GB0722539D0 - Improved led device - Google Patents

Improved led device

Info

Publication number
GB0722539D0
GB0722539D0 GB0722539A GB0722539A GB0722539D0 GB 0722539 D0 GB0722539 D0 GB 0722539D0 GB 0722539 A GB0722539 A GB 0722539A GB 0722539 A GB0722539 A GB 0722539A GB 0722539 D0 GB0722539 D0 GB 0722539D0
Authority
GB
United Kingdom
Prior art keywords
led device
improved led
improved
device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB0722539A
Other versions
GB2455069A (en
GB2455069B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WITTENBERG URIEL M
Original Assignee
WITTENBERG URIEL M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WITTENBERG URIEL M filed Critical WITTENBERG URIEL M
Priority to GB0722539A priority Critical patent/GB2455069B/en
Publication of GB0722539D0 publication Critical patent/GB0722539D0/en
Publication of GB2455069A publication Critical patent/GB2455069A/en
Application granted granted Critical
Publication of GB2455069B publication Critical patent/GB2455069B/en
Application status is Expired - Fee Related legal-status Critical
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64Heat extraction or cooling elements
    • H01L33/641Heat extraction or cooling elements characterized by the materials
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
GB0722539A 2007-11-16 2007-11-16 Improved led device Expired - Fee Related GB2455069B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0722539A GB2455069B (en) 2007-11-16 2007-11-16 Improved led device

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1004698A GB2470802B (en) 2007-11-16 2007-11-16 A silver-based thermally conductive composition for thermally coupling LED chips to heat sinks
GB0722539A GB2455069B (en) 2007-11-16 2007-11-16 Improved led device
PCT/GB2008/051078 WO2009063255A1 (en) 2007-11-16 2008-11-17 Improved led device

Publications (3)

Publication Number Publication Date
GB0722539D0 true GB0722539D0 (en) 2007-12-27
GB2455069A GB2455069A (en) 2009-06-03
GB2455069B GB2455069B (en) 2010-05-12

Family

ID=38896451

Family Applications (2)

Application Number Title Priority Date Filing Date
GB0722539A Expired - Fee Related GB2455069B (en) 2007-11-16 2007-11-16 Improved led device
GB1004698A Expired - Fee Related GB2470802B (en) 2007-11-16 2007-11-16 A silver-based thermally conductive composition for thermally coupling LED chips to heat sinks

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB1004698A Expired - Fee Related GB2470802B (en) 2007-11-16 2007-11-16 A silver-based thermally conductive composition for thermally coupling LED chips to heat sinks

Country Status (2)

Country Link
GB (2) GB2455069B (en)
WO (1) WO2009063255A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8648359B2 (en) * 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
CN101882569B (en) * 2010-06-08 2012-01-25 常州银河电器有限公司 Method for removing flash on lead wire and frame of diode or triode
TW201251140A (en) 2011-01-31 2012-12-16 Cree Inc High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4400214A (en) * 1981-06-05 1983-08-23 Matsushita Electric Industrial, Co., Ltd. Conductive paste
DE3230975A1 (en) * 1982-08-20 1984-02-23 Bosch Gmbh Robert Motor vehicle light from light-emitting diodes or chips
US5500009A (en) * 1990-11-15 1996-03-19 Amron, Ltd. Method of treating herpes
JPH03104768U (en) * 1990-02-15 1991-10-30
JP2602380B2 (en) * 1991-10-23 1997-04-23 富士通株式会社 Semiconductor device and manufacturing method thereof
GB2335308B (en) * 1996-11-12 1999-10-27 L F D Limited Lamp
WO1999057945A1 (en) * 1998-05-04 1999-11-11 Fiber Optic Designs, Inc. A lamp employing a monolithic led device
US7066628B2 (en) * 2001-03-29 2006-06-27 Fiber Optic Designs, Inc. Jacketed LED assemblies and light strings containing same
US6874910B2 (en) * 2001-04-12 2005-04-05 Matsushita Electric Works, Ltd. Light source device using LED, and method of producing same
WO2003016782A1 (en) * 2001-08-09 2003-02-27 Matsushita Electric Industrial Co., Ltd. Led illuminator and card type led illuminating light source
US6634770B2 (en) * 2001-08-24 2003-10-21 Densen Cao Light source using semiconductor devices mounted on a heat sink
US6498355B1 (en) * 2001-10-09 2002-12-24 Lumileds Lighting, U.S., Llc High flux LED array
US6791839B2 (en) * 2002-06-25 2004-09-14 Dow Corning Corporation Thermal interface materials and methods for their preparation and use
US20040264195A1 (en) * 2003-06-25 2004-12-30 Chia-Fu Chang Led light source having a heat sink
US7304418B2 (en) * 2003-10-24 2007-12-04 Seiko Epson Corporation Light source apparatus with light-emitting chip which generates light and heat
US7524085B2 (en) * 2003-10-31 2009-04-28 Phoseon Technology, Inc. Series wiring of highly reliable light sources
US7331691B2 (en) * 2004-10-29 2008-02-19 Goldeneye, Inc. Light emitting diode light source with heat transfer means
TWI290777B (en) * 2006-02-27 2007-12-01 Guei-Fang Chen Lighting device with light emitting diode

Also Published As

Publication number Publication date
WO2009063255A1 (en) 2009-05-22
GB2455069A (en) 2009-06-03
GB201004698D0 (en) 2010-05-05
GB2470802A (en) 2010-12-08
GB2470802B (en) 2011-10-05
GB2455069B (en) 2010-05-12

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20131116