100504146C/zh not_active Expired - Fee Related
- 2002-08-08 TW TW091117913A patent/TW567619B/zh not_active IP Right Cessation
-
2003
- 2003-02-26 US US10/374,614 patent/US6949772B2/en not_active Expired - Lifetime
-
2005
- 2005-05-09 US US11/125,392 patent/US7375381B2/en not_active Expired - Fee Related
- 2005-06-22 US US11/158,646 patent/US7259403B2/en not_active Expired - Fee Related
- 2005-06-22 US US11/158,836 patent/US7045828B2/en not_active Expired - Lifetime
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2006
- 2006-03-30 US US11/277,952 patent/US7250637B2/en not_active Expired - Lifetime
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2007
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Also Published As
Publication number | Publication date |
---|---|
EP3078899A1 (en) | 2016-10-12 |
CN100504146C (zh) | 2009-06-24 |
US20060160409A1 (en) | 2006-07-20 |
US7375381B2 (en) | 2008-05-20 |
US20050242362A1 (en) | 2005-11-03 |
US20030189829A1 (en) | 2003-10-09 |
US7045828B2 (en) | 2006-05-16 |
CN1975239A (zh) | 2007-06-06 |
TW567619B (en) | 2003-12-21 |
US7259403B2 (en) | 2007-08-21 |
US20050207165A1 (en) | 2005-09-22 |
US7250637B2 (en) | 2007-07-31 |
US20070187708A1 (en) | 2007-08-16 |
EP1416219B1 (en) | 2016-06-22 |
WO2003016782A1 (en) | 2003-02-27 |
EP1416219A4 (en) | 2009-06-17 |
EP1416219A1 (en) | 2004-05-06 |
EP3078899B1 (en) | 2020-02-12 |
US20050237747A1 (en) | 2005-10-27 |
US6949772B2 (en) | 2005-09-27 |
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