USD824343S1 - LED chip - Google Patents
LED chip Download PDFInfo
- Publication number
- USD824343S1 USD824343S1 US29/589,383 US201629589383F USD824343S US D824343 S1 USD824343 S1 US D824343S1 US 201629589383 F US201629589383 F US 201629589383F US D824343 S USD824343 S US D824343S
- Authority
- US
- United States
- Prior art keywords
- led chip
- present disclosure
- view
- chip according
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
Claims (1)
- The ornamental design for an LED chip, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201630349617 | 2016-07-27 | ||
CN201630349617 | 2016-07-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD824343S1 true USD824343S1 (en) | 2018-07-31 |
Family
ID=62948782
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/589,383 Active USD824343S1 (en) | 2016-07-27 | 2016-12-30 | LED chip |
Country Status (1)
Country | Link |
---|---|
US (1) | USD824343S1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD899384S1 (en) | 2019-11-04 | 2020-10-20 | Putco, Inc. | Surface-mount device |
USD995454S1 (en) | 2020-10-20 | 2023-08-15 | Lextar Electronics Corporation | Light emitting diode module |
Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060160409A1 (en) * | 2001-08-09 | 2006-07-20 | Matsushita Electric Industrial Co., Ltd. | Card type led illumination source |
US20060261725A1 (en) * | 2005-05-19 | 2006-11-23 | Lee Sang-Jin | Electron emission device, electron emission display, and manufacturing method of the electron emission device |
USD566057S1 (en) * | 2006-12-21 | 2008-04-08 | Cree, Inc. | LED chip |
US20080116782A1 (en) * | 2006-11-20 | 2008-05-22 | Byoung-Kuk Kim | Light emission device and display device |
USD582866S1 (en) * | 2007-09-07 | 2008-12-16 | Cree, Inc. | LED chip |
US7621654B2 (en) * | 2004-03-26 | 2009-11-24 | Panasonic Corporation | LED mounting module, LED module, manufacturing method of LED mounting module, and manufacturing method of LED module |
US7786491B2 (en) * | 2006-02-02 | 2010-08-31 | Panasonic Corporation | Semiconductor light-emitting device comprising a plurality of semiconductor layers |
US20110291120A1 (en) * | 2010-06-01 | 2011-12-01 | Samsung Electronics Co., Ltd. | Light Emitting Devices Using Connection Structures And Methods Of Manufacturing The Same |
US20110291070A1 (en) * | 2010-05-25 | 2011-12-01 | Jong Hak Won | Light emitting device, light emitting device package, and lighting system |
US20120056232A1 (en) * | 2010-09-06 | 2012-03-08 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device and method for manufacturing same |
US8227815B2 (en) * | 2007-08-09 | 2012-07-24 | Lg Innotek Co., Ltd. | Lighting device |
USD694202S1 (en) * | 2012-10-15 | 2013-11-26 | I-Chiun Precision Industry Co., Ltd. | Composite lead frame for LED |
USD730848S1 (en) * | 2014-01-14 | 2015-06-02 | Lextar Electronics Corporation | Lead-frame |
USD745472S1 (en) * | 2014-01-28 | 2015-12-15 | Formosa Epitaxy Incorporation | Light emitting diode chip |
USD795822S1 (en) * | 2016-07-29 | 2017-08-29 | Enraytek Optoelectronics Co., Ltd. | LED chip |
-
2016
- 2016-12-30 US US29/589,383 patent/USD824343S1/en active Active
Patent Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060160409A1 (en) * | 2001-08-09 | 2006-07-20 | Matsushita Electric Industrial Co., Ltd. | Card type led illumination source |
US7621654B2 (en) * | 2004-03-26 | 2009-11-24 | Panasonic Corporation | LED mounting module, LED module, manufacturing method of LED mounting module, and manufacturing method of LED module |
US20060261725A1 (en) * | 2005-05-19 | 2006-11-23 | Lee Sang-Jin | Electron emission device, electron emission display, and manufacturing method of the electron emission device |
US7786491B2 (en) * | 2006-02-02 | 2010-08-31 | Panasonic Corporation | Semiconductor light-emitting device comprising a plurality of semiconductor layers |
US20080116782A1 (en) * | 2006-11-20 | 2008-05-22 | Byoung-Kuk Kim | Light emission device and display device |
USD566057S1 (en) * | 2006-12-21 | 2008-04-08 | Cree, Inc. | LED chip |
US8227815B2 (en) * | 2007-08-09 | 2012-07-24 | Lg Innotek Co., Ltd. | Lighting device |
USD582866S1 (en) * | 2007-09-07 | 2008-12-16 | Cree, Inc. | LED chip |
US20110291070A1 (en) * | 2010-05-25 | 2011-12-01 | Jong Hak Won | Light emitting device, light emitting device package, and lighting system |
US20110291120A1 (en) * | 2010-06-01 | 2011-12-01 | Samsung Electronics Co., Ltd. | Light Emitting Devices Using Connection Structures And Methods Of Manufacturing The Same |
US20120056232A1 (en) * | 2010-09-06 | 2012-03-08 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device and method for manufacturing same |
USD694202S1 (en) * | 2012-10-15 | 2013-11-26 | I-Chiun Precision Industry Co., Ltd. | Composite lead frame for LED |
USD730848S1 (en) * | 2014-01-14 | 2015-06-02 | Lextar Electronics Corporation | Lead-frame |
USD745472S1 (en) * | 2014-01-28 | 2015-12-15 | Formosa Epitaxy Incorporation | Light emitting diode chip |
USD795822S1 (en) * | 2016-07-29 | 2017-08-29 | Enraytek Optoelectronics Co., Ltd. | LED chip |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD899384S1 (en) | 2019-11-04 | 2020-10-20 | Putco, Inc. | Surface-mount device |
USD920933S1 (en) | 2019-11-04 | 2021-06-01 | Putco, Inc. | Surface-mount device |
USD995454S1 (en) | 2020-10-20 | 2023-08-15 | Lextar Electronics Corporation | Light emitting diode module |
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