ATE511740T1 - Beleuchtungssystem - Google Patents

Beleuchtungssystem

Info

Publication number
ATE511740T1
ATE511740T1 AT05826730T AT05826730T ATE511740T1 AT E511740 T1 ATE511740 T1 AT E511740T1 AT 05826730 T AT05826730 T AT 05826730T AT 05826730 T AT05826730 T AT 05826730T AT E511740 T1 ATE511740 T1 AT E511740T1
Authority
AT
Austria
Prior art keywords
light
category
mounting substrate
substrate
emitting diodes
Prior art date
Application number
AT05826730T
Other languages
English (en)
Inventor
Johannes Ansems
Christoph Hoelen
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Application granted granted Critical
Publication of ATE511740T1 publication Critical patent/ATE511740T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/20—Controlling the colour of the light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
AT05826730T 2004-12-09 2005-12-05 Beleuchtungssystem ATE511740T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP04106407 2004-12-09
PCT/IB2005/054045 WO2006061763A1 (en) 2004-12-09 2005-12-05 Illumination system

Publications (1)

Publication Number Publication Date
ATE511740T1 true ATE511740T1 (de) 2011-06-15

Family

ID=36123141

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05826730T ATE511740T1 (de) 2004-12-09 2005-12-05 Beleuchtungssystem

Country Status (7)

Country Link
US (1) US7659545B2 (de)
EP (1) EP1825719B1 (de)
JP (1) JP5209969B2 (de)
CN (1) CN101073292A (de)
AT (1) ATE511740T1 (de)
TW (1) TWI398186B (de)
WO (1) WO2006061763A1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008016895A2 (en) 2006-07-31 2008-02-07 3M Innovative Properties Company Integrating light source module
JP2009545854A (ja) * 2006-07-31 2009-12-24 スリーエム イノベイティブ プロパティズ カンパニー Ｌｅｄモザイク
EP2074656A2 (de) 2006-10-05 2009-07-01 Philips Intellectual Property & Standards GmbH Lichtmodulpaket
DE102007040871A1 (de) * 2007-08-29 2009-03-12 Osram Gesellschaft mit beschränkter Haftung Verbindungselement
JP2009099715A (ja) * 2007-10-16 2009-05-07 Fujikura Ltd 発光装置
US9812096B2 (en) 2008-01-23 2017-11-07 Spy Eye, Llc Eye mounted displays and systems using eye mounted displays
JP4995121B2 (ja) * 2008-02-28 2012-08-08 ハリソン東芝ライティング株式会社 面照明装置
JP5271066B2 (ja) * 2008-12-22 2013-08-21 パナソニック株式会社 発光装置および照明器具
US20120032206A1 (en) * 2010-08-06 2012-02-09 Cho Byoung Gu Variable height light emitting diode and method of manufacture
US8587187B2 (en) 2010-12-06 2013-11-19 Byoung GU Cho Light diffusion of visible edge lines in a multi-dimensional modular display
JP6156402B2 (ja) 2015-02-13 2017-07-05 日亜化学工業株式会社 発光装置
JP6932910B2 (ja) 2016-10-27 2021-09-08 船井電機株式会社 表示装置
EP3542400B1 (de) * 2016-11-17 2021-06-09 Signify Holding B.V. Beleuchtungsvorrichtung mit uv-led

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3649748B2 (ja) * 1993-03-22 2005-05-18 三洋電機株式会社 発光ダイオードランプ
US5748161A (en) * 1996-03-04 1998-05-05 Motorola, Inc. Integrated electro-optical package with independent menu bar
WO1997048138A2 (en) 1996-06-11 1997-12-18 Philips Electronics N.V. Visible light emitting devices including uv-light emitting diode and uv-excitable, visible light emitting phosphor, and method of producing such devices
US6784463B2 (en) * 1997-06-03 2004-08-31 Lumileds Lighting U.S., Llc III-Phospide and III-Arsenide flip chip light-emitting devices
JP3287457B2 (ja) * 1997-10-31 2002-06-04 日亜化学工業株式会社 Ｌｅｄ表示器及びｌｅｄ表示装置
US5952681A (en) * 1997-11-24 1999-09-14 Chen; Hsing Light emitting diode emitting red, green and blue light
JPH11163415A (ja) 1997-11-27 1999-06-18 Toyoda Gosei Co Ltd Ｌｅｄ表示装置用フィルタ
CN1227749C (zh) 1998-09-28 2005-11-16 皇家菲利浦电子有限公司 照明系统
JP4382902B2 (ja) * 1999-03-26 2009-12-16 京セラ株式会社 Ｌｅｄアレイおよびその製造方法
EP1103759A3 (de) 1999-11-11 2005-02-23 Toyoda Gosei Co., Ltd. Vollfarben-Lichtquellen-Einheit
US6513949B1 (en) 1999-12-02 2003-02-04 Koninklijke Philips Electronics N.V. LED/phosphor-LED hybrid lighting systems
US6903376B2 (en) * 1999-12-22 2005-06-07 Lumileds Lighting U.S., Llc Selective placement of quantum wells in flipchip light emitting diodes for improved light extraction
JP4495814B2 (ja) * 1999-12-28 2010-07-07 アビックス株式会社 調光式ｌｅｄ照明器具
DE10051159C2 (de) * 2000-10-16 2002-09-19 Osram Opto Semiconductors Gmbh LED-Modul, z.B. Weißlichtquelle
JP5110744B2 (ja) * 2000-12-21 2012-12-26 フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー 発光装置及びその製造方法
TW486830B (en) * 2001-02-08 2002-05-11 Ind Tech Res Inst High resolution and brightness full-color LED display manufactured using CMP technique
JP3659407B2 (ja) * 2001-08-03 2005-06-15 ソニー株式会社 発光装置
JP2003051618A (ja) * 2001-08-06 2003-02-21 Rohm Co Ltd チップ型半導体発光装置
WO2003016782A1 (en) 2001-08-09 2003-02-27 Matsushita Electric Industrial Co., Ltd. Led illuminator and card type led illuminating light source
JP2003110149A (ja) * 2001-09-28 2003-04-11 Matsushita Electric Ind Co Ltd 発光ユニット及び当該発光ユニットを用いた照明装置
JP3705791B2 (ja) * 2002-03-14 2005-10-12 株式会社東芝 半導体発光素子および半導体発光装置
DE10214210B4 (de) * 2002-03-28 2011-02-10 Osram Opto Semiconductors Gmbh Lumineszenzdiodenchip zur Flip-Chip-Montage auf einen lotbedeckten Träger und Verfahren zu dessen Herstellung
JP4123830B2 (ja) * 2002-05-28 2008-07-23 松下電工株式会社 Ｌｅｄチップ
DE60330023D1 (de) * 2002-08-30 2009-12-24 Lumination Llc Geschichtete led mit verbessertem wirkungsgrad
JP4226338B2 (ja) * 2003-01-08 2009-02-18 豊田合成株式会社 発光ダイオードおよびｌｅｄライト
JP4874510B2 (ja) * 2003-05-14 2012-02-15 日亜化学工業株式会社 発光装置及びその製造方法

Also Published As

Publication number Publication date
US20090283780A1 (en) 2009-11-19
JP5209969B2 (ja) 2013-06-12
WO2006061763A1 (en) 2006-06-15
JP2008523601A (ja) 2008-07-03
TWI398186B (zh) 2013-06-01
EP1825719A1 (de) 2007-08-29
EP1825719B1 (de) 2011-06-01
US7659545B2 (en) 2010-02-09
CN101073292A (zh) 2007-11-14
TW200633575A (en) 2006-09-16

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Legal Events

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