JP6832658B2 - 光透過基板、表示装置、信号装置、および、照明装置 - Google Patents
光透過基板、表示装置、信号装置、および、照明装置 Download PDFInfo
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- G09F13/10—Signs, boards or panels, illuminated from behind the insignia using both translucent and non-translucent layers using transparencies
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
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- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/0137—Materials
- H05K2201/0162—Silicon containing polymer, e.g. silicone
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
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Description
<第1の実施形態>
第1の実施形態の光透過基板について説明する。この光透過基板は、装置の内部から外部に向かって光を発する装置や、少なくとも最表面を光が通過する透明体や鏡等の物体、の最表面に配置され、表面に付着する水分を蒸発させたり、雪を融かしたりする機能を有する。
第2の実施形態の光透過基板について説明する。
第1および第2の実施形態の光透過基板は、表示装置や、信号装置や、照明装置の最表面に配置することができる。これにより、これらの装置に付着した雪や水分を蒸発等させることができる。このとき、光透過基板は、導電体パターン43が配置されている面とは逆側の面を外部に向けて配置されていることが好ましい。
また、図18のように、第1の実施形態の光透過基板101と、第2の実施形態の発光素子30が搭載された光透過基板102を、導電体パターン43が形成された面が向かい合うように対向配置することにより表示装置を構成することができる。このとき、発光素子30の光出射方向は、光透過基板101に向くようにし、外部側の光透過基板101を透過させて、光を外部に出射させる。なお、図18のように、光透過基板101の発光素子30と向かい合う領域には、導電体パターン43が配置されないように、もしくは光が透過できる領域を設けて設計することが望ましい。
Claims (17)
- 少なくとも所定の波長の光を透過する基板と、前記基板に配置された、電流を供給されることより発熱して前記基板の表面の温度を上昇させる導電体パターンとを有し、
前記導電体パターンは、接着層を介することなく前記基板に直接配置され、
前記基板の前記導電体パターンが配置されている面には、発光素子がさらに搭載され、
前記発光素子は、前記導電体パターンに接続され、前記導電体パターンを介して電流を供給されて発光し、
前記導電体パターンは、前記発光素子の発する熱を伝導することにより、前記発光素子から離れた位置の前記基板の温度を上昇させることを特徴とする光透過基板。 - 請求項1に記載の光透過基板であって、前記発光素子は、発光面を有し、前記発光面を前記基板側に向けて前記基板に搭載され、前記発光面から発せられた光は、前記基板を透過して外部に出射されることを特徴とする光透過基板。
- 請求項1または2に記載の光透過基板であって、前記導電体パターンを構成する導電体は、多孔質であることを特徴とする光透過基板。
- 請求項1ないし3のいずれか1項に記載の光透過基板であって、前記導電体パターンと前記基板との界面において、前記導電体パターンを構成する導電体は、前記基板に固着していることを特徴とする光透過基板。
- 請求項1ないし4のいずれか1項に記載の光透過基板であって、前記導電体パターンを構成する導電体は、導電性粒子を焼結したものであることを特徴とする光透過基板。
- 請求項5に記載の光透過基板であって、前記導電体パターンを構成する導電体は、前記導電性粒子を前記基板に搭載した状態で光によって焼結したものであることを特徴とする光透過基板。
- 請求項1ないし6のいずれか1項に記載の光透過基板であって、前記基板は、樹脂からなることを特徴とする光透過基板。
- 請求項1ないし7のいずれか1項に記載の光透過基板であって、前記基板および前記導電体パターンは、フレキシブルであることを特徴とする光透過基板。
- 請求項1ないし8のいずれか1項に記載の光透過基板であって、前記導電体パターンは、幅および高さの少なくとも一方が、他の領域よりも狭められたまたは広げられた領域を有することを特徴とする光透過基板。
- 請求項1ないし9のいずれか1項に記載の光透過基板であって、前記導電体パターンは、他の領域とは異なる導電体材料で構成された領域を有することを特徴とする光透過基板。
- 請求項1ないし10のいずれか1項に記載の光透過基板であって、前記基板は前記所定の波長の光を透過する基材と、前記基材に分散されたフィラーとを含み、前記フィラーは、前記基材よりも熱伝導率が大きいことを特徴とする光透過基板。
- 請求項1ないし11のいずれか1項に記載の光透過基板であって、前記導電体パターンの少なくとも一部は、前記基板に接していない面が、湾曲面であることを特徴とする光透過基板。
- 請求項1ないし12のいずれか1項に記載の光透過基板を最表面に備える表示装置。
- 請求項13に記載の表示装置であって、前記光透過基板は、前記導電体パターンが配置されている面とは逆側の面を外部に向けて配置されていることを特徴とする表示装置。
- 第1光透過基板と、第2光透過基板とを有し、
前記第1光透過基板は、少なくとも所定の波長の光を透過する第1基板と、前記第1基板に配置された、電流を供給されることより発熱して前記第1基板の表面の温度を上昇させる第1導電体パターンとを有し、前記第1導電体パターンは、接着層を介することなく前記第1基板に直接配置され、
前記第2光透過基板は、少なくとも所定の波長の光を透過する第2基板と、前記第2基板に配置された、電流を供給されることより発熱して前記第2基板の表面の温度を上昇させる第2導電体パターンとを有し、前記第2導電体パターンは、接着層を介することなく前記第2基板に直接配置され、前記第2基板の前記第2導電体パターンが配置されている面には、発光素子がさらに搭載され、前記発光素子は、前記第2導電体パターンに接続され、前記第2導電体パターンを介して電流を供給されて発光し、前記第2導電体パターンは、前記発光素子の発する熱を伝導することにより、前記発光素子から離れた位置の前記第2基板の温度を上昇させ、
第1光透過基板と、第2光透過基板とは、前記第1導電体パターンと第2導電体パターンが形成された面が向かい合うように対向配置された表示装置。 - 請求項1ないし12のいずれか1項に記載の光透過基板を最表面に備える信号装置。
- 請求項1ないし12のいずれか1項に記載の光透過基板を最表面に備える照明装置。
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EP17191666.1A EP3300465B1 (en) | 2016-09-23 | 2017-09-18 | Light-emitting device |
CN201710851407.9A CN107871810B (zh) | 2016-09-23 | 2017-09-20 | 显示装置 |
US15/710,565 US10217386B2 (en) | 2016-09-23 | 2017-09-20 | Light-transmitting substrate, display device, signal device, and illumination device |
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US4196338A (en) * | 1974-04-29 | 1980-04-01 | Saint-Gobain Industries | Electrically heated vehicle window |
CA1043405A (en) * | 1976-03-15 | 1978-11-28 | Normand Dery | Rear window defrosters and method of installation |
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