USD824343S1 - LED chip - Google Patents

LED chip Download PDF

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Publication number
USD824343S1
USD824343S1 US29/589,383 US201629589383F USD824343S US D824343 S1 USD824343 S1 US D824343S1 US 201629589383 F US201629589383 F US 201629589383F US D824343 S USD824343 S US D824343S
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United States
Prior art keywords
led chip
present disclosure
view
chip according
led
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US29/589,383
Inventor
Xiushan Zhu
Ling Tong
Huiwen Xu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Enraytek Optoelectronics Co Ltd
Original Assignee
Enraytek Optoelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Assigned to ENRAYTEK OPTOELECTRONICS CO., LTD. reassignment ENRAYTEK OPTOELECTRONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TONG, LING, XU, HUIWEN, ZHU, XIUSHAN
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FIG. 1 is a 3D view of a LED chip according to a first embodiment of the present disclosure, in which the light emitting layer is provided with multiple holes penetrating through the light emitting layer and exposing the substrate;
FIG. 2 is another 3D view of the LED chip according to the first embodiment of the present disclosure;
FIG. 3 is a top view of the LED chip according to the first embodiment of the present disclosure;
FIG. 4 is a left-side view of the LED chip according to the first embodiment of the present disclosure;
FIG. 5 is a right-side view of the LED chip according to the first embodiment of the present disclosure;
FIG. 6 is a front-side view of the LED chip according to the first embodiment of the present disclosure;
FIG. 7 is a rear-side view of the LED chip according to the first embodiment of the present disclosure;
FIG. 8 is a bottom view of the LED chip according to the first embodiment of the present disclosure;
FIG. 9 is a 3D view of a LED chip according to a second embodiment of the present disclosure;
FIG. 10 is a another 3D view of the LED chip according to a second embodiment of the present disclosure;
FIG. 11 is a top view of the LED chip according to a second embodiment of the present disclosure;
FIG. 12 is a cross-sectional view of the LED chip along line 12-12 in FIG. 11;
FIG. 13 is a left-side view of the LED chip according to a second embodiment of the present disclosure;
FIG. 14 is a right-side view of the LED chip according to a second embodiment of the present disclosure;
FIG. 15 is a front-side view of the LED chip according to a second embodiment of the present disclosure;
FIG. 16 is a rear-side view of the LED chip according to a second embodiment of the present disclosure; and,
FIG. 17 is a bottom view of the LED chip according to a second embodiment of the present disclosure.

Claims (1)

    CLAIM
  1. The ornamental design for an LED chip, as shown and described.
US29/589,383 2016-07-27 2016-12-30 LED chip Active USD824343S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201630349617 2016-07-27
CN201630349617 2016-07-27

Publications (1)

Publication Number Publication Date
USD824343S1 true USD824343S1 (en) 2018-07-31

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US29/589,383 Active USD824343S1 (en) 2016-07-27 2016-12-30 LED chip

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD899384S1 (en) 2019-11-04 2020-10-20 Putco, Inc. Surface-mount device
USD995454S1 (en) 2020-10-20 2023-08-15 Lextar Electronics Corporation Light emitting diode module

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060160409A1 (en) * 2001-08-09 2006-07-20 Matsushita Electric Industrial Co., Ltd. Card type led illumination source
US20060261725A1 (en) * 2005-05-19 2006-11-23 Lee Sang-Jin Electron emission device, electron emission display, and manufacturing method of the electron emission device
USD566057S1 (en) * 2006-12-21 2008-04-08 Cree, Inc. LED chip
US20080116782A1 (en) * 2006-11-20 2008-05-22 Byoung-Kuk Kim Light emission device and display device
USD582866S1 (en) * 2007-09-07 2008-12-16 Cree, Inc. LED chip
US7621654B2 (en) * 2004-03-26 2009-11-24 Panasonic Corporation LED mounting module, LED module, manufacturing method of LED mounting module, and manufacturing method of LED module
US7786491B2 (en) * 2006-02-02 2010-08-31 Panasonic Corporation Semiconductor light-emitting device comprising a plurality of semiconductor layers
US20110291120A1 (en) * 2010-06-01 2011-12-01 Samsung Electronics Co., Ltd. Light Emitting Devices Using Connection Structures And Methods Of Manufacturing The Same
US20110291070A1 (en) * 2010-05-25 2011-12-01 Jong Hak Won Light emitting device, light emitting device package, and lighting system
US20120056232A1 (en) * 2010-09-06 2012-03-08 Kabushiki Kaisha Toshiba Semiconductor light emitting device and method for manufacturing same
US8227815B2 (en) * 2007-08-09 2012-07-24 Lg Innotek Co., Ltd. Lighting device
USD694202S1 (en) * 2012-10-15 2013-11-26 I-Chiun Precision Industry Co., Ltd. Composite lead frame for LED
USD730848S1 (en) * 2014-01-14 2015-06-02 Lextar Electronics Corporation Lead-frame
USD745472S1 (en) * 2014-01-28 2015-12-15 Formosa Epitaxy Incorporation Light emitting diode chip
USD795822S1 (en) * 2016-07-29 2017-08-29 Enraytek Optoelectronics Co., Ltd. LED chip

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060160409A1 (en) * 2001-08-09 2006-07-20 Matsushita Electric Industrial Co., Ltd. Card type led illumination source
US7621654B2 (en) * 2004-03-26 2009-11-24 Panasonic Corporation LED mounting module, LED module, manufacturing method of LED mounting module, and manufacturing method of LED module
US20060261725A1 (en) * 2005-05-19 2006-11-23 Lee Sang-Jin Electron emission device, electron emission display, and manufacturing method of the electron emission device
US7786491B2 (en) * 2006-02-02 2010-08-31 Panasonic Corporation Semiconductor light-emitting device comprising a plurality of semiconductor layers
US20080116782A1 (en) * 2006-11-20 2008-05-22 Byoung-Kuk Kim Light emission device and display device
USD566057S1 (en) * 2006-12-21 2008-04-08 Cree, Inc. LED chip
US8227815B2 (en) * 2007-08-09 2012-07-24 Lg Innotek Co., Ltd. Lighting device
USD582866S1 (en) * 2007-09-07 2008-12-16 Cree, Inc. LED chip
US20110291070A1 (en) * 2010-05-25 2011-12-01 Jong Hak Won Light emitting device, light emitting device package, and lighting system
US20110291120A1 (en) * 2010-06-01 2011-12-01 Samsung Electronics Co., Ltd. Light Emitting Devices Using Connection Structures And Methods Of Manufacturing The Same
US20120056232A1 (en) * 2010-09-06 2012-03-08 Kabushiki Kaisha Toshiba Semiconductor light emitting device and method for manufacturing same
USD694202S1 (en) * 2012-10-15 2013-11-26 I-Chiun Precision Industry Co., Ltd. Composite lead frame for LED
USD730848S1 (en) * 2014-01-14 2015-06-02 Lextar Electronics Corporation Lead-frame
USD745472S1 (en) * 2014-01-28 2015-12-15 Formosa Epitaxy Incorporation Light emitting diode chip
USD795822S1 (en) * 2016-07-29 2017-08-29 Enraytek Optoelectronics Co., Ltd. LED chip

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD899384S1 (en) 2019-11-04 2020-10-20 Putco, Inc. Surface-mount device
USD920933S1 (en) 2019-11-04 2021-06-01 Putco, Inc. Surface-mount device
USD995454S1 (en) 2020-10-20 2023-08-15 Lextar Electronics Corporation Light emitting diode module

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