JP4180576B2 - Led照明装置およびカード型led照明光源 - Google Patents
Led照明装置およびカード型led照明光源 Download PDFInfo
- Publication number
- JP4180576B2 JP4180576B2 JP2005088767A JP2005088767A JP4180576B2 JP 4180576 B2 JP4180576 B2 JP 4180576B2 JP 2005088767 A JP2005088767 A JP 2005088767A JP 2005088767 A JP2005088767 A JP 2005088767A JP 4180576 B2 JP4180576 B2 JP 4180576B2
- Authority
- JP
- Japan
- Prior art keywords
- led
- light source
- substrate
- illumination light
- card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S6/00—Lighting devices intended to be free-standing
- F21S6/002—Table lamps, e.g. for ambient lighting
- F21S6/003—Table lamps, e.g. for ambient lighting for task lighting, e.g. for reading or desk work, e.g. angle poise lamps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21L—LIGHTING DEVICES OR SYSTEMS THEREOF, BEING PORTABLE OR SPECIALLY ADAPTED FOR TRANSPORTATION
- F21L4/00—Electric lighting devices with self-contained electric batteries or cells
- F21L4/02—Electric lighting devices with self-contained electric batteries or cells characterised by the provision of two or more light sources
- F21L4/022—Pocket lamps
- F21L4/027—Pocket lamps the light sources being a LED
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S6/00—Lighting devices intended to be free-standing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Description
図3(a)は、本発明によるLED照明装置の一部を示す斜視図であり、着脱可能な複数のカード型LED照明光源10が嵌め込まれるヒートシンク19を示している。
次に、本発明によるカード型LED照明光源の実施形態を説明する。
次に、本発明によるカード型LED照明光源の他の実施形態を説明する。
以下、図20から図31を参照しながら、本発明によるLED照明装置の種々の実施形態を説明する。
1a 配線パターン
1b 金属板
1c 絶縁層
1d 配線パターン
1e 絶縁層
2 LEDベアチップ
3 光学反射板
3a 反射面
3b 光学反射板の孔(開口部)
4 樹脂
10 カード型LED照明光源
11 LEDの素子基板
12 GaN系のn型半導体層
13 活性層
14 p型半導体層
15 発光部
16 バンプ
19 ヒートシンク
20 アダプタ
21 基板
21a 配線パターン
22 LEDベアチップ
23 板
23a 板23の反射面
23b 板23の孔(開口部)
24 樹脂(モールド樹脂)
31 素子基板
32 n型半導体層
33 活性層
34 p型半導体層
34a 電極
41 金製のワイヤ
42 金製のワイヤ
50 金属板
51 多層配線基板
52 金属製光学反射板
53 LED
54 給電電極
55 コネクタ本体
56 コネクタ電極
57 金属プレート(底板)
58 配線コード
59 配線パターン
60 アンダーフィル
61 Auバンプ
62 樹脂
63 ビア
Claims (3)
- 無機フィラーと樹脂組成物とを含むコンポジット材料から形成されている絶縁層を含む配線基板が形成されている金属ベース基板と、
前記配線基板の裏面に接触する金属ベース基板と、
前記配線基板の上に設けられた配線パターンと、
前記配線パターンに接続され、かつ、前記配線基板に実装された複数のLEDベアチップと、
前記金属ベース基板のうち前記LEDベアチップが実装されている前記配線基板の面に設けられた金属製の光学反射板と、
前記配線基板と前記光学反射板との間に配置された応力緩和手段と、
を備えたLED照明光源。 - 前記LEDベアチップは、フリップチップボンディングにより、前記金属ベース基板の配線パターンに実装されている、請求項1に記載のLED照明光源。
- 前記LEDベアチップは、面実装素子またはチップ型素子として組み込まれる、請求項1に記載のLED照明光源。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005088767A JP4180576B2 (ja) | 2001-08-09 | 2005-03-25 | Led照明装置およびカード型led照明光源 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001242857 | 2001-08-09 | ||
JP2005088767A JP4180576B2 (ja) | 2001-08-09 | 2005-03-25 | Led照明装置およびカード型led照明光源 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002231765A Division JP3989794B2 (ja) | 2001-08-09 | 2002-08-08 | Led照明装置およびled照明光源 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006274596A Division JP2007059930A (ja) | 2001-08-09 | 2006-10-06 | Led照明装置およびカード型led照明光源 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005235778A JP2005235778A (ja) | 2005-09-02 |
JP2005235778A5 JP2005235778A5 (ja) | 2006-11-24 |
JP4180576B2 true JP4180576B2 (ja) | 2008-11-12 |
Family
ID=35018455
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005088767A Expired - Fee Related JP4180576B2 (ja) | 2001-08-09 | 2005-03-25 | Led照明装置およびカード型led照明光源 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4180576B2 (ja) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7821023B2 (en) * | 2005-01-10 | 2010-10-26 | Cree, Inc. | Solid state lighting component |
KR20070045462A (ko) | 2005-10-27 | 2007-05-02 | 엘지이노텍 주식회사 | 발광 다이오드 패키지 |
JP2007180234A (ja) * | 2005-12-27 | 2007-07-12 | Matsushita Electric Ind Co Ltd | 発光光源及び照明器具 |
JP2007220830A (ja) * | 2006-02-15 | 2007-08-30 | Matsushita Electric Ind Co Ltd | 発光モジュールとこれを用いた表示装置及び照明装置 |
JP4539581B2 (ja) * | 2006-02-21 | 2010-09-08 | 株式会社島津製作所 | ランプ装置 |
DE102007004303A1 (de) | 2006-08-04 | 2008-02-07 | Osram Opto Semiconductors Gmbh | Dünnfilm-Halbleiterbauelement und Bauelement-Verbund |
DE102007004304A1 (de) | 2007-01-29 | 2008-07-31 | Osram Opto Semiconductors Gmbh | Dünnfilm-Leuchtdioden-Chip und Verfahren zur Herstellung eines Dünnfilm-Leuchtdioden-Chips |
JP5063187B2 (ja) * | 2007-05-23 | 2012-10-31 | シャープ株式会社 | 照明装置 |
WO2008146694A1 (ja) | 2007-05-23 | 2008-12-04 | Sharp Kabushiki Kaisha | 照明装置 |
JP2008295534A (ja) * | 2007-05-29 | 2008-12-11 | Sanyo Electric Co Ltd | ショーケース |
CN101469845B (zh) * | 2007-12-29 | 2011-08-24 | 富士迈半导体精密工业(上海)有限公司 | 照明装置及其电源模组以及使用该照明装置的灯具 |
US7866850B2 (en) * | 2008-02-26 | 2011-01-11 | Journée Lighting, Inc. | Light fixture assembly and LED assembly |
JP5078666B2 (ja) * | 2008-02-26 | 2012-11-21 | 京セラ株式会社 | セラミック基板とアルミニウム基板との接合方法、および発光素子実装体 |
JP5330889B2 (ja) * | 2009-04-14 | 2013-10-30 | 電気化学工業株式会社 | 照明用ledモジュール |
JP2010262742A (ja) * | 2009-04-30 | 2010-11-18 | Kowa Co | Led照明装置 |
EP2484966A1 (en) * | 2009-09-30 | 2012-08-08 | Panasonic Corporation | Illumination device |
JP5499660B2 (ja) * | 2009-11-26 | 2014-05-21 | 東芝ライテック株式会社 | 照明器具 |
JP2012089357A (ja) * | 2010-10-20 | 2012-05-10 | Sumitomo Light Metal Ind Ltd | Led照明基板用積層体及びそれを用いたled照明 |
US9565782B2 (en) | 2013-02-15 | 2017-02-07 | Ecosense Lighting Inc. | Field replaceable power supply cartridge |
JP6335638B2 (ja) * | 2014-05-21 | 2018-05-30 | シチズン電子株式会社 | 放熱基板、その製造方法及びその放熱基板を利用したled発光装置 |
US10477636B1 (en) | 2014-10-28 | 2019-11-12 | Ecosense Lighting Inc. | Lighting systems having multiple light sources |
US9869450B2 (en) | 2015-02-09 | 2018-01-16 | Ecosense Lighting Inc. | Lighting systems having a truncated parabolic- or hyperbolic-conical light reflector, or a total internal reflection lens; and having another light reflector |
US11306897B2 (en) | 2015-02-09 | 2022-04-19 | Ecosense Lighting Inc. | Lighting systems generating partially-collimated light emissions |
US9746159B1 (en) | 2015-03-03 | 2017-08-29 | Ecosense Lighting Inc. | Lighting system having a sealing system |
US9568665B2 (en) | 2015-03-03 | 2017-02-14 | Ecosense Lighting Inc. | Lighting systems including lens modules for selectable light distribution |
US9651227B2 (en) | 2015-03-03 | 2017-05-16 | Ecosense Lighting Inc. | Low-profile lighting system having pivotable lighting enclosure |
US9651216B2 (en) | 2015-03-03 | 2017-05-16 | Ecosense Lighting Inc. | Lighting systems including asymmetric lens modules for selectable light distribution |
USD785218S1 (en) | 2015-07-06 | 2017-04-25 | Ecosense Lighting Inc. | LED luminaire having a mounting system |
USD782093S1 (en) | 2015-07-20 | 2017-03-21 | Ecosense Lighting Inc. | LED luminaire having a mounting system |
USD782094S1 (en) | 2015-07-20 | 2017-03-21 | Ecosense Lighting Inc. | LED luminaire having a mounting system |
US9651232B1 (en) | 2015-08-03 | 2017-05-16 | Ecosense Lighting Inc. | Lighting system having a mounting device |
CN110504349A (zh) * | 2018-05-18 | 2019-11-26 | 深圳市聚飞光电股份有限公司 | Led器件及发光装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11168235A (ja) * | 1997-12-05 | 1999-06-22 | Toyoda Gosei Co Ltd | 発光ダイオード |
JP3708319B2 (ja) * | 1998-02-03 | 2005-10-19 | 松下電器産業株式会社 | 半導体発光装置 |
JP2000235808A (ja) * | 1999-02-15 | 2000-08-29 | Matsushita Electric Works Ltd | 光源装置 |
JP2001168398A (ja) * | 1999-12-13 | 2001-06-22 | Nichia Chem Ind Ltd | 発光ダイオード及び製造方法 |
-
2005
- 2005-03-25 JP JP2005088767A patent/JP4180576B2/ja not_active Expired - Fee Related
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Publication number | Publication date |
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JP2005235778A (ja) | 2005-09-02 |
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