CN101846247B - 具有led的照明器具 - Google Patents
具有led的照明器具 Download PDFInfo
- Publication number
- CN101846247B CN101846247B CN201010105402XA CN201010105402A CN101846247B CN 101846247 B CN101846247 B CN 101846247B CN 201010105402X A CN201010105402X A CN 201010105402XA CN 201010105402 A CN201010105402 A CN 201010105402A CN 101846247 B CN101846247 B CN 101846247B
- Authority
- CN
- China
- Prior art keywords
- led chip
- main body
- led
- light
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
- F21S8/04—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
- F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
Description
钎焊 | 直接结合 | |
结合面积 | 60%-80% | 大致为100% |
结合强度 | 98N/mm2或更大 | 127N/mm2或更大 |
剪切强度 | 98N/mm2 | 127N//mm2 |
结合部分 | 其上可能残留焊剂 |
银焊 | 直接结合 | |
导热率【W/m·K】 | 185.4 | 211.8 |
Claims (9)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005371116A JP3998027B2 (ja) | 2005-07-25 | 2005-12-22 | Ledを用いた照明器具 |
JP2005-371116 | 2005-12-22 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006800485379A Division CN101346584B (zh) | 2005-12-22 | 2006-12-21 | 具有led的照明器具 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101846247A CN101846247A (zh) | 2010-09-29 |
CN101846247B true CN101846247B (zh) | 2013-04-17 |
Family
ID=38188694
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010101054053A Expired - Fee Related CN101852349B (zh) | 2005-12-22 | 2006-12-21 | 具有led的照明器具 |
CN2006800485379A Expired - Fee Related CN101346584B (zh) | 2005-12-22 | 2006-12-21 | 具有led的照明器具 |
CN201010105402XA Expired - Fee Related CN101846247B (zh) | 2005-12-22 | 2006-12-21 | 具有led的照明器具 |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010101054053A Expired - Fee Related CN101852349B (zh) | 2005-12-22 | 2006-12-21 | 具有led的照明器具 |
CN2006800485379A Expired - Fee Related CN101346584B (zh) | 2005-12-22 | 2006-12-21 | 具有led的照明器具 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8070316B2 (zh) |
EP (1) | EP1965128B1 (zh) |
KR (1) | KR100997946B1 (zh) |
CN (3) | CN101852349B (zh) |
WO (1) | WO2007072919A1 (zh) |
Families Citing this family (83)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2630477C (en) * | 2007-05-04 | 2010-12-14 | Abl Ip Holding Llc | Adjustable light distribution system |
JP5132234B2 (ja) * | 2007-09-25 | 2013-01-30 | 三洋電機株式会社 | 発光モジュール |
DE102007046969B3 (de) * | 2007-09-28 | 2009-04-02 | Siemens Ag | Elektronische Schaltung aus Teilschaltungen und Verfahren zu deren Herstellung und demgemäßer Umrichter oder Schalter |
WO2009054177A1 (ja) * | 2007-10-24 | 2009-04-30 | Sharp Kabushiki Kaisha | 表示装置用照明装置、表示装置、テレビ受信装置 |
WO2009082011A1 (ja) * | 2007-12-26 | 2009-07-02 | Kyocera Corporation | 発光装置および照明装置 |
JP5113573B2 (ja) * | 2008-03-24 | 2013-01-09 | パナソニック株式会社 | Led照明装置 |
JP5665160B2 (ja) * | 2008-03-26 | 2015-02-04 | パナソニックIpマネジメント株式会社 | 発光装置および照明器具 |
US8083372B2 (en) * | 2008-04-25 | 2011-12-27 | Epson Imaging Devices Corporation | Illumination system, electro-optic device, and electronic apparatus |
CN103443937A (zh) * | 2008-04-30 | 2013-12-11 | 浙江迈勒斯照明有限公司 | 白光发光二极管及白光发光二极管灯 |
JP5187746B2 (ja) * | 2008-06-10 | 2013-04-24 | Necライティング株式会社 | 発光装置 |
DE102008039364A1 (de) * | 2008-08-22 | 2010-03-04 | Osram Gesellschaft mit beschränkter Haftung | Halbleiter-Leuchtvorrichtung |
US8182107B2 (en) * | 2008-08-24 | 2012-05-22 | Led Transformations, Llc | LED luminaire made with recycled materials |
DE102008054233A1 (de) | 2008-10-31 | 2010-05-06 | Osram Opto Semiconductors Gmbh | Leuchtmodul |
DE102008057140A1 (de) * | 2008-11-13 | 2010-05-20 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
DE102008059468A1 (de) * | 2008-11-28 | 2010-06-24 | Osram Opto Semiconductors Gmbh | Optoelektronische Lampe |
JP5327489B2 (ja) * | 2009-02-20 | 2013-10-30 | キューエムシー カンパニー リミテッド | エルイーディーチップテスト装置 |
EP2421062A4 (en) | 2009-04-13 | 2013-08-28 | Panasonic Corp | ELECTROLUMINESCENT DIODE UNIT |
RU2464489C2 (ru) * | 2009-04-27 | 2012-10-20 | Общество с ограниченной ответственностью "ДиС ПЛЮС" | Светодиодное осветительное устройство и узел источников излучения для этого устройства |
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Also Published As
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EP1965128B1 (en) | 2016-08-17 |
US8070316B2 (en) | 2011-12-06 |
CN101346584A (zh) | 2009-01-14 |
KR20080083006A (ko) | 2008-09-12 |
EP1965128A4 (en) | 2013-05-15 |
CN101346584B (zh) | 2012-03-28 |
WO2007072919A1 (ja) | 2007-06-28 |
US20090046456A1 (en) | 2009-02-19 |
CN101852349B (zh) | 2012-08-29 |
CN101846247A (zh) | 2010-09-29 |
KR100997946B1 (ko) | 2010-12-02 |
CN101852349A (zh) | 2010-10-06 |
EP1965128A1 (en) | 2008-09-03 |
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