GB2455069B - Improved led device - Google Patents

Improved led device

Info

Publication number
GB2455069B
GB2455069B GB0722539A GB0722539A GB2455069B GB 2455069 B GB2455069 B GB 2455069B GB 0722539 A GB0722539 A GB 0722539A GB 0722539 A GB0722539 A GB 0722539A GB 2455069 B GB2455069 B GB 2455069B
Authority
GB
United Kingdom
Prior art keywords
led device
improved led
improved
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0722539A
Other versions
GB0722539D0 (en
GB2455069A (en
Inventor
Hu Pengxiang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
URIEL MEYER WITTENBERG
Original Assignee
URIEL MEYER WITTENBERG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by URIEL MEYER WITTENBERG filed Critical URIEL MEYER WITTENBERG
Priority to GB0722539A priority Critical patent/GB2455069B/en
Priority to GB1004698A priority patent/GB2470802B/en
Publication of GB0722539D0 publication Critical patent/GB0722539D0/en
Priority to PCT/GB2008/051078 priority patent/WO2009063255A1/en
Publication of GB2455069A publication Critical patent/GB2455069A/en
Application granted granted Critical
Publication of GB2455069B publication Critical patent/GB2455069B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Led Device Packages (AREA)
GB0722539A 2007-11-16 2007-11-16 Improved led device Expired - Fee Related GB2455069B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB0722539A GB2455069B (en) 2007-11-16 2007-11-16 Improved led device
GB1004698A GB2470802B (en) 2007-11-16 2007-11-16 A silver-based thermally conductive composition for thermally coupling LED chips to heat sinks
PCT/GB2008/051078 WO2009063255A1 (en) 2007-11-16 2008-11-17 Improved led device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0722539A GB2455069B (en) 2007-11-16 2007-11-16 Improved led device

Publications (3)

Publication Number Publication Date
GB0722539D0 GB0722539D0 (en) 2007-12-27
GB2455069A GB2455069A (en) 2009-06-03
GB2455069B true GB2455069B (en) 2010-05-12

Family

ID=38896451

Family Applications (2)

Application Number Title Priority Date Filing Date
GB1004698A Expired - Fee Related GB2470802B (en) 2007-11-16 2007-11-16 A silver-based thermally conductive composition for thermally coupling LED chips to heat sinks
GB0722539A Expired - Fee Related GB2455069B (en) 2007-11-16 2007-11-16 Improved led device

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB1004698A Expired - Fee Related GB2470802B (en) 2007-11-16 2007-11-16 A silver-based thermally conductive composition for thermally coupling LED chips to heat sinks

Country Status (2)

Country Link
GB (2) GB2470802B (en)
WO (1) WO2009063255A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101882569B (en) * 2010-06-08 2012-01-25 常州银河电器有限公司 Method for removing flash on lead wire and frame of diode or triode
US8648359B2 (en) * 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
TW201251140A (en) 2011-01-31 2012-12-16 Cree Inc High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
CN103348496A (en) 2011-02-07 2013-10-09 克利公司 Components and methods for light emitting diode (LED) lighting
US11587799B2 (en) 2019-12-02 2023-02-21 Applied Materials, Inc. Methods and apparatus for processing a substrate

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2102026A (en) * 1981-06-05 1983-01-26 Matsushita Electric Ind Co Ltd Conductive pastes
US6498355B1 (en) * 2001-10-09 2002-12-24 Lumileds Lighting, U.S., Llc High flux LED array
US20030039122A1 (en) * 2001-08-24 2003-02-27 Densen Cao Light source using semiconductor devices mounted on a heat sink
US20040264195A1 (en) * 2003-06-25 2004-12-30 Chia-Fu Chang Led light source having a heat sink
US20070201232A1 (en) * 2006-02-27 2007-08-30 Kuei-Fang Chen Illumination apparatus having heat dissipating capability

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3230975A1 (en) * 1982-08-20 1984-02-23 Robert Bosch Gmbh, 7000 Stuttgart MOTOR VEHICLE LAMP MADE OF LIGHT-EMITTING DIODES OR LIGHT-EMITTING DIODE CHIPS
JPH03104768U (en) * 1990-02-15 1991-10-30
US5500009A (en) * 1990-11-15 1996-03-19 Amron, Ltd. Method of treating herpes
JP2602380B2 (en) * 1991-10-23 1997-04-23 富士通株式会社 Semiconductor device and manufacturing method thereof
EP0938834B1 (en) * 1996-11-12 2002-03-13 L.F.D. Limited Lamp
WO1999057945A1 (en) * 1998-05-04 1999-11-11 Fiber Optic Designs, Inc. A lamp employing a monolithic led device
US7066628B2 (en) * 2001-03-29 2006-06-27 Fiber Optic Designs, Inc. Jacketed LED assemblies and light strings containing same
ATE425556T1 (en) * 2001-04-12 2009-03-15 Matsushita Electric Works Ltd LIGHT SOURCE COMPONENT WITH LED AND METHOD FOR PRODUCING IT
EP1416219B1 (en) * 2001-08-09 2016-06-22 Everlight Electronics Co., Ltd Led illuminator and card type led illuminating light source
US6791839B2 (en) * 2002-06-25 2004-09-14 Dow Corning Corporation Thermal interface materials and methods for their preparation and use
US7304418B2 (en) * 2003-10-24 2007-12-04 Seiko Epson Corporation Light source apparatus with light-emitting chip which generates light and heat
US7524085B2 (en) * 2003-10-31 2009-04-28 Phoseon Technology, Inc. Series wiring of highly reliable light sources
US7331691B2 (en) * 2004-10-29 2008-02-19 Goldeneye, Inc. Light emitting diode light source with heat transfer means

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2102026A (en) * 1981-06-05 1983-01-26 Matsushita Electric Ind Co Ltd Conductive pastes
US20030039122A1 (en) * 2001-08-24 2003-02-27 Densen Cao Light source using semiconductor devices mounted on a heat sink
US6498355B1 (en) * 2001-10-09 2002-12-24 Lumileds Lighting, U.S., Llc High flux LED array
US20040264195A1 (en) * 2003-06-25 2004-12-30 Chia-Fu Chang Led light source having a heat sink
US20070201232A1 (en) * 2006-02-27 2007-08-30 Kuei-Fang Chen Illumination apparatus having heat dissipating capability

Also Published As

Publication number Publication date
GB201004698D0 (en) 2010-05-05
WO2009063255A1 (en) 2009-05-22
GB0722539D0 (en) 2007-12-27
GB2455069A (en) 2009-06-03
GB2470802B (en) 2011-10-05
GB2470802A (en) 2010-12-08

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20131116