JP4572994B2 - 発光モジュールおよび照明装置 - Google Patents
発光モジュールおよび照明装置 Download PDFInfo
- Publication number
- JP4572994B2 JP4572994B2 JP2009221147A JP2009221147A JP4572994B2 JP 4572994 B2 JP4572994 B2 JP 4572994B2 JP 2009221147 A JP2009221147 A JP 2009221147A JP 2009221147 A JP2009221147 A JP 2009221147A JP 4572994 B2 JP4572994 B2 JP 4572994B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- insulator
- light
- substrate
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
Description
金属基材と、前記金属基材に積層されるとともに前記金属基材の反対側に実装面を有する絶縁体と、を含む基板と;前記基板の実装面に設けられた配線パターンと;前記基板の実装面に実装され、前記配線パターンに電気的に接続されて通電時に発熱する発光素子と;を備えている。前記基板の前記絶縁体は、前記基板の厚さ方向に互いに積み重ねられた複数の絶縁層を有し、これら絶縁層は厚さが同一であるとともに、前記絶縁層のうち前記実装面を形成する一つの絶縁層のみに光反射性および熱抵抗が増加する材料が混入されていることを特徴としている。
T2×1/N
よりも小さな値となっている。
Claims (4)
- 金属基材と、前記金属基材に積層されるとともに前記金属基材の反対側に実装面を有する絶縁体と、を含む基板と;
前記基板の実装面に設けられた配線パターンと;
前記基板の実装面に実装され、前記配線パターンに電気的に接続されて通電時に発熱する発光素子と;を具備し、
前記基板の前記絶縁体は、前記基板の厚さ方向に互いに積み重ねられた複数の絶縁層を有し、これら絶縁層は厚さが同一であるとともに、前記絶縁層のうち前記実装面を形成する一つの絶縁層のみに光反射性および熱抵抗が増加する材料が混入されていることを特徴とする発光モジュール。 - 請求項1の記載において、前記各絶縁層はボイドを含み、前記ボイドのサイズが前記各絶縁層の厚さよりも小さいことを特徴とする発光モジュール。
- 請求項1の記載において、前記金属基材は、前記発光素子の熱を放出する放熱部を有し、この放熱部は前記絶縁体の反対側に位置することを特徴とする発光モジュール。
- 請求項1ないし請求項3のいずれか一項に記載された発光モジュールと;
前記発光モジュールの前記発光素子を点灯させる点灯装置と;を具備したことを特徴とする照明装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009221147A JP4572994B2 (ja) | 2008-10-28 | 2009-09-25 | 発光モジュールおよび照明装置 |
CN200910206652XA CN101725854B (zh) | 2008-10-28 | 2009-10-26 | 发光模块及照明装置 |
EP09013540A EP2182783A3 (en) | 2008-10-28 | 2009-10-27 | Light-emitting module and illuminating apparatus |
US12/606,211 US8403536B2 (en) | 2008-10-28 | 2009-10-27 | Light-emitting module and illuminating apparatus having an insulating base having a plurality of insulating layers |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008276915 | 2008-10-28 | ||
JP2009221147A JP4572994B2 (ja) | 2008-10-28 | 2009-09-25 | 発光モジュールおよび照明装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010135749A JP2010135749A (ja) | 2010-06-17 |
JP4572994B2 true JP4572994B2 (ja) | 2010-11-04 |
Family
ID=41600330
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009221147A Expired - Fee Related JP4572994B2 (ja) | 2008-10-28 | 2009-09-25 | 発光モジュールおよび照明装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8403536B2 (ja) |
EP (1) | EP2182783A3 (ja) |
JP (1) | JP4572994B2 (ja) |
CN (1) | CN101725854B (ja) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011082497A1 (en) * | 2010-01-11 | 2011-07-14 | Cooledge Lighting Inc. | Package for light emitting and receiving devices |
EP2804227B1 (en) * | 2010-05-13 | 2015-10-07 | Panasonic Intellectual Property Management Co., Ltd. | LED lamp |
CN101886766A (zh) * | 2010-07-29 | 2010-11-17 | 北京尚明时代光电科技有限公司 | 一种条形led光源 |
TWI520386B (zh) * | 2010-07-29 | 2016-02-01 | 神基科技股份有限公司 | 發光二極體總成的結構與其製造方法 |
JP5851680B2 (ja) * | 2010-09-24 | 2016-02-03 | 株式会社小糸製作所 | 発光モジュール |
KR101181173B1 (ko) * | 2010-10-11 | 2012-09-18 | 엘지이노텍 주식회사 | 방열회로기판, 그의 제조 방법 및 그를 포함하는 발열소자 패키지 |
GB2484712A (en) * | 2010-10-21 | 2012-04-25 | Optovate Ltd | Illumination Apparatus |
GB2484713A (en) | 2010-10-21 | 2012-04-25 | Optovate Ltd | Illumination apparatus |
CN103053038A (zh) | 2011-01-13 | 2013-04-17 | 松下电器产业株式会社 | 安装用基板、发光装置以及灯 |
CN103430339B (zh) * | 2012-03-13 | 2014-09-10 | 松下电器产业株式会社 | 基板、发光装置以及照明装置 |
US9859484B2 (en) | 2012-10-24 | 2018-01-02 | Sharp Kabushiki Kaisha | Light emitting apparatus |
US10308856B1 (en) | 2013-03-15 | 2019-06-04 | The Research Foundation For The State University Of New York | Pastes for thermal, electrical and mechanical bonding |
JP6221456B2 (ja) * | 2013-07-23 | 2017-11-01 | 日亜化学工業株式会社 | 発光装置及び照明装置 |
JP2015061063A (ja) * | 2013-09-20 | 2015-03-30 | 東芝ライテック株式会社 | 発光モジュール、および照明装置 |
JP2015061068A (ja) * | 2013-09-20 | 2015-03-30 | 東芝ライテック株式会社 | 発光モジュールおよび照明装置 |
WO2015079913A1 (ja) * | 2013-11-29 | 2015-06-04 | シャープ株式会社 | 発光装置用基板、発光装置および発光装置用基板の製造方法 |
JP6215360B2 (ja) * | 2014-01-10 | 2017-10-18 | シャープ株式会社 | 発光装置用基板、発光装置および発光装置用基板の製造方法 |
CN106134297B (zh) * | 2014-04-04 | 2019-08-06 | 夏普株式会社 | 发光装置用基板、发光装置及照明装置 |
US20180209614A1 (en) * | 2017-01-20 | 2018-07-26 | Maxim Lighting International, Inc. | Light emitting diode assembly and method of manufacture |
GB201705364D0 (en) | 2017-04-03 | 2017-05-17 | Optovate Ltd | Illumination apparatus |
GB201705365D0 (en) | 2017-04-03 | 2017-05-17 | Optovate Ltd | Illumination apparatus |
GB201800574D0 (en) | 2018-01-14 | 2018-02-28 | Optovate Ltd | Illumination apparatus |
GB201803767D0 (en) | 2018-03-09 | 2018-04-25 | Optovate Ltd | Illumination apparatus |
GB201807747D0 (en) | 2018-05-13 | 2018-06-27 | Optovate Ltd | Colour micro-LED display apparatus |
TW202102883A (zh) | 2019-07-02 | 2021-01-16 | 美商瑞爾D斯帕克有限責任公司 | 定向顯示設備 |
CN114616498A (zh) | 2019-08-23 | 2022-06-10 | 瑞尔D斯帕克有限责任公司 | 定向照明设备和防窥显示器 |
WO2021050967A1 (en) | 2019-09-11 | 2021-03-18 | Reald Spark, Llc | Directional illumination apparatus and privacy display |
CN114631046A (zh) | 2019-09-11 | 2022-06-14 | 瑞尔D斯帕克有限责任公司 | 可切换照明设备和防窥显示器 |
US11162661B2 (en) | 2019-10-03 | 2021-11-02 | Reald Spark, Llc | Illumination apparatus comprising passive optical nanostructures |
EP4038313A4 (en) | 2019-10-03 | 2023-11-22 | RealD Spark, LLC | LIGHTING APPARATUS COMPRISING PASSIVE OPTICAL NANOSTRUCTURES |
US11287562B2 (en) | 2020-02-20 | 2022-03-29 | Reald Spark, Llc | Illumination apparatus including mask with plurality of apertures and display apparatus comprising same |
Citations (7)
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JPH01139250A (ja) * | 1987-11-27 | 1989-05-31 | Nisshin Steel Co Ltd | 金属基積層板 |
JPH01232795A (ja) * | 1988-03-11 | 1989-09-18 | Mitsubishi Cable Ind Ltd | 金属ベース基板の製造方法 |
JPH0575225A (ja) * | 1991-09-18 | 1993-03-26 | Hitachi Chem Co Ltd | 金属ベース印刷配線基板及びその製造方法 |
JP2006261600A (ja) * | 2005-03-18 | 2006-09-28 | Matsushita Electric Ind Co Ltd | 照明モジュール、照明装置及び照明モジュールの製造方法 |
JP2006270002A (ja) * | 2005-03-25 | 2006-10-05 | Nippon Rika Kogyosho:Kk | 発光ダイオード実装用金属基板及び発光装置 |
JP2007214249A (ja) * | 2006-02-08 | 2007-08-23 | Matsushita Electric Ind Co Ltd | 発光モジュールとその製造方法 |
JP2007300138A (ja) * | 2003-12-05 | 2007-11-15 | Mitsubishi Electric Corp | 発光装置及びこれを用いた照明器具 |
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JP2006344690A (ja) | 2005-06-07 | 2006-12-21 | Fujikura Ltd | 発光素子実装用ホーロー基板、発光素子モジュール、照明装置、表示装置及び交通信号機 |
-
2009
- 2009-09-25 JP JP2009221147A patent/JP4572994B2/ja not_active Expired - Fee Related
- 2009-10-26 CN CN200910206652XA patent/CN101725854B/zh not_active Expired - Fee Related
- 2009-10-27 EP EP09013540A patent/EP2182783A3/en not_active Withdrawn
- 2009-10-27 US US12/606,211 patent/US8403536B2/en not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01139250A (ja) * | 1987-11-27 | 1989-05-31 | Nisshin Steel Co Ltd | 金属基積層板 |
JPH01232795A (ja) * | 1988-03-11 | 1989-09-18 | Mitsubishi Cable Ind Ltd | 金属ベース基板の製造方法 |
JPH0575225A (ja) * | 1991-09-18 | 1993-03-26 | Hitachi Chem Co Ltd | 金属ベース印刷配線基板及びその製造方法 |
JP2007300138A (ja) * | 2003-12-05 | 2007-11-15 | Mitsubishi Electric Corp | 発光装置及びこれを用いた照明器具 |
JP2006261600A (ja) * | 2005-03-18 | 2006-09-28 | Matsushita Electric Ind Co Ltd | 照明モジュール、照明装置及び照明モジュールの製造方法 |
JP2006270002A (ja) * | 2005-03-25 | 2006-10-05 | Nippon Rika Kogyosho:Kk | 発光ダイオード実装用金属基板及び発光装置 |
JP2007214249A (ja) * | 2006-02-08 | 2007-08-23 | Matsushita Electric Ind Co Ltd | 発光モジュールとその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
EP2182783A2 (en) | 2010-05-05 |
EP2182783A3 (en) | 2011-08-24 |
US8403536B2 (en) | 2013-03-26 |
CN101725854A (zh) | 2010-06-09 |
JP2010135749A (ja) | 2010-06-17 |
CN101725854B (zh) | 2012-05-16 |
US20100103680A1 (en) | 2010-04-29 |
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